Intel® MAX® 10 Devices I/O Resources Per Package

MAX® 10 FPGA Device Overview

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ID 683658

Date 6/14/2022

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Intel® MAX® 10 Devices I/O Resources Per Package

Table 5. Package Plan for Intel® MAX® 10 Single Power Supply Devices
Device	Package
	Type	V81 81-pin WLCSP	Y180 180-pin WLCSP	M153 153-pin MBGA	U169 169-pin UBGA	U324 324-pin UBGA	E144 144-pin EQFP
	Size	4 mm × 4 mm	6 mm × 5 mm	8 mm × 8 mm	11 mm × 11 mm	15 mm × 15 mm	22 mm × 22 mm
	Ball Pitch	0.4 mm	0.35 mm	0.5 mm	0.8 mm	0.8 mm	0.5 mm
10M02		—	—	112	130	246	101
10M04		—	—	112	130	246	101
10M08		58	—	112	130	246	101
10M16		—	125	—	130	246	101
10M25		—	—	—	—	—	101
10M40		—	—	—	—	—	101
10M50		—	—	—	—	—	101

Table 6. Package Plan for Intel® MAX® 10 Dual Power Supply Devices
Device	Package
	Type	V36 36-pin WLCSP	V81 81-pin WLCSP	U324 324-pin UBGA	F256 256-pin FBGA	F484 484-pin FBGA	F672 672-pin FBGA
	Size	3 mm × 3 mm	4 mm × 4 mm	15 mm × 15 mm	17 mm × 17 mm	23 mm × 23 mm	27 mm × 27 mm
	Ball Pitch	0.4 mm	0.4 mm	0.8 mm	1.0 mm	1.0 mm	1.0 mm
10M02		27	—	160	—	—	—
10M04		—	—	246	178	—	—
10M08		—	56	246	178	250	—
10M16		—	—	246	178	320	—
10M25		—	—	—	178	360	—
10M40		—	—	—	178	360	500
10M50		—	—	—	178	360	500