Intel® MAX™ 10 Embedded Memory User Guide

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ID 683431
Date 5/05/2023
Public
Document Table of Contents
Document Table of Contents x
1. Intel® MAX® 10 Embedded Memory Overview 2. Intel® MAX® 10 Embedded Memory Architecture and Features 3. Intel® MAX® 10 Embedded Memory Design Consideration 4. RAM: 1-Port IP Core References 5. RAM: 2-PORT IP Core References 6. ROM: 1-PORT IP Core References 7. ROM: 2-PORT IP Core References 8. FIFO IP Core References 9. Shift Register (RAM-based) IP Core References 10. ALTMEMMULT IP Core References 11. Document Revision History for the Intel® MAX® 10 Embedded Memory User Guide
2. Intel® MAX® 10 Embedded Memory Architecture and Features x
2.1. Intel® MAX® 10 Embedded Memory General Features 2.2. Intel® MAX® 10 Embedded Memory Operation Modes 2.3. Intel® MAX® 10 Embedded Memory Clock Modes 2.4. Intel® MAX® 10 Embedded Memory Configurations
2.1. Intel® MAX® 10 Embedded Memory General Features x
2.1.1. Control Signals 2.1.2. Parity Bit 2.1.3. Read Enable 2.1.4. Read-During-Write 2.1.5. Byte Enable 2.1.6. Packed Mode Support 2.1.7. Address Clock Enable Support 2.1.8. Asynchronous Clear
2.1.5. Byte Enable x
2.1.5.1. Byte Enable Controls 2.1.5.2. Data Byte Output 2.1.5.3. RAM Blocks Operations
2.1.7. Address Clock Enable Support x
2.1.7.1. Address Clock Enable During Read Cycle Waveform 2.1.7.2. Address Clock Enable During Write Cycle Waveform
2.1.8. Asynchronous Clear x
2.1.8.1. Resetting Registers in M9K Blocks
2.2. Intel® MAX® 10 Embedded Memory Operation Modes x
2.2.1. Supported Memory Operation Modes
2.3. Intel® MAX® 10 Embedded Memory Clock Modes x
2.3.1. Asynchronous Clear in Clock Modes 2.3.2. Output Read Data in Simultaneous Read and Write 2.3.3. Independent Clock Enables in Clock Modes
2.4. Intel® MAX® 10 Embedded Memory Configurations x
2.4.1. Port Width Configurations 2.4.2. Memory Configurations for Single-Port Modes 2.4.3. Memory Configurations for Dual-Port Modes 2.4.4. Maximum Block Depth Configuration
3. Intel® MAX® 10 Embedded Memory Design Consideration x
3.1. Implement External Conflict Resolution 3.2. Customize Read-During-Write Behavior 3.3. Consider Power-Up State and Memory Initialization 3.4. Control Clocking to Reduce Power Consumption 3.5. Selecting Read-During-Write Output Choices
3.2. Customize Read-During-Write Behavior x
3.2.1. Same-Port Read-During-Write Mode 3.2.2. Mixed-Port Read-During-Write Mode
3.2.2. Mixed-Port Read-During-Write Mode x
3.2.2.1. Mixed-Port Read-During-Write Operation with Dual Clocks
4. RAM: 1-Port IP Core References x
4.1. RAM: 1-Port IP Core Signals For Intel® MAX® 10 Devices 4.2. RAM: 1-Port IP Core Parameters For Intel® MAX® 10 Devices
5. RAM: 2-PORT IP Core References x
5.1. RAM: 2-Ports IP Core Signals (Simple Dual-Port RAM) For Intel® MAX® 10 Devices 5.2. RAM: 2-Port IP Core Signals (True Dual-Port RAM) for Intel® MAX® 10 Devices 5.3. RAM: 2-Port IP Core Parameters for Intel® MAX® 10 Devices
6. ROM: 1-PORT IP Core References x
6.1. ROM: 1-PORT IP Core Signals For Intel® MAX® 10 Devices 6.2. ROM: 1-PORT IP Core Parameters for Intel® MAX® 10 Devices
7. ROM: 2-PORT IP Core References x
7.1. ROM: 2-PORT IP Core Signals for Intel® MAX® 10 Devices 7.2. ROM: 2-Port IP Core Parameters For Intel® MAX® 10 Devices
8. FIFO IP Core References x
8.1. FIFO IP Core Signals for Intel® MAX® 10 Devices 8.2. FIFO IP Core Parameters for Intel® MAX® 10 Devices 8.3. FIFO Functional Timing Requirements 8.4. SCFIFO ALMOST_EMPTY Functional Timing
9. Shift Register (RAM-based) IP Core References x
9.1. Shift Register (RAM-based) IP Core Signals for Intel® MAX® 10 Devices 9.2. Shift Register (RAM-based) IP Core Parameters for Intel® MAX® 10 Devices
10. ALTMEMMULT IP Core References x
10.1. ALTMEMMULT IP Core Signals for Intel® MAX® 10 Devices 10.2. ALTMEMMULT IP Core Parameters for Intel® MAX® 10 Devices
1. Intel® MAX® 10 Embedded Memory Overview
2. Intel® MAX® 10 Embedded Memory Architecture and Features
3. Intel® MAX® 10 Embedded Memory Design Consideration
4. RAM: 1-Port IP Core References
5. RAM: 2-PORT IP Core References
6. ROM: 1-PORT IP Core References
7. ROM: 2-PORT IP Core References
8. FIFO IP Core References
9. Shift Register (RAM-based) IP Core References
10. ALTMEMMULT IP Core References
11. Document Revision History for the Intel® MAX® 10 Embedded Memory User Guide

2.4.4. Maximum Block Depth Configuration

The Set the maximum block depth parameter allows you to set the maximum block depth of the dedicated memory block you use. You can slice the memory block to your desired maximum block depth. For example, the capacity of an M9K block is 9,216 bits, and the default memory depth is 8K, in which each address is capable of storing 1 bit (8K × 1). If you set the maximum block depth to 512, the M9K block is sliced to a depth of 512 and each address is capable of storing up to 18 bits (512 × 18).

Use this parameter to save power usage in your devices and to reduce the total number of memory blocks used. However, this parameter might increase the number of LEs and affects the design performance.

When the RAM is sliced shallower, the dynamic power usage decreases. However, for a RAM block with a depth of 256, the power used by the extra LEs starts to outweigh the power gain achieved by shallower slices.

The maximum block depth must be in a power of two, and the valid values vary among different dedicated memory blocks.

This table lists the valid range of maximum block depth for M9K memory blocks.

Table 8.  Valid Range of Maximum Block Depth for M9K Memory Blocks
Memory Block Valid Range
M9K 256 - 8K. The maximum block depth must be in a power of two.

The IP parameter editor prompts an error message if you enter an invalid value for the maximum block depth. Intel recommends that you set the value of the Set the maximum block depth parameter to Auto if you are unsure of the appropriate maximum block depth to set or the setting is not important for your design. The Auto setting enables the Compiler to select the maximum block depth with the appropriate port width configuration for the type of internal memory block of your memory.

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