Intel® Quartus® Prime Pro Edition User Guide: Design Constraints

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ID 683143
Date 9/26/2022
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Document Table of Contents
Document Table of Contents x
1. Answers to Top FAQs 2. Constraining Designs 3. Interface Planning 4. Managing Device I/O Pins 5. Intel® Quartus® Prime Pro Edition User Guide: Design Constraints Document Archives A. Intel® Quartus® Prime Pro Edition User Guides
2. Constraining Designs x
2.1. Specifying Design Constraints Designs in the GUI 2.2. Constraining Designs with Tcl Scripts 2.3. A Fully Iterative Scripted Flow 2.4. Constraining Designs Revision History
2.1. Specifying Design Constraints Designs in the GUI x
2.1.1. Global Constraints and Assignments 2.1.2. Node, Entity, and Instance-Level Constraints 2.1.3. Probing Between Components of the Intel® Quartus® Prime GUI 2.1.4. Specifying Timing Constraints in the GUI
2.1.2. Node, Entity, and Instance-Level Constraints x
2.1.2.1. Specify Instance-Specific Constraints in Assignment Editor 2.1.2.2. Specifying Multi-Dimensional Bus Constraints 2.1.2.3. Specify I/O Constraints in Pin Planner 2.1.2.4. Plan Interface Constraints in Interface Planner and Tile Interface Planner 2.1.2.5. Adjust Constraints with the Chip Planner 2.1.2.6. Constraining Designs with the Design Partition Planner
2.2. Constraining Designs with Tcl Scripts x
2.2.1. Create a Project and Apply Constraints 2.2.2. Assigning a Pin 2.2.3. Generating Intel® Quartus® Prime Settings Files 2.2.4. Synopsys* Design Constraint (.sdc) Files 2.2.5. Tcl-only Script Flows
3. Interface Planning x
3.1. Using Interface Planner 3.2. Using Tile Interface Planner 3.3. Interface Planning Revision History
3.1. Using Interface Planner x
3.1.1. Interface Planner User Interface 3.1.2. Interface Planner Tool Flow 3.1.3. Interface Planner Reports
3.1.1. Interface Planner User Interface x
3.1.1.1. Flow Controls 3.1.1.2. Home Tab Controls 3.1.1.3. Assignments Tab Controls 3.1.1.4. Plan Tab Controls 3.1.1.5. Reports Tab Controls
3.1.2. Interface Planner Tool Flow x
3.1.2.1. Step 1: Setup and Synthesize the Project 3.1.2.2. Step 2: Initialize Interface Planner 3.1.2.3. Step 3: Update Plan with Project Assignments 3.1.2.4. Step 4: Plan Periphery Placement 3.1.2.5. Step 5: Report Placement Data 3.1.2.6. Step 6: Validate and Export Plan Constraints
3.1.2.4. Step 4: Plan Periphery Placement x
3.1.2.4.1. Plan Clock Networks 3.1.2.4.2. Saving & Loading Floorplans
3.1.3. Interface Planner Reports x
3.1.3.1. Report Summary 3.1.3.2. Report Pins 3.1.3.3. Report HSSI Channels 3.1.3.4. Report Clocks 3.1.3.5. Report Periphery Locations 3.1.3.6. Report Cell Connectivity 3.1.3.7. Report Instance Assignments
3.2. Using Tile Interface Planner x
3.2.1. Tile Interface Planner Terminology 3.2.2. Tile Interface Planner Tool Flow 3.2.3. Constraining Dynamic Reconfiguration IP 3.2.4. Tile Interface Planner GUI Reference
3.2.2. Tile Interface Planner Tool Flow x
3.2.2.1. Step 1: Instantiate IP and Run Design Analysis 3.2.2.2. Step 2: Initialize Tile Interface Planner 3.2.2.3. Step 3: Update Plan with Project Assignments 3.2.2.4. Step 4: Create a Tile Plan 3.2.2.5. Step 5: Save Tile Plan Assignments 3.2.2.6. Step 6: Run Logic Generation and Design Synthesis
3.2.2.4. Step 4: Create a Tile Plan x
3.2.2.4.1. Placing IP Components 3.2.2.4.2. Constraining IP Building Blocks
3.2.3. Constraining Dynamic Reconfiguration IP x
3.2.3.1. Defining a Dynamic Reconfiguration Group 3.2.3.2. Assigning Dynamic Reconfiguration Group Placement
3.2.4. Tile Interface Planner GUI Reference x
3.2.4.1. Flow Controls 3.2.4.2. Home Tab 3.2.4.3. Assignments Tab Controls 3.2.4.4. Plan Tab Controls 3.2.4.5. Tcl Console Window
3.2.4.4. Plan Tab Controls x
3.2.4.4.1. Design Tree and Filters 3.2.4.4.2. Reconfiguration Groups View 3.2.4.4.3. Legal Locations Pane
4. Managing Device I/O Pins x
4.1. I/O Planning Overview 4.2. Assigning I/O Pins 4.3. Importing and Exporting I/O Pin Assignments 4.4. Validating Pin Assignments 4.5. Verifying I/O Timing 4.6. Viewing Routing and Timing Delays 4.7. Scripting API 4.8. Managing Device I/O Pins Revision History
4.1. I/O Planning Overview x
4.1.1. Basic I/O Planning Flow 4.1.2. Integrating PCB Design Tools 4.1.3. Intel Device Terms
4.2. Assigning I/O Pins x
4.2.1. Assigning to Exclusive Pin Groups 4.2.2. Assigning Slew Rate and Drive Strength 4.2.3. Assigning Differential Pins 4.2.4. Entering Pin Assignments with Tcl Commands 4.2.5. Entering Pin Assignments in HDL Code
4.2.3. Assigning Differential Pins x
4.2.3.1. Overriding I/O Placement Rules on Differential Pins
4.2.5. Entering Pin Assignments in HDL Code x
4.2.5.1. Using Low-Level I/O Primitives
4.3. Importing and Exporting I/O Pin Assignments x
4.3.1. Importing and Exporting for PCB Tools 4.3.2. Migrating Assignments to Another Target Device
4.4. Validating Pin Assignments x
4.4.1. I/O Assignment Validation Rules 4.4.2. I/O Assignment Analysis 4.4.3. Understanding I/O Analysis Reports
4.4.2. I/O Assignment Analysis x
4.4.2.1. Early I/O Assignment Analysis Without Design Files 4.4.2.2. I/O Assignment Analysis With Design Files 4.4.2.3. Overriding Default I/O Pin Analysis
4.5. Verifying I/O Timing x
4.5.1. Running Advanced I/O Timing 4.5.2. Adjusting I/O Timing and Power with Capacitive Loading
4.5.1. Running Advanced I/O Timing x
4.5.1.1. Board Trace Models 4.5.1.2. Defining the Board Trace Model 4.5.1.3. Modifying the Board Trace Model 4.5.1.4. Specifying Near-End vs Far-End I/O Timing Analysis 4.5.1.5. Advanced I/O Timing Analysis Reports
4.7. Scripting API x
4.7.1. Generate Mapped Netlist 4.7.2. Reserve Pins 4.7.3. Set Location 4.7.4. Exclusive I/O Group 4.7.5. Slew Rate and Current Strength
1. Answers to Top FAQs
2. Constraining Designs
3. Interface Planning
4. Managing Device I/O Pins
5. Intel® Quartus® Prime Pro Edition User Guide: Design Constraints Document Archives
A. Intel® Quartus® Prime Pro Edition User Guides

4.5.1.5. Advanced I/O Timing Analysis Reports

The following reports show advanced I/O timing analysis information:

Table 31.  Advanced I/O Timing Reports
I/O Timing Report Description
Timing Analyzer Report Reports signal integrity and board delay data.
Board Trace Model Assignments report Summarizes the board trace model component settings for each output and bidirectional signal.
Signal Integrity Metrics report Contains all the signal integrity metrics calculated during advanced I/O timing analysis based on the board trace model settings for each output or bidirectional pin. Includes measurements at both the FPGA pin and at the far-end load of board delay, steady state voltages, and rise and fall times.
Note: By default, the Timing Analyzer generates the Slow‑Corner Signal Integrity Metrics report. To generate a Fast-Corner Signal Integrity Metrics report you must change the delay model by clicking Tools > Timing Analyzer.
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