AN 802: Intel® Stratix® 10 SoC Device Design Guidelines

Download PDF
ID 683117
Date 12/14/2020
Public

A newer version of this document is available. Customers should click here to go to the newest version.

Document Table of Contents
Document Table of Contents x
1. Introduction to the Intel® Stratix® 10 SoC Device Design Guidelines 2. Board Design Guidelines for Stratix 10 SoC FPGAs 3. Interfacing to the FPGA for Stratix 10 SoC FPGAs 4. System Considerations for Stratix 10 SoC FPGAs 5. Embedded Software Design Guidelines for Intel® Stratix® 10 SoC FPGAs 6. Recommended Resources for Stratix 10 SoC FPGAs
1. Introduction to the Intel® Stratix® 10 SoC Device Design Guidelines x
1.1. Introduction to the Stratix 10 SoC Device Design Guidelines Revision History
2. Board Design Guidelines for Stratix 10 SoC FPGAs x
2.1. Pin Connection Considerations for Board Design 2.2. HPS Clocking and Reset Design Considerations 2.3. Design Considerations for Connecting Device I/O to HPS Peripherals and Memory 2.4. Design Guidelines for HPS Interfaces 2.5. HPS EMIF Design Considerations 2.6. HPS Memory Debug 2.7. Boundary Scan for HPS 2.8. Embedded Software Debugging and Trace 2.9. Board Design Guidelines for Intel® Stratix® 10 SoC FPGAs Revision History
2.1. Pin Connection Considerations for Board Design x
2.1.1. Board-Related Intel® Quartus® Prime Settings
2.1.1. Board-Related Intel® Quartus® Prime Settings x
2.1.1.1. Unused Pins
2.2. HPS Clocking and Reset Design Considerations x
2.2.1. HPS Clock Planning 2.2.2. Early Pin Planning and I/O Assignment Analysis 2.2.3. Pin Features and Connections for HPS Clocks, Reset and PoR 2.2.4. Direct to Factory Pin Support for Remote System Update (RSU) Feature 2.2.5. Internal Clocks 2.2.6. HPS Peripheral Reset Management
2.3. Design Considerations for Connecting Device I/O to HPS Peripherals and Memory x
2.3.1. HPS Pin Multiplexing Design Considerations 2.3.2. HPS I/O Settings: Constraints and Drive Strengths
2.4. Design Guidelines for HPS Interfaces x
2.4.1. HPS EMAC PHY Interfaces 2.4.2. USB Interface Design Guidelines 2.4.3. SD/MMC and eMMC Card Interface Design Guidelines 2.4.4. Design Guidelines for Flash Interfaces 2.4.5. UART Interface Design Guidelines 2.4.6. I2C Interface Design Guidelines
2.4.1. HPS EMAC PHY Interfaces x
2.4.1.1. PHY Interfaces 2.4.1.2. PHY Interfaces Connected Through FPGA I/O 2.4.1.3. MDIO 2.4.1.4. Common PHY Interface Design Considerations
2.4.1.1. PHY Interfaces x
2.4.1.1.1. RMII 2.4.1.1.2. RGMII
2.4.1.2. PHY Interfaces Connected Through FPGA I/O x
2.4.1.2.1. GMII/MII 2.4.1.2.2. Adapting to RGMII 2.4.1.2.3. Adapting to RMII 2.4.1.2.4. Adapting to SGMII
2.4.1.4. Common PHY Interface Design Considerations x
2.4.1.4.1. Signal Integrity GUIDELINE: Make use of the SoC device’s On-Chip Termination (OCT). GUIDELINE: Use appropriate board-level termination on PHY outputs. GUIDELINE: Ensure reflections at PHY TX_CLK and EMAC RX_CLK inputs are minimized to prevent double-clocking. GUIDELINE: Use a Signal Integrity (SI) simulation tool.
2.4.4. Design Guidelines for Flash Interfaces x
2.4.4.1. NAND Flash Interface Design Guidelines
2.5. HPS EMIF Design Considerations x
2.5.1. Considerations for Connecting HPS to SDRAM 2.5.2. HPS SDRAM I/O Locations
3. Interfacing to the FPGA for Stratix 10 SoC FPGAs x
3.1. Overview of HPS Memory-Mapped Interfaces 3.2. Recommended System Topologies 3.3. Recommended Starting Point for HPS-to-FPGA Interface Designs 3.4. Timing Closure for FPGA Accelerators 3.5. Information on How to Configure and Use the Bridges 3.6. Interfacing to the FPGA for Intel® Stratix® 10 SoC FPGAs Revision History
3.1. Overview of HPS Memory-Mapped Interfaces x
3.1.1. HPS-to-FPGA Bridge 3.1.2. Lightweight HPS-to-FPGA Bridge 3.1.3. FPGA-to-HPS Bridge 3.1.4. FPGA-to-SDRAM Ports 3.1.5. Interface Bandwidths
3.2. Recommended System Topologies x
3.2.1. HPS Accesses to FPGA Fabric 3.2.2. MPU Sharing Data with FPGA 3.2.3. Examples of Cacheable and Non-Cacheable Data Accesses From the FPGA
3.2.3. Examples of Cacheable and Non-Cacheable Data Accesses From the FPGA x
3.2.3.1. Example 1: FPGA Reading Data from HPS SDRAM Directly 3.2.3.2. Example 2: FPGA Writing Data into HPS SDRAM Directly 3.2.3.3. Example 3: FPGA Reading Cache Coherent Data from HPS 3.2.3.4. Example 4: FPGA Writing Cache Coherent Data to HPS
4. System Considerations for Stratix 10 SoC FPGAs x
4.1. Timing Considerations 4.2. Maximizing Performance 4.3. System Level Cache Coherency 4.4. System Considerations for Stratix 10 SoC FPGAs Revision History
4.1. Timing Considerations x
4.1.1. Timing Closure for FPGA Accelerators 4.1.2. USB Interface Design Guidelines
4.1.1. Timing Closure for FPGA Accelerators x
4.1.1.1. HPS First and FPGA First Boot Considerations
5. Embedded Software Design Guidelines for Intel® Stratix® 10 SoC FPGAs x
5.1. Overview 5.2. Assembling the Components of Your Software Development Platform 5.3. Golden Hardware Reference Design (GHRD) 5.4. Selecting an Operating System for Your Application 5.5. Assembling Your Software Development Platform for Linux* 5.6. Assembling your Software Development Platform for a Bare-Metal Application 5.7. Assembling your Software Development Platform for Partner OS or RTOS 5.8. Choosing the Bootloader Software 5.9. Selecting Software Tools for Development, Debug and Trace 5.10. Boot And Configuration Considerations 5.11. System Reset Considerations 5.12. Flash Considerations 5.13. Embedded Software Debugging and Trace 5.14. Embedded Software Design Guidelines for Intel® Stratix® 10 SoC FPGAs Revision History
5.4. Selecting an Operating System for Your Application x
5.4.1. Using Linux* or RTOS 5.4.2. Developing a Bare-Metal Application 5.4.3. Using the Bootloader as a Bare-Metal Framework 5.4.4. Using Symmetrical vs. Asymmetrical Multiprocessing (SMP vs. AMP) Modes
5.5. Assembling Your Software Development Platform for Linux* x
5.5.1. Golden System Reference Design (GSRD) for Linux* 5.5.2. Source Code Management Considerations
5.9. Selecting Software Tools for Development, Debug and Trace x
5.9.1. Selecting Software Build Tools 5.9.2. Selecting Software Debug Tools 5.9.3. Selecting Software Trace Tools
5.10. Boot And Configuration Considerations x
5.10.1. Configuration Sources 5.10.2. Configuration Flash 5.10.3. Configuration Clock 5.10.4. Selecting HPS Boot Options 5.10.5. HPS Boot Sources 5.10.6. Remote System Update (RSU)
5.12. Flash Considerations x
5.12.1. Flash Programming Method 5.12.2. Using a Single flash for Both FPGA Configuration and HPS Mass Storage
6. Recommended Resources for Stratix 10 SoC FPGAs x
6.1. Device Documentation 6.2. Tools and Software Web Pages 6.3. Recommended Resources for Intel® Stratix® 10 SoC FPGAs Revision History
1. Introduction to the Intel® Stratix® 10 SoC Device Design Guidelines
2. Board Design Guidelines for Stratix 10 SoC FPGAs
3. Interfacing to the FPGA for Stratix 10 SoC FPGAs
4. System Considerations for Stratix 10 SoC FPGAs
5. Embedded Software Design Guidelines for Intel® Stratix® 10 SoC FPGAs
6. Recommended Resources for Stratix 10 SoC FPGAs

2.4.1.4.1. Signal Integrity

GUIDELINE: Make use of the SoC device’s On-Chip Termination (OCT).

Intel® Stratix® 10 devices can tune their outputs to many settings, with 50 ohm output impedance often being the best value. Intel® Quartus® Prime automatically uses series OCT without calibration on RGMII outputs. Check the Intel® Quartus® Prime fitter report to verify the OCT settings on the interface’s outputs.

GUIDELINE: Use appropriate board-level termination on PHY outputs.

Only a few PHYs offer I/O tuning for their outputs, so Intel® recommends that you verify the signal path to the Intel® Stratix® 10 device with a simulator. Place a series resistor on each signal near the PHY output pins to reduce the reflections if necessary.

GUIDELINE: Ensure reflections at PHY TX_CLK and EMAC RX_CLK inputs are minimized to prevent double-clocking.

Be cognizant if the connection is routed as a “T” as signal integrity must be maintained such that no double-edges are seen at REF_CLK loads. Ensure reflections at REF_CLK loads are minimized to prevent double-clocking.

GUIDELINE: Use a Signal Integrity (SI) simulation tool.

It is simple to run SI simulations on these unidirectional signals. These signals are almost always point-to-point, so simply determining an appropriate series resistor to place on each signal is usually sufficient. Many times, this resistor is not necessary, but the device drive strength and trace lengths as well as topology should be studied when making this determination.

Level Two Title