AN 802: Intel® Stratix® 10 SoC Device Design Guidelines

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ID 683117
Date 12/14/2020
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Document Table of Contents
Document Table of Contents x
1. Introduction to the Intel® Stratix® 10 SoC Device Design Guidelines 2. Board Design Guidelines for Stratix 10 SoC FPGAs 3. Interfacing to the FPGA for Stratix 10 SoC FPGAs 4. System Considerations for Stratix 10 SoC FPGAs 5. Embedded Software Design Guidelines for Intel® Stratix® 10 SoC FPGAs 6. Recommended Resources for Stratix 10 SoC FPGAs
1. Introduction to the Intel® Stratix® 10 SoC Device Design Guidelines x
1.1. Introduction to the Stratix 10 SoC Device Design Guidelines Revision History
2. Board Design Guidelines for Stratix 10 SoC FPGAs x
2.1. Pin Connection Considerations for Board Design 2.2. HPS Clocking and Reset Design Considerations 2.3. Design Considerations for Connecting Device I/O to HPS Peripherals and Memory 2.4. Design Guidelines for HPS Interfaces 2.5. HPS EMIF Design Considerations 2.6. HPS Memory Debug 2.7. Boundary Scan for HPS 2.8. Embedded Software Debugging and Trace 2.9. Board Design Guidelines for Intel® Stratix® 10 SoC FPGAs Revision History
2.1. Pin Connection Considerations for Board Design x
2.1.1. Board-Related Intel® Quartus® Prime Settings
2.1.1. Board-Related Intel® Quartus® Prime Settings x
2.1.1.1. Unused Pins
2.2. HPS Clocking and Reset Design Considerations x
2.2.1. HPS Clock Planning 2.2.2. Early Pin Planning and I/O Assignment Analysis 2.2.3. Pin Features and Connections for HPS Clocks, Reset and PoR 2.2.4. Direct to Factory Pin Support for Remote System Update (RSU) Feature 2.2.5. Internal Clocks 2.2.6. HPS Peripheral Reset Management
2.3. Design Considerations for Connecting Device I/O to HPS Peripherals and Memory x
2.3.1. HPS Pin Multiplexing Design Considerations 2.3.2. HPS I/O Settings: Constraints and Drive Strengths
2.4. Design Guidelines for HPS Interfaces x
2.4.1. HPS EMAC PHY Interfaces 2.4.2. USB Interface Design Guidelines 2.4.3. SD/MMC and eMMC Card Interface Design Guidelines 2.4.4. Design Guidelines for Flash Interfaces 2.4.5. UART Interface Design Guidelines 2.4.6. I2C Interface Design Guidelines
2.4.1. HPS EMAC PHY Interfaces x
2.4.1.1. PHY Interfaces 2.4.1.2. PHY Interfaces Connected Through FPGA I/O 2.4.1.3. MDIO 2.4.1.4. Common PHY Interface Design Considerations
2.4.1.1. PHY Interfaces x
2.4.1.1.1. RMII 2.4.1.1.2. RGMII
2.4.1.2. PHY Interfaces Connected Through FPGA I/O x
2.4.1.2.1. GMII/MII GUIDELINE: Apply timing constraints and verify timing with Timing Analyzer. GUIDELINE: Register interface I/O at the FPGA I/O boundary. GUIDELINE: Consider transmit timing in MII mode. 2.4.1.2.2. Adapting to RGMII 2.4.1.2.3. Adapting to RMII 2.4.1.2.4. Adapting to SGMII
2.4.1.4. Common PHY Interface Design Considerations x
2.4.1.4.1. Signal Integrity
2.4.4. Design Guidelines for Flash Interfaces x
2.4.4.1. NAND Flash Interface Design Guidelines
2.5. HPS EMIF Design Considerations x
2.5.1. Considerations for Connecting HPS to SDRAM 2.5.2. HPS SDRAM I/O Locations
3. Interfacing to the FPGA for Stratix 10 SoC FPGAs x
3.1. Overview of HPS Memory-Mapped Interfaces 3.2. Recommended System Topologies 3.3. Recommended Starting Point for HPS-to-FPGA Interface Designs 3.4. Timing Closure for FPGA Accelerators 3.5. Information on How to Configure and Use the Bridges 3.6. Interfacing to the FPGA for Intel® Stratix® 10 SoC FPGAs Revision History
3.1. Overview of HPS Memory-Mapped Interfaces x
3.1.1. HPS-to-FPGA Bridge 3.1.2. Lightweight HPS-to-FPGA Bridge 3.1.3. FPGA-to-HPS Bridge 3.1.4. FPGA-to-SDRAM Ports 3.1.5. Interface Bandwidths
3.2. Recommended System Topologies x
3.2.1. HPS Accesses to FPGA Fabric 3.2.2. MPU Sharing Data with FPGA 3.2.3. Examples of Cacheable and Non-Cacheable Data Accesses From the FPGA
3.2.3. Examples of Cacheable and Non-Cacheable Data Accesses From the FPGA x
3.2.3.1. Example 1: FPGA Reading Data from HPS SDRAM Directly 3.2.3.2. Example 2: FPGA Writing Data into HPS SDRAM Directly 3.2.3.3. Example 3: FPGA Reading Cache Coherent Data from HPS 3.2.3.4. Example 4: FPGA Writing Cache Coherent Data to HPS
4. System Considerations for Stratix 10 SoC FPGAs x
4.1. Timing Considerations 4.2. Maximizing Performance 4.3. System Level Cache Coherency 4.4. System Considerations for Stratix 10 SoC FPGAs Revision History
4.1. Timing Considerations x
4.1.1. Timing Closure for FPGA Accelerators 4.1.2. USB Interface Design Guidelines
4.1.1. Timing Closure for FPGA Accelerators x
4.1.1.1. HPS First and FPGA First Boot Considerations
5. Embedded Software Design Guidelines for Intel® Stratix® 10 SoC FPGAs x
5.1. Overview 5.2. Assembling the Components of Your Software Development Platform 5.3. Golden Hardware Reference Design (GHRD) 5.4. Selecting an Operating System for Your Application 5.5. Assembling Your Software Development Platform for Linux* 5.6. Assembling your Software Development Platform for a Bare-Metal Application 5.7. Assembling your Software Development Platform for Partner OS or RTOS 5.8. Choosing the Bootloader Software 5.9. Selecting Software Tools for Development, Debug and Trace 5.10. Boot And Configuration Considerations 5.11. System Reset Considerations 5.12. Flash Considerations 5.13. Embedded Software Debugging and Trace 5.14. Embedded Software Design Guidelines for Intel® Stratix® 10 SoC FPGAs Revision History
5.4. Selecting an Operating System for Your Application x
5.4.1. Using Linux* or RTOS 5.4.2. Developing a Bare-Metal Application 5.4.3. Using the Bootloader as a Bare-Metal Framework 5.4.4. Using Symmetrical vs. Asymmetrical Multiprocessing (SMP vs. AMP) Modes
5.5. Assembling Your Software Development Platform for Linux* x
5.5.1. Golden System Reference Design (GSRD) for Linux* 5.5.2. Source Code Management Considerations
5.9. Selecting Software Tools for Development, Debug and Trace x
5.9.1. Selecting Software Build Tools 5.9.2. Selecting Software Debug Tools 5.9.3. Selecting Software Trace Tools
5.10. Boot And Configuration Considerations x
5.10.1. Configuration Sources 5.10.2. Configuration Flash 5.10.3. Configuration Clock 5.10.4. Selecting HPS Boot Options 5.10.5. HPS Boot Sources 5.10.6. Remote System Update (RSU)
5.12. Flash Considerations x
5.12.1. Flash Programming Method 5.12.2. Using a Single flash for Both FPGA Configuration and HPS Mass Storage
6. Recommended Resources for Stratix 10 SoC FPGAs x
6.1. Device Documentation 6.2. Tools and Software Web Pages 6.3. Recommended Resources for Intel® Stratix® 10 SoC FPGAs Revision History
1. Introduction to the Intel® Stratix® 10 SoC Device Design Guidelines
2. Board Design Guidelines for Stratix 10 SoC FPGAs
3. Interfacing to the FPGA for Stratix 10 SoC FPGAs
4. System Considerations for Stratix 10 SoC FPGAs
5. Embedded Software Design Guidelines for Intel® Stratix® 10 SoC FPGAs
6. Recommended Resources for Stratix 10 SoC FPGAs

2.4.1.2.1. GMII/MII

GMII and MII are only available in Intel® Stratix® 10 by driving the EMAC signals into the FPGA core routing logic, then ultimately to FPGA I/O pins or to internal registers in the FPGA core.

GUIDELINE: Apply timing constraints and verify timing with Timing Analyzer.

Because routing delays can vary widely in the FPGA core and I/O structures, it is important to read the timing reports, and especially for GMII, create timing constraints. GMII has a 125 MHz clock and is single data rate unlike RGMII. GMII does not have the same considerations for CLK-to-DATA skew though; its signals are automatically centered by design by being launched with the negative edge and captured with the rising edge.

GUIDELINE: Register interface I/O at the FPGA I/O boundary.

With core and I/O delays easily exceeding 8 ns, Intel® recommends to register these buses in each direction in I/O Element (IOE) registers, so they remain aligned as they travel across the core FPGA logic fabric. On the transmit data and control, maintain the clock-to-data/control relationship by latching these signals on the falling edge of the emac[0,1,2]_gtx_clk output from the HPS EMAC. Latch the receive data and control at the FPGA I/O inputs on the rising edge of the RX_CLK sourced by the PHY.

GUIDELINE: Consider transmit timing in MII mode.

MII is 25 MHz when the PHY is in 100 Mbps mode and 2.5 MHz when the PHY is in 10 Mbps mode, so the shortest clock period is 40 ns. The PHY sources the clock for both transmit and receive directions. Because the transmit timing is relative to the TX_CLK clock provided by the PHY, the turnaround time may be of concern, but this is usually not an issue due to the long 40 ns clock period.

Since the reference clock is transmitted through the FPGA, then out for the data – the round-trip delay must be less than 25 ns as there is a 15 ns input setup time. Note that the transmit data and control are launched into the FPGA fabric by the HPS EMAC transmit path logic on the negative edge of the PHY-sourced TX_CLK, which removes 20 ns of the 40 ns clock-to-setup timing budget.

With the round-trip clock path delay on the data arrival timing incurring PHY-to-SoC board propagation delay plus the internal path delay from the SoC pin to and through the HPS EMAC transmit clock mux taking away from the remaining 20 ns setup timing budget, it may be necessary to retime the transmit data and control to the rising edge of the phy_txclk_o clock output registers in the FPGA fabric for MII mode transmit data and control.

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