Intel® Agilex™ 7 General-Purpose I/O User Guide: F-Series and I-Series

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ID 683780
Date 2/20/2023
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Document Table of Contents
Document Table of Contents x
1. Intel® Agilex™ 7 F-Series and I-Series General-Purpose I/O Overview 2. Intel® Agilex™ 7 F-Series and I-Series GPIO Banks 3. Intel® Agilex™ 7 F-Series and I-Series HPS I/O Banks 4. Intel® Agilex™ 7 F-Series and I-Series SDM I/O Banks 5. Intel® Agilex™ 7 F-Series and I-Series I/O Troubleshooting Guidelines 6. Intel® Agilex™ 7 F-Series and I-Series General-Purpose I/O IPs 7. Programmable I/O Features Description 8. Documentation Related to the Intel® Agilex™ 7 General-Purpose I/O User Guide: F-Series and I-Series 9. Document Revision History for the Intel® Agilex™ 7 General-Purpose I/O User Guide: F-Series and I-Series
1. Intel® Agilex™ 7 F-Series and I-Series General-Purpose I/O Overview x
1.1. Package Selection and I/O Vertical Migration Support 1.2. Types of I/O Banks
2. Intel® Agilex™ 7 F-Series and I-Series GPIO Banks x
2.1. GPIO Bank Overview 2.2. GPIO Features 2.3. GPIO Implementation Guide 2.4. GPIO Termination 2.5. GPIO Design Guidelines 2.6. GPIO Simulation
2.1. GPIO Bank Overview x
2.1.1. GPIO Bank Structure 2.1.2. GPIO Buffers and Registers
2.2. GPIO Features x
2.2.1. Supported I/O Standards for GPIO Banks 2.2.2. GPIO Buffer Behavior 2.2.3. Programmable I/O Element Features for the GPIO Bank
2.2.3. Programmable I/O Element Features for the GPIO Bank x
2.2.3.1. Guidelines: Programmable Output Slew Rate Control 2.2.3.2. Guidelines: Programmable Open-Drain Output 2.2.3.3. Guidelines: Programmable Bus-Hold 2.2.3.4. Guidelines: Programmable Pull-Up Resistor 2.2.3.5. Guidelines: Programmable De-Emphasis
2.3. GPIO Implementation Guide x
2.3.1. I/O Assignments with the Intel® Quartus® Prime Assignment Editor 2.3.2. Assigning Pin I/O Standards in the Intel® Quartus® Prime Pin Planner
2.3.1. I/O Assignments with the Intel® Quartus® Prime Assignment Editor x
2.3.1.1. Assigning Pin I/O Standards in the Intel® Quartus® Prime Assignment Editor 2.3.1.2. Assigning Programmable IOE Features in the Intel® Quartus® Prime Assignment Editor 2.3.1.3. GPIO Programmable IOE Features Assignment Names and Settings
2.4. GPIO Termination x
2.4.1. Single-Ended I/O Termination in F-Series and I-Series Devices 2.4.2. True Differential Signaling I/O Termination
2.4.1. Single-Ended I/O Termination in F-Series and I-Series Devices x
2.4.1.1. Single-Ended I/O Standard OCT Termination 2.4.1.2. OCT Calibration Block 2.4.1.3. Single-Ended I/O Standards External Termination 2.4.1.4. Single-Ended I/O Termination Implementation Guide
2.4.1.1. Single-Ended I/O Standard OCT Termination x
2.4.1.1.1. RS OCT 2.4.1.1.2. RT OCT 2.4.1.1.3. Dynamic OCT
2.4.1.4. Single-Ended I/O Termination Implementation Guide x
2.4.1.4.1. Configuring OCT Using the Assignment Editor 2.4.1.4.2. OCT Features Assignment Names and Settings
2.4.2. True Differential Signaling I/O Termination x
2.4.2.1. True Differential Signaling I/O Standard OCT Termination 2.4.2.2. True Differential Signaling I/O Standard External Termination
2.4.2.1. True Differential Signaling I/O Standard OCT Termination x
2.4.2.1.1. Configuring Differential Input RD OCT Using the Assignment Editor 2.4.2.1.2. Guidelines: Differential Input RD OCT
2.5. GPIO Design Guidelines x
2.5.1. VREF Sources and VREF Pins 2.5.2. I/O Standards Implementation Based on VCCIO_PIO Voltages 2.5.3. OCT Calibration Block Requirement 2.5.4. I/O Pins Placement Requirements 2.5.5. I/O Standard Selection and I/O Bank Supply Compatibility Check 2.5.6. Simultaneous Switching Noise 2.5.7. Special Pins Requirement 2.5.8. External Memory Interface Pin Placement Requirements 2.5.9. HPS Shared I/O Requirements 2.5.10. Clocking Requirements 2.5.11. SDM Shared I/O Requirements 2.5.12. Unused Pins 2.5.13. Voltage Setting for Unused GPIO Banks 2.5.14. GPIO Pins During Power Sequencing 2.5.15. Drive Strength Requirement for GPIO Input Pins 2.5.16. Maximum DC Current Restrictions 2.5.17. 1.2 V I/O Interface Voltage Level Compatibility 2.5.18. GPIO Pins for the Avalon® Streaming Interface Configuration Scheme 2.5.19. Maximum True Differential Signaling Receiver Pairs Per I/O Lane
2.6. GPIO Simulation x
2.6.1. IBIS Models 2.6.2. HSPICE* Models 2.6.3. Net Length Reports
3. Intel® Agilex™ 7 F-Series and I-Series HPS I/O Banks x
3.1. HPS I/O Bank Overview 3.2. HPS I/O Features 3.3. HPS I/O Implementation Guide 3.4. HPS I/O Design Guidelines 3.5. HPS I/O Simulation
3.2. HPS I/O Features x
3.2.1. Supported I/O Standards for HPS I/O Banks 3.2.2. HPS I/O Buffer Behavior 3.2.3. Programmable I/O Element Features for the HPS I/O Bank
3.3. HPS I/O Implementation Guide x
3.3.1. Configuring Open Drain Feature for the HPS I/O 3.3.2. I/O Assignments with the Intel® Quartus® Prime Assignment Editor 3.3.3. Assigning Pin I/O Standards in the Intel® Quartus® Prime Pin Planner
3.3.2. I/O Assignments with the Intel® Quartus® Prime Assignment Editor x
3.3.2.1. Assigning Programmable IOE Features in the Intel® Quartus® Prime Assignment Editor 3.3.2.2. HPS I/O Programmable IOE Features Assignment Names and Settings
3.4. HPS I/O Design Guidelines x
3.4.1. Unused Pins 3.4.2. HPS I/O Pins During Power Sequencing 3.4.3. HPS Shared I/O Requirements
3.5. HPS I/O Simulation x
3.5.1. HPS IBIS Models 3.5.2. Net Length Reports
4. Intel® Agilex™ 7 F-Series and I-Series SDM I/O Banks x
4.1. SDM I/O Bank Overview 4.2. SDM I/O Features 4.3. SDM I/O Design Guidelines 4.4. SDM I/O Simulation
4.2. SDM I/O Features x
4.2.1. Supported I/O Standards for SDM I/O Banks 4.2.2. SDM I/O Buffer Behavior 4.2.3. I/O Standards and Features for Configuration Pins
4.3. SDM I/O Design Guidelines x
4.3.1. Unused Pins 4.3.2. SDM I/O Pins During Power Sequencing
4.4. SDM I/O Simulation x
4.4.1. SDM IBIS Models 4.4.2. Net Length Reports
6. Intel® Agilex™ 7 F-Series and I-Series General-Purpose I/O IPs x
6.1. GPIO Intel® FPGA IP 6.2. OCT Intel® FPGA IP
6.1. GPIO Intel® FPGA IP x
6.1.1. Release Information for GPIO Intel® FPGA IP 6.1.2. Generating the GPIO Intel® FPGA IP 6.1.3. GPIO Intel® FPGA IP Parameter Settings 6.1.4. GPIO Intel® FPGA IP Interface Signals 6.1.5. GPIO Intel® FPGA IP Architecture 6.1.6. Verifying Resource Utilization and Design Performance 6.1.7. GPIO Intel® FPGA IP Timing 6.1.8. GPIO Intel® FPGA IP Design Examples
6.1.2. Generating the GPIO Intel® FPGA IP x
6.1.2.1. Intel® FPGA IP Generation Output
6.1.3. GPIO Intel® FPGA IP Parameter Settings x
6.1.3.1. Guideline: Swap datain_h and datain_l Ports in Migrated IP
6.1.4. GPIO Intel® FPGA IP Interface Signals x
6.1.4.1. Shared Signals 6.1.4.2. Data Bit-Order for Data Interface 6.1.4.3. Input and Output Bus High and Low Bits 6.1.4.4. Data Interface Signals and Corresponding Clocks
6.1.5. GPIO Intel® FPGA IP Architecture x
6.1.5.1. GPIO Intel® FPGA IP Data Paths 6.1.5.2. Register Packing
6.1.5.1. GPIO Intel® FPGA IP Data Paths x
6.1.5.1.1. Input Path 6.1.5.1.2. Output and Output Enable Paths
6.1.7. GPIO Intel® FPGA IP Timing x
6.1.7.1. Timing Components 6.1.7.2. Delay Elements 6.1.7.3. Timing Analysis 6.1.7.4. Timing Closure Guidelines
6.1.7.3. Timing Analysis x
6.1.7.3.1. Single Data Rate Input Register 6.1.7.3.2. Full-Rate or Half-Rate DDIO Input Register 6.1.7.3.3. Single Data Rate Output Register 6.1.7.3.4. Full-Rate or Half-Rate DDIO Output Register
6.1.8. GPIO Intel® FPGA IP Design Examples x
6.1.8.1. GPIO Intel® FPGA IP Synthesizable Intel® Quartus® Prime Design Example 6.1.8.2. GPIO Intel® FPGA IP Simulation Design Example
6.2. OCT Intel® FPGA IP x
6.2.1. Release Information 6.2.2. Generating the OCT Intel® FPGA IP 6.2.3. OCT Intel® FPGA IP Parameter Settings 6.2.4. OCT Intel® FPGA IP Signals 6.2.5. QSF Assignments 6.2.6. OCT Intel® FPGA IP Architecture 6.2.7. OCT Intel® FPGA IP Design Example
6.2.2. Generating the OCT Intel® FPGA IP x
6.2.2.1. Intel® FPGA IP Generation Output
6.2.7. OCT Intel® FPGA IP Design Example x
6.2.7.1. Generating the Intel® Quartus® Prime Design Example
7. Programmable I/O Features Description x
7.1. Programmable Pre-Emphasis 7.2. Programmable De-Emphasis 7.3. Programmable Differential Output Voltage
1. Intel® Agilex™ 7 F-Series and I-Series General-Purpose I/O Overview
2. Intel® Agilex™ 7 F-Series and I-Series GPIO Banks
3. Intel® Agilex™ 7 F-Series and I-Series HPS I/O Banks
4. Intel® Agilex™ 7 F-Series and I-Series SDM I/O Banks
5. Intel® Agilex™ 7 F-Series and I-Series I/O Troubleshooting Guidelines
6. Intel® Agilex™ 7 F-Series and I-Series General-Purpose I/O IPs
7. Programmable I/O Features Description
8. Documentation Related to the Intel® Agilex™ 7 General-Purpose I/O User Guide: F-Series and I-Series
9. Document Revision History for the Intel® Agilex™ 7 General-Purpose I/O User Guide: F-Series and I-Series

2.6. GPIO Simulation

Intel provides three types of simulation models for F-Series and I-Series devices.

These simulation models are:

  • Synopsys* HSPICE* models
  • IBIS models
  • IBIS AMI models
Table 20.  Simulation Models Descriptions
Model Supported I/O Type Description
HSPICE* GPIO
  • Simulates actual transistor level design to obtain precise electrical simulation.
  • The syntax describes I/O buffers, board components and connections, and specific simulation parameters.
  • The model contains encrypted transistor and logic cell library models, output buffer circuit models for single-ended and differential I/Os, and sample SPICE decks for single-ended and differential I/Os.
  • The model requires a longer simulation time compared to the IBIS model.
IBIS GPIO
  • This is a behavioral model of the I/O buffers based on the I/V curve data derived from the HSPICE* simulation.
  • The pre-emphasis feature is an example that can use the IBIS simulation model.
  • This model has a shorter simulation time compared to HSPICE* .
  • The simulation model has less complexity compared to HSPICE* models and supported by many simulation tools.
IBIS AMI Transceiver I/O
  • Algorithmic Modeling Interface (IBIS AMI) is a part of IBIS 5.0 specification for high-speed transmitter and receiver models that are supplied as executables in tools that support IBIS simulation.
  • This is an industry standard model methodology for high-speed link simulation applied to multi gigabit serial link channels.
  • This simulation model allows simulation of millions of bits in minutes, crosstalk and jitter analysis, detect data pattern dependencies, and able to model complex blocks such as equalization and CDR.

Section Content
IBIS Models
HSPICE Models
Net Length Reports

Level Two Title