Intel® Agilex™ 7 General-Purpose I/O User Guide: F-Series and I-Series

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ID 683780
Date 2/20/2023
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Document Table of Contents
Document Table of Contents x
1. Intel® Agilex™ 7 F-Series and I-Series General-Purpose I/O Overview 2. Intel® Agilex™ 7 F-Series and I-Series GPIO Banks 3. Intel® Agilex™ 7 F-Series and I-Series HPS I/O Banks 4. Intel® Agilex™ 7 F-Series and I-Series SDM I/O Banks 5. Intel® Agilex™ 7 F-Series and I-Series I/O Troubleshooting Guidelines 6. Intel® Agilex™ 7 F-Series and I-Series General-Purpose I/O IPs 7. Programmable I/O Features Description 8. Documentation Related to the Intel® Agilex™ 7 General-Purpose I/O User Guide: F-Series and I-Series 9. Document Revision History for the Intel® Agilex™ 7 General-Purpose I/O User Guide: F-Series and I-Series
1. Intel® Agilex™ 7 F-Series and I-Series General-Purpose I/O Overview x
1.1. Package Selection and I/O Vertical Migration Support 1.2. Types of I/O Banks
2. Intel® Agilex™ 7 F-Series and I-Series GPIO Banks x
2.1. GPIO Bank Overview 2.2. GPIO Features 2.3. GPIO Implementation Guide 2.4. GPIO Termination 2.5. GPIO Design Guidelines 2.6. GPIO Simulation
2.1. GPIO Bank Overview x
2.1.1. GPIO Bank Structure 2.1.2. GPIO Buffers and Registers
2.2. GPIO Features x
2.2.1. Supported I/O Standards for GPIO Banks 2.2.2. GPIO Buffer Behavior 2.2.3. Programmable I/O Element Features for the GPIO Bank
2.2.3. Programmable I/O Element Features for the GPIO Bank x
2.2.3.1. Guidelines: Programmable Output Slew Rate Control 2.2.3.2. Guidelines: Programmable Open-Drain Output 2.2.3.3. Guidelines: Programmable Bus-Hold 2.2.3.4. Guidelines: Programmable Pull-Up Resistor 2.2.3.5. Guidelines: Programmable De-Emphasis
2.3. GPIO Implementation Guide x
2.3.1. I/O Assignments with the Intel® Quartus® Prime Assignment Editor 2.3.2. Assigning Pin I/O Standards in the Intel® Quartus® Prime Pin Planner
2.3.1. I/O Assignments with the Intel® Quartus® Prime Assignment Editor x
2.3.1.1. Assigning Pin I/O Standards in the Intel® Quartus® Prime Assignment Editor 2.3.1.2. Assigning Programmable IOE Features in the Intel® Quartus® Prime Assignment Editor 2.3.1.3. GPIO Programmable IOE Features Assignment Names and Settings
2.4. GPIO Termination x
2.4.1. Single-Ended I/O Termination in F-Series and I-Series Devices 2.4.2. True Differential Signaling I/O Termination
2.4.1. Single-Ended I/O Termination in F-Series and I-Series Devices x
2.4.1.1. Single-Ended I/O Standard OCT Termination 2.4.1.2. OCT Calibration Block 2.4.1.3. Single-Ended I/O Standards External Termination 2.4.1.4. Single-Ended I/O Termination Implementation Guide
2.4.1.1. Single-Ended I/O Standard OCT Termination x
2.4.1.1.1. RS OCT 2.4.1.1.2. RT OCT 2.4.1.1.3. Dynamic OCT
2.4.1.4. Single-Ended I/O Termination Implementation Guide x
2.4.1.4.1. Configuring OCT Using the Assignment Editor 2.4.1.4.2. OCT Features Assignment Names and Settings
2.4.2. True Differential Signaling I/O Termination x
2.4.2.1. True Differential Signaling I/O Standard OCT Termination 2.4.2.2. True Differential Signaling I/O Standard External Termination
2.4.2.1. True Differential Signaling I/O Standard OCT Termination x
2.4.2.1.1. Configuring Differential Input RD OCT Using the Assignment Editor 2.4.2.1.2. Guidelines: Differential Input RD OCT
2.5. GPIO Design Guidelines x
2.5.1. VREF Sources and VREF Pins 2.5.2. I/O Standards Implementation Based on VCCIO_PIO Voltages 2.5.3. OCT Calibration Block Requirement 2.5.4. I/O Pins Placement Requirements 2.5.5. I/O Standard Selection and I/O Bank Supply Compatibility Check 2.5.6. Simultaneous Switching Noise 2.5.7. Special Pins Requirement 2.5.8. External Memory Interface Pin Placement Requirements 2.5.9. HPS Shared I/O Requirements 2.5.10. Clocking Requirements 2.5.11. SDM Shared I/O Requirements 2.5.12. Unused Pins 2.5.13. Voltage Setting for Unused GPIO Banks 2.5.14. GPIO Pins During Power Sequencing 2.5.15. Drive Strength Requirement for GPIO Input Pins 2.5.16. Maximum DC Current Restrictions 2.5.17. 1.2 V I/O Interface Voltage Level Compatibility 2.5.18. GPIO Pins for the Avalon® Streaming Interface Configuration Scheme 2.5.19. Maximum True Differential Signaling Receiver Pairs Per I/O Lane
2.6. GPIO Simulation x
2.6.1. IBIS Models 2.6.2. HSPICE* Models 2.6.3. Net Length Reports
3. Intel® Agilex™ 7 F-Series and I-Series HPS I/O Banks x
3.1. HPS I/O Bank Overview 3.2. HPS I/O Features 3.3. HPS I/O Implementation Guide 3.4. HPS I/O Design Guidelines 3.5. HPS I/O Simulation
3.2. HPS I/O Features x
3.2.1. Supported I/O Standards for HPS I/O Banks 3.2.2. HPS I/O Buffer Behavior 3.2.3. Programmable I/O Element Features for the HPS I/O Bank
3.3. HPS I/O Implementation Guide x
3.3.1. Configuring Open Drain Feature for the HPS I/O 3.3.2. I/O Assignments with the Intel® Quartus® Prime Assignment Editor 3.3.3. Assigning Pin I/O Standards in the Intel® Quartus® Prime Pin Planner
3.3.2. I/O Assignments with the Intel® Quartus® Prime Assignment Editor x
3.3.2.1. Assigning Programmable IOE Features in the Intel® Quartus® Prime Assignment Editor 3.3.2.2. HPS I/O Programmable IOE Features Assignment Names and Settings
3.4. HPS I/O Design Guidelines x
3.4.1. Unused Pins 3.4.2. HPS I/O Pins During Power Sequencing 3.4.3. HPS Shared I/O Requirements
3.5. HPS I/O Simulation x
3.5.1. HPS IBIS Models 3.5.2. Net Length Reports
4. Intel® Agilex™ 7 F-Series and I-Series SDM I/O Banks x
4.1. SDM I/O Bank Overview 4.2. SDM I/O Features 4.3. SDM I/O Design Guidelines 4.4. SDM I/O Simulation
4.2. SDM I/O Features x
4.2.1. Supported I/O Standards for SDM I/O Banks 4.2.2. SDM I/O Buffer Behavior 4.2.3. I/O Standards and Features for Configuration Pins
4.3. SDM I/O Design Guidelines x
4.3.1. Unused Pins 4.3.2. SDM I/O Pins During Power Sequencing
4.4. SDM I/O Simulation x
4.4.1. SDM IBIS Models 4.4.2. Net Length Reports
6. Intel® Agilex™ 7 F-Series and I-Series General-Purpose I/O IPs x
6.1. GPIO Intel® FPGA IP 6.2. OCT Intel® FPGA IP
6.1. GPIO Intel® FPGA IP x
6.1.1. Release Information for GPIO Intel® FPGA IP 6.1.2. Generating the GPIO Intel® FPGA IP 6.1.3. GPIO Intel® FPGA IP Parameter Settings 6.1.4. GPIO Intel® FPGA IP Interface Signals 6.1.5. GPIO Intel® FPGA IP Architecture 6.1.6. Verifying Resource Utilization and Design Performance 6.1.7. GPIO Intel® FPGA IP Timing 6.1.8. GPIO Intel® FPGA IP Design Examples
6.1.2. Generating the GPIO Intel® FPGA IP x
6.1.2.1. Intel® FPGA IP Generation Output
6.1.3. GPIO Intel® FPGA IP Parameter Settings x
6.1.3.1. Guideline: Swap datain_h and datain_l Ports in Migrated IP
6.1.4. GPIO Intel® FPGA IP Interface Signals x
6.1.4.1. Shared Signals 6.1.4.2. Data Bit-Order for Data Interface 6.1.4.3. Input and Output Bus High and Low Bits 6.1.4.4. Data Interface Signals and Corresponding Clocks
6.1.5. GPIO Intel® FPGA IP Architecture x
6.1.5.1. GPIO Intel® FPGA IP Data Paths 6.1.5.2. Register Packing
6.1.5.1. GPIO Intel® FPGA IP Data Paths x
6.1.5.1.1. Input Path 6.1.5.1.2. Output and Output Enable Paths
6.1.7. GPIO Intel® FPGA IP Timing x
6.1.7.1. Timing Components 6.1.7.2. Delay Elements 6.1.7.3. Timing Analysis 6.1.7.4. Timing Closure Guidelines
6.1.7.3. Timing Analysis x
6.1.7.3.1. Single Data Rate Input Register 6.1.7.3.2. Full-Rate or Half-Rate DDIO Input Register 6.1.7.3.3. Single Data Rate Output Register 6.1.7.3.4. Full-Rate or Half-Rate DDIO Output Register
6.1.8. GPIO Intel® FPGA IP Design Examples x
6.1.8.1. GPIO Intel® FPGA IP Synthesizable Intel® Quartus® Prime Design Example 6.1.8.2. GPIO Intel® FPGA IP Simulation Design Example
6.2. OCT Intel® FPGA IP x
6.2.1. Release Information 6.2.2. Generating the OCT Intel® FPGA IP 6.2.3. OCT Intel® FPGA IP Parameter Settings 6.2.4. OCT Intel® FPGA IP Signals 6.2.5. QSF Assignments 6.2.6. OCT Intel® FPGA IP Architecture 6.2.7. OCT Intel® FPGA IP Design Example
6.2.2. Generating the OCT Intel® FPGA IP x
6.2.2.1. Intel® FPGA IP Generation Output
6.2.7. OCT Intel® FPGA IP Design Example x
6.2.7.1. Generating the Intel® Quartus® Prime Design Example
7. Programmable I/O Features Description x
7.1. Programmable Pre-Emphasis 7.2. Programmable De-Emphasis 7.3. Programmable Differential Output Voltage
1. Intel® Agilex™ 7 F-Series and I-Series General-Purpose I/O Overview
2. Intel® Agilex™ 7 F-Series and I-Series GPIO Banks
3. Intel® Agilex™ 7 F-Series and I-Series HPS I/O Banks
4. Intel® Agilex™ 7 F-Series and I-Series SDM I/O Banks
5. Intel® Agilex™ 7 F-Series and I-Series I/O Troubleshooting Guidelines
6. Intel® Agilex™ 7 F-Series and I-Series General-Purpose I/O IPs
7. Programmable I/O Features Description
8. Documentation Related to the Intel® Agilex™ 7 General-Purpose I/O User Guide: F-Series and I-Series
9. Document Revision History for the Intel® Agilex™ 7 General-Purpose I/O User Guide: F-Series and I-Series

6.2.5. QSF Assignments

F-Series and I-Series devices support the following termination-related Intel® Quartus® Prime settings file (.qsf) assignments:

  • INPUT_TERMINATION
  • OUTPUT_TERMINATION
  • TERMINATION_CONTROL_BLOCK
  • RZQ_GROUP
Table 61.  QSF Assignments
QSF Assignment Details
INPUT_TERMINATION

OUTPUT_TERMINATION

The input/output termination assignment specifies the termination value in ohm on the pin in question.

Example:

set_instance_assignment -name INPUT_TERMINATION <value> -to <pin name>
set_instance_assignment -name OUTPUT_TERMINATION <value> -to <pin name>

To enable the series/parallel termination ports, include these assignments, which specify the series and parallel termination values for the pins.

Make sure to connect the ser_data port from the OCT Intel® FPGA IP to the GPIO Intel® FPGA IP.

Example: 
set_instance_assignment -name INPUT_TERMINATION "PARALLEL <VALUE> OHM WITH CALIBRATION" -to <pin>
set_instance_assignment -name OUTPUT_TERMINATION "SERIES <VALUE> OHM WITH CALIBRATION" -to <pin>
TERMINATION_CONTROL_BLOCK

Directs the Fitter to make the proper connection from the desired OCT block to the specified pins. This assignment is useful when I/O buffers are not explicitly instantiated and you need to associate the pins with a specific OCT block.

Example:

set_instance_assignment -name TERMINATION_CONTROL_BLOCK <desired OCT BLK> -to <pin name>
RZQ_GROUP

The Fitter searches for the rzq pin name in the netlist. If the pin does not exist, the Fitter creates the pin name along with the OCT IP and its corresponding connections. This allows you to create a group of pins to be calibrated by an existing or non-existing OCT and the Fitter ensures the legality of the design.

Example:

set_instance_assignment -name RZQ_GROUP <rzq pin name> -to <pin name>

Termination can exist on input and output buffers, and sometimes simultaneously.

There are two methods to associate pin groups with an OCT block:

  • Use a .qsf assignment to indicate which pin (bus) is associated with which OCT block. You can use the TERMINATION_CONTROL_BLOCK assignment to associates a pin with an OCT instantiated in the RTL.
  • Instantiate the I/O buffer primitives at the top level and connect them to the appropriate OCT blocks.
Figure 48. OCT Block Connection with I/O BufferThis figure shows the connections from the I/O buffer primitives to the appropriate OCT blocks.
Note: All I/O banks within the same bank row with the same VCCIO can share one OCT block even if that particular I/O bank has its own OCT block. You can connect any number of I/O pins that support calibrated termination to an OCT block. Ensure that you connect I/Os with compatible configuration to an OCT block. You must also ensure that the OCT block and its corresponding I/Os have the same VCCIO and series or parallel termination values. With these settings, the Fitter places the I/Os and OCT block in the same column. The Intel® Quartus® Prime software generates warning messages if there is no pin connected to the block.
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