Intel® MAX® 10 General Purpose I/O User Guide

Download PDF
ID 683751
Date 1/27/2022
Public

A newer version of this document is available. Customers should click here to go to the newest version.

Document Table of Contents
Document Table of Contents x
1. Intel® MAX® 10 I/O Overview 2. Intel® MAX® 10 I/O Architecture and Features 3. Intel® MAX® 10 I/O Design Considerations 4. Intel® MAX® 10 I/O Implementation Guides 5. GPIO Lite Intel® FPGA IP References 6. Intel® MAX® 10 General Purpose I/O User Guide Archives 7. Document Revision History for Intel® MAX® 10 General Purpose I/O User Guide
1. Intel® MAX® 10 I/O Overview x
1.1. Intel® MAX® 10 Devices I/O Resources Per Package 1.2. Intel® MAX® 10 I/O Vertical Migration Support
2. Intel® MAX® 10 I/O Architecture and Features x
2.1. Intel® MAX® 10 I/O Standards Support 2.2. Intel® MAX® 10 I/O Elements 2.3. Intel® MAX® 10 I/O Buffers 2.4. I/O Standards Termination
2.1. Intel® MAX® 10 I/O Standards Support x
2.1.1. Intel® MAX® 10 I/O Standards Voltage and Pin Support
2.2. Intel® MAX® 10 I/O Elements x
2.2.1. Intel® MAX® 10 I/O Banks Architecture 2.2.2. Intel® MAX® 10 I/O Banks Performance 2.2.3. Intel® MAX® 10 I/O Banks Locations
2.3. Intel® MAX® 10 I/O Buffers x
2.3.1. Schmitt-Trigger Input Buffer 2.3.2. Programmable I/O Buffer Features
2.3.2. Programmable I/O Buffer Features x
2.3.2.1. Programmable Open Drain 2.3.2.2. Programmable Bus Hold 2.3.2.3. Programmable Pull-Up Resistor 2.3.2.4. Programmable Current Strength 2.3.2.5. Programmable Output Slew Rate Control 2.3.2.6. Programmable IOE Delay 2.3.2.7. PCI Clamp Diode 2.3.2.8. Programmable Pre-Emphasis 2.3.2.9. Programmable Differential Output Voltage 2.3.2.10. Programmable Emulated Differential Output 2.3.2.11. Programmable Dynamic Power Down
2.4. I/O Standards Termination x
2.4.1. Voltage-Referenced I/O Standards Termination 2.4.2. Differential I/O Standards Termination 2.4.3. Intel® MAX® 10 On-Chip I/O Termination
2.4.3. Intel® MAX® 10 On-Chip I/O Termination x
2.4.3.1. OCT Calibration 2.4.3.2. RS OCT in Intel® MAX® 10 Devices
3. Intel® MAX® 10 I/O Design Considerations x
3.1. Guidelines: VCCIO Range Considerations 3.2. Guidelines: Voltage-Referenced I/O Standards Restriction 3.3. Guidelines: Enable Clamp Diode for LVTTL/LVCMOS Input Buffers 3.4. Guidelines: Adhere to the LVDS I/O Restrictions Rules 3.5. Guidelines: I/O Restriction Rules 3.6. Guidelines: Placement Restrictions for 1.0 V I/O Pin 3.7. Guidelines: Analog-to-Digital Converter I/O Restriction 3.8. Guidelines: External Memory Interface I/O Restrictions 3.9. Guidelines: Dual-Purpose Configuration Pin 3.10. Guidelines: Clock and Data Input Signal for Intel® MAX® 10 E144 Package
3.6. Guidelines: Placement Restrictions for 1.0 V I/O Pin x
3.6.1. Calculating the Total Inductance for 1.0 V Pin Placement
4. Intel® MAX® 10 I/O Implementation Guides x
4.1. GPIO Lite Intel FPGA IP GPIO Lite Intel® FPGA IP 4.2. Verifying Pin Migration Compatibility
4.1. GPIO Lite Intel FPGA IP GPIO Lite Intel® FPGA IP x
4.1.1. GPIO Lite Intel® FPGA IP Data Paths
4.1.1. GPIO Lite Intel® FPGA IP Data Paths x
4.1.1.1. DDR Input Path 4.1.1.2. DDR Output Path with Output Enable
5. GPIO Lite Intel® FPGA IP References x
5.1. GPIO Lite Intel® FPGA IP Parameter Settings 5.2. GPIO Lite Intel® FPGA IP Interface Signals
1. Intel® MAX® 10 I/O Overview
2. Intel® MAX® 10 I/O Architecture and Features
3. Intel® MAX® 10 I/O Design Considerations
4. Intel® MAX® 10 I/O Implementation Guides
5. GPIO Lite Intel® FPGA IP References
6. Intel® MAX® 10 General Purpose I/O User Guide Archives
7. Document Revision History for Intel® MAX® 10 General Purpose I/O User Guide

4.2. Verifying Pin Migration Compatibility

You can use the Pin Migration View window in the Intel® Quartus® Prime software Pin Planner to assist you in verifying whether your pin assignments migrate to a different device successfully.

You can vertically migrate to a device with a different density while using the same device package, or migrate between packages with different densities and ball counts.

  1. Open Assignments > Pin Planner and create pin assignments.
  2. If necessary, perform one of the following options to populate the Pin Planner with the node names in the design:
    • Analysis & Elaboration
    • Analysis & Synthesis
    • Fully compile the design
  3. Then, on the menu in Pin Planner, click View > Pin Migration Window.
  4. To select or change migration devices:
    1. Click Device to open the Device dialog box.
    2. Click Migration Devices.
  5. To show more information about the pins:
    1. Right-click anywhere in the Pin Migration View window and select Show Columns.
    2. Then, click the pin feature you want to display.
  6. If you want to view only the pins, in at least one migration device, that have a different feature than the corresponding pin in the migration result, turn on Show migration differences.
  7. Click Pin Finder to open the Pin Finder dialog box and find and highlight pins with specific functionality.
    If you want to view only the pins found and highlighted by the most recent query in the Pin Finder dialog box, turn on Show only highlighted pins.
  8. To export the pin migration information to a Comma-Separated Value File (.csv), click Export.
Related Information
Level Two Title