Stratix® 10 TX Device Overview

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ID 683717
Date 9/07/2023
Public
Document Table of Contents
Document Table of Contents x
1. Intel® Stratix® 10 TX Device Overview
1. Intel® Stratix® 10 TX Device Overview x
1.1. Intel® Stratix® 10 TX Devices 1.2. Innovations in Intel® Stratix® 10 TX Devices 1.3. Intel® Stratix® 10 TX Features Summary 1.4. Intel® Stratix® 10 TX Block Diagram 1.5. Intel® Stratix® 10 TX Family Plan 1.6. Intel® Hyperflex™ Core Architecture 1.7. Heterogeneous 3D SiP Transceiver Tiles 1.8. Intel® Stratix® 10 TX Transceivers 1.9. PCI Express Gen1/Gen2/Gen3 Hard IP 1.10. Ethernet MAC, Reed-Solomon FEC for NRZ signals (528, 514) and PAM4 signals (544, 514) 1.11. 10G Ethernet Hard IP 1.12. Interlaken PCS Hard IP 1.13. External Memory and General Purpose I/O 1.14. Adaptive Logic Module (ALM) 1.15. Core Clocking 1.16. Fractional Synthesis PLLs and I/O PLLs 1.17. Internal Embedded Memory 1.18. Variable Precision DSP Block 1.19. Hard Processor System (HPS) 1.20. Power Management 1.21. Device Configuration and Secure Device Manager (SDM) 1.22. Device Security 1.23. Configuration via Protocol Using PCI Express* 1.24. Partial and Dynamic Reconfiguration 1.25. Fast Forward Compile 1.26. Single Event Upset (SEU) Error Detection and Correction 1.27. Document Revision History for the Intel® Stratix® 10 TX Device Overview
1.1. Intel® Stratix® 10 TX Devices x
1.1.1. Available Options
1.8. Intel® Stratix® 10 TX Transceivers x
1.8.1. PMA Features 1.8.2. PCS Features
1.19. Hard Processor System (HPS) x
1.19.1. Key Features of the Intel® Stratix® 10 HPS
1. Intel® Stratix® 10 TX Device Overview

1.7. Heterogeneous 3D SiP Transceiver Tiles

Intel® Stratix® 10 TX devices feature power efficient, high bandwidth, low latency transceivers. The transceivers are implemented on heterogeneous 3D System-in-Package (SiP) transceiver tiles, each containing 24 full-duplex transceiver channels. In addition to providing a high-performance transceiver solution to meet current connectivity needs, this allows for future flexibility and scalability as data rates, modulation schemes, and protocol IPs evolve.

Figure 10. Monolithic Core Fabric, Heterogeneous 3D SiP Transceiver Tiles

Each transceiver tile contains:

  • 24 full-duplex transceiver channels (PMA and PCS)
  • Reference clock distribution network
  • Transmit PLLs
  • High-speed clocking and bonding networks
  • PCI Express* and 100G Ethernet MAC hard IP, or 100G Ethernet MAC with dedicated Reed-Solomon FEC for NRZ signals (528, 514) and PAM4 signals (544, 514)
Figure 11. Heterogeneous 3D SiP Transceiver Tile Architecture
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