AN 307: Intel® FPGA Design Flow for AMD* Xilinx* Users

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ID 683562
Date 4/01/2024
Public
Document Table of Contents
Document Table of Contents x
1. Introduction to Intel® FPGA Design Flow for AMD* Xilinx* Users 2. Technology Comparison 3. FPGA Tools Comparison 4. AMD* Xilinx* to Intel® FPGA Design Conversion 5. Conclusion 6. AN 307: Intel® FPGA Design Flow for AMD* Xilinx* Users Archives 7. Document Revision History for Intel® FPGA Design Flow for AMD* Xilinx* Users
2. Technology Comparison x
2.1. Intel® FPGA and SoC Devices 2.2. Intel® - AMD* Xilinx* Device Comparison 2.3. Intel® FPGA Device Features
3. FPGA Tools Comparison x
3.1. Hardware and Software Tools for FPGA Design 3.2. FPGA Design Flow Using Command Line Scripting 3.3. FPGA Design Flow Using Tools with GUIs 3.4. Additional Quartus® Prime Pro Edition Features
3.2. FPGA Design Flow Using Command Line Scripting x
3.2.1. Command-Line Executable Equivalents 3.2.2. Programming and Configuration File Support in the Quartus® Prime Pro Edition Software
3.2.1. Command-Line Executable Equivalents x
3.2.1.1. synth_design 3.2.1.2. place_design/route_design 3.2.1.3. report_timing 3.2.1.4. write_bitstream 3.2.1.5. write_sdf/write_verilog/write_vhdl 3.2.1.6. report_power 3.2.1.7. write_checkpoint 3.2.1.8. Run Complete Design Flow
3.3. FPGA Design Flow Using Tools with GUIs x
3.3.1. Project Creation 3.3.2. Design Entry 3.3.3. IP Status 3.3.4. Design Constraints 3.3.5. Synthesis 3.3.6. Design Implementation 3.3.7. Finalize Pinout 3.3.8. Viewing and Editing Design Placement 3.3.9. Static Timing Analysis 3.3.10. Generation of Device Programming Files 3.3.11. Power Analysis 3.3.12. Simulation 3.3.13. Hardware Verification 3.3.14. View Netlist 3.3.15. Design Optimization 3.3.16. Techniques to Improve Productivity 3.3.17. Partial Reconfiguration 3.3.18. Cross-Probing in the Quartus® Prime Pro Edition Software
3.3.2. Design Entry x
3.3.2.1. HDL Editor 3.3.2.2. Schematic/Block Editor 3.3.2.3. State Machine Editor 3.3.2.4. IP Catalog and Parameter Editor 3.3.2.5. Platform Designer System Integration Tool 3.3.2.6. Platform Designer Component Editor
3.3.4. Design Constraints x
3.3.4.1. Assignment Editor 3.3.4.2. Create Timing Constraints with the Timing Analyzer GUI 3.3.4.3. Create Timing Constraints with the Timing Analyzer Text Editor
3.3.7. Finalize Pinout x
3.3.7.1. Pin Planner 3.3.7.2. Interface Planner 3.3.7.3. Tile Interface Planner
3.3.12. Simulation x
3.3.12.1. Simulation Models for Designs Containing LPMs or IP Cores
3.3.13. Hardware Verification x
3.3.13.1. System Console 3.3.13.2. Signal Tap Logic Analyzer 3.3.13.3. In-System Sources and Probes 3.3.13.4. Toolkit Explorer 3.3.13.5. Remote Debugging 3.3.13.6. Other Intel® FPGA Debugging Tools
3.3.13.4. Toolkit Explorer x
3.3.13.4.1. Transceiver Toolkit 3.3.13.4.2. EMIF Debug Toolkit
3.3.14. View Netlist x
3.3.14.1. RTL Viewer 3.3.14.2. Technology Map Viewer
3.3.15. Design Optimization x
3.3.15.1. Hyper-Aware Design Flow 3.3.15.2. Physical Synthesis Optimization 3.3.15.3. Optimization Modes 3.3.15.4. Fractal Synthesis
3.3.16. Techniques to Improve Productivity x
3.3.16.1. Fast Preservation 3.3.16.2. Engineering Change Order (ECO) Flow 3.3.16.3. Block-Based Design Flow 3.3.16.4. Design Assistant 3.3.16.5. Snapshot Viewer 3.3.16.6. Design Space Explorer II
3.4. Additional Quartus® Prime Pro Edition Features x
3.4.1. Scripting with Tcl in the Quartus® Prime Pro Edition Software
3.4.1. Scripting with Tcl in the Quartus® Prime Pro Edition Software x
3.4.1.1. Running Scripts from the DOS or UNIX Prompt 3.4.1.2. Running Scripts in Batch Mode from a Shell 3.4.1.3. Running Tcl Commands Directly from the Command Line 3.4.1.4. Running Tcl Commands Interactively from the Shell 3.4.1.5. The Quartus® Prime Tcl Console Window
4. AMD* Xilinx* to Intel® FPGA Design Conversion x
4.1. Replacing AMD* Xilinx* Primitives 4.2. Converting IP Cores 4.3. Setting Equivalent AMD* Xilinx* Design Constraints 4.4. Setting Up the Simulation Environment
4.1. Replacing AMD* Xilinx* Primitives x
4.1.1. Converting I/O Buffers 4.1.2. Changing Default I/O Standard for Pins 4.1.3. Converting Registers
4.1.1. Converting I/O Buffers x
4.1.1.1. Example of Converting I/O Buffer
4.2. Converting IP Cores x
4.2.1. Converting Memory Blocks 4.2.2. Converting Mixed-Mode Clock Manager (MMCM) to Phase-Locked Loop (PLL) 4.2.3. Converting Multipliers
4.2.1. Converting Memory Blocks x
4.2.1.1. Embedded Memory Blocks 4.2.1.2. Differences Between AMD* Xilinx* Memory and Intel® FPGA Memory 4.2.1.3. Determining Memory Block and Mapping Ports 4.2.1.4. Memory Port Mapping 4.2.1.5. Example: Converting Simple Dual-Port RAM
4.2.1.2. Differences Between AMD* Xilinx* Memory and Intel® FPGA Memory x
4.2.1.2.1. Memory Mode 4.2.1.2.2. Clocking Mode 4.2.1.2.3. Write and Read Operation Triggering 4.2.1.2.4. Read-During-Write Operation at the Same Address 4.2.1.2.5. Error Correction Code (ECC) 4.2.1.2.6. Byte Enable 4.2.1.2.7. Address Clock Enable 4.2.1.2.8. Parity Bit Support 4.2.1.2.9. Memory Initialization 4.2.1.2.10. Output Synchronous Set/Reset
4.2.2. Converting Mixed-Mode Clock Manager (MMCM) to Phase-Locked Loop (PLL) x
4.2.2.1. Feature Comparison 4.2.2.2. Port Mapping Reference 4.2.2.3. Example: Converting AMD* Xilinx* MMCM into an Intel® PLL
4.2.3. Converting Multipliers x
4.2.3.1. Feature Comparison 4.2.3.2. Port Mapping 4.2.3.3. Example: Converting to the LPM_MULT IP Core 4.2.3.4. Example: Converting to the Intel® FPGA Multiply Adder IP core
4.3. Setting Equivalent AMD* Xilinx* Design Constraints x
4.3.1. Device Constraints 4.3.2. Placement Constraints 4.3.3. Timing Constraints 4.3.4. Retimer Constraints
4.3.1. Device Constraints x
4.3.1.1. DRIVE 4.3.1.2. SLEW 4.3.1.3. IOB 4.3.1.4. IOSTANDARD 4.3.1.5. KEEP
4.3.2. Placement Constraints x
4.3.2.1. PBLOCK 4.3.2.2. PACKAGE_PIN 4.3.2.3. LOC & BEL 4.3.2.4. PROHIBIT
4.3.2.1. PBLOCK x
4.3.2.1.1. Differences Between PBLOCK and Logic Lock Regions
4.3.3. Timing Constraints x
4.3.3.1. Clock Domain Crossing
4.4. Setting Up the Simulation Environment x
4.4.1. Simulation Levels 4.4.2. HDL Support for EDA Simulators 4.4.3. Value Change Dump (VCD) Support 4.4.4. Simulating Intel FPGA IP Cores
1. Introduction to Intel® FPGA Design Flow for AMD* Xilinx* Users
2. Technology Comparison
3. FPGA Tools Comparison
4. AMD* Xilinx* to Intel® FPGA Design Conversion
5. Conclusion
6. AN 307: Intel® FPGA Design Flow for AMD* Xilinx* Users Archives
7. Document Revision History for Intel® FPGA Design Flow for AMD* Xilinx* Users

2.1. Intel® FPGA and SoC Devices

Intel® FPGA devices are ideal for a wide variety of applications, from prototyping state-of-the-art new products all the way through to high-volume production. Intel has several FPGA families that cover high-end, mid-range, and low-cost markets. Each family includes different features such as embedded memory, digital signal processing (DSP) blocks, high-speed transceivers, and general purpose I/O pins. These features help cover a broad range of application requirements.

Intel® SoC devices bring high-integration and advanced system, power, and security management capabilities to the Intel® product portfolio. These devices are supported by industry-standard Arm* tools, along with a broad ecosystem of operating systems and development tools.

Intel FPGA and SoC devices are available in the following device families:

  • Cyclone® 10 GX FPGA devices are built to meet your low-power, cost-sensitive, design needs in a broad range of markets such as industrial, broadcast and telecommunications.
  • Agilex™ 5 FPGA devices extend the innovations of Agilex™ devices to midrange FPGA applications. Agilex™ 5 devices serve a broad range of applications that require high performance, lower power, smaller form factors and lower logic densities.
  • Agilex™ 7 FPGA and SoC devices deliver on average 50% higher core performance, or up to 40% lower power over previous generation high-end, high-performance FPGAs. Fabricated using the Intel 10 nm SuperFin technology, these FPGAs and SoCs accelerate your delivery of the most advanced bandwidth-intensive applications.
  • Arria® 10 FPGA and SoC devices are ideal for your high-performance, power-sensitive midrange applications in diverse markets. The power efficiency of these devices is achieved through a comprehensive set of power-saving technologies.
  • Stratix® 10 FPGA and SoC devices feature several groundbreaking innovations, including the Intel® Hyperflex™ core architecture. This device family enables you to meet the demand for ever-increasing transceiver and processing performance in your most advanced applications, while meeting your power budget.
Table 1.  Intel FPGA Family Technologies and Architectures
Intel® FPGA Family Technology Architecture
Agilex™ 5 E-Series and D-Series Intel 7 Fabric
Agilex™ 7 F-Series and I-Series 10 nm SuperFin Fabric + Tiles
Agilex™ 7 M-Series Intel 7 Fabric + Tiles
Arria® 10 20 nm Planar Monolithic
Cyclone® 10 GX 20 nm Planar Monolithic
Stratix® 10 14 nm FinFet Fabric + Tiles

The latest Agilex™ 7 and Stratix® 10 FPGA and SoC devices are built using heterogeneous 3D system-in-package (SiP) technology. This technology enables in-package integration of a range of component tiles such as transceivers, memory, and analog, while maintaining a monolithic FPGA fabric. Various tile die from different process nodes can be integrated in the same package, the tiles being connected to the FPGA fabric die using the Intel® Embedded Multi-die Interconnect Bridge (EMIB) packaging technology.

For more information about the Intel® SiP technology, refer to the Enabling Next-Generation Platforms Using Intel® ’s 3D System-in-Package Technology white paper.

To understand the advantages of a monolithic FPGA fabric compared to alternative silicon interposer-based schemes used in competitive FPGA and SoC devices, refer to the Achieving the Highest Levels of Integration in Programmable Logic white paper.

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