AN 307: Intel® FPGA Design Flow for AMD* Xilinx* Users

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ID 683562
Date 9/08/2023
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Document Table of Contents
Document Table of Contents x
1. Introduction to Intel® FPGA Design Flow for AMD* Xilinx* Users 2. Technology Comparison 3. FPGA Tools Comparison 4. AMD* Xilinx* to Intel® FPGA Design Conversion 5. Conclusion 6. AN 307: Intel® FPGA Design Flow for AMD* Xilinx* Users Archives 7. Document Revision History for Intel® FPGA Design Flow for AMD* Xilinx* Users
2. Technology Comparison x
2.1. Intel® FPGA and SoC Devices 2.2. Intel® - AMD* Xilinx* Device Comparison 2.3. Intel® FPGA Device Features
3. FPGA Tools Comparison x
3.1. Hardware and Software Tools for FPGA Design 3.2. FPGA Design Flow Using Command Line Scripting 3.3. FPGA Design Flow Using Tools with GUIs 3.4. Additional Intel® Quartus® Prime Pro Edition Features
3.2. FPGA Design Flow Using Command Line Scripting x
3.2.1. Command-Line Executable Equivalents 3.2.2. Programming and Configuration File Support in the Intel® Quartus® Prime Pro Edition Software
3.2.1. Command-Line Executable Equivalents x
3.2.1.1. synth_design 3.2.1.2. place_design/route_design 3.2.1.3. report_timing 3.2.1.4. write_bitstream 3.2.1.5. write_sdf/write_verilog/write_vhdl 3.2.1.6. report_power 3.2.1.7. write_checkpoint 3.2.1.8. Run Complete Design Flow
3.3. FPGA Design Flow Using Tools with GUIs x
3.3.1. Project Creation 3.3.2. Design Entry 3.3.3. IP Status 3.3.4. Design Constraints 3.3.5. Synthesis 3.3.6. Design Implementation 3.3.7. Finalize Pinout 3.3.8. Viewing and Editing Design Placement 3.3.9. Static Timing Analysis 3.3.10. Generation of Device Programming Files 3.3.11. Power Analysis 3.3.12. Simulation 3.3.13. Hardware Verification 3.3.14. View Netlist 3.3.15. Design Optimization 3.3.16. Techniques to Improve Productivity 3.3.17. Partial Reconfiguration 3.3.18. Cross-Probing in the Intel® Quartus® Prime Pro Edition Software
3.3.2. Design Entry x
3.3.2.1. HDL Editor 3.3.2.2. Schematic/Block Editor 3.3.2.3. State Machine Editor 3.3.2.4. IP Catalog and Parameter Editor 3.3.2.5. Platform Designer System Integration Tool 3.3.2.6. Platform Designer Component Editor
3.3.4. Design Constraints x
3.3.4.1. Assignment Editor 3.3.4.2. Create Timing Constraints with the Timing Analyzer GUI 3.3.4.3. Create Timing Constraints with the Timing Analyzer Text Editor
3.3.7. Finalize Pinout x
3.3.7.1. Pin Planner 3.3.7.2. Interface Planner 3.3.7.3. Tile Interface Planner
3.3.12. Simulation x
3.3.12.1. Simulation Models for Designs Containing LPMs or IP Cores
3.3.13. Hardware Verification x
3.3.13.1. System Console 3.3.13.2. Signal Tap Logic Analyzer 3.3.13.3. In-System Sources and Probes 3.3.13.4. Toolkit Explorer 3.3.13.5. Remote Debugging 3.3.13.6. Other Intel® FPGA Debugging Tools
3.3.13.4. Toolkit Explorer x
3.3.13.4.1. Transceiver Toolkit 3.3.13.4.2. EMIF Debug Toolkit
3.3.14. View Netlist x
3.3.14.1. RTL Viewer 3.3.14.2. Technology Map Viewer
3.3.15. Design Optimization x
3.3.15.1. Hyper-Aware Design Flow 3.3.15.2. Physical Synthesis Optimization 3.3.15.3. Optimization Modes 3.3.15.4. Fractal Synthesis
3.3.16. Techniques to Improve Productivity x
3.3.16.1. Fast Preservation 3.3.16.2. Engineering Change Order (ECO) Flow 3.3.16.3. Block-Based Design Flow 3.3.16.4. Design Assistant 3.3.16.5. Snapshot Viewer 3.3.16.6. Design Space Explorer II
3.4. Additional Intel® Quartus® Prime Pro Edition Features x
3.4.1. Scripting with Tcl in the Intel® Quartus® Prime Pro Edition Software
3.4.1. Scripting with Tcl in the Intel® Quartus® Prime Pro Edition Software x
3.4.1.1. Running Scripts from the DOS or UNIX Prompt 3.4.1.2. Running Scripts in Batch Mode from a Shell 3.4.1.3. Running Tcl Commands Directly from the Command Line 3.4.1.4. Running Tcl Commands Interactively from the Shell 3.4.1.5. The Intel® Quartus® Prime Tcl Console Window
4. AMD* Xilinx* to Intel® FPGA Design Conversion x
4.1. Replacing AMD* Xilinx* Primitives 4.2. Converting IP Cores 4.3. Setting Equivalent AMD* Xilinx* Design Constraints 4.4. Setting Up the Simulation Environment
4.1. Replacing AMD* Xilinx* Primitives x
4.1.1. Converting I/O Buffers 4.1.2. Changing Default I/O Standard for Pins 4.1.3. Converting Registers
4.1.1. Converting I/O Buffers x
4.1.1.1. Example of Converting I/O Buffer
4.2. Converting IP Cores x
4.2.1. Converting Memory Blocks 4.2.2. Converting Mixed-Mode Clock Manager (MMCM) to Phase-Locked Loop (PLL) 4.2.3. Converting Multipliers
4.2.1. Converting Memory Blocks x
4.2.1.1. Embedded Memory Blocks 4.2.1.2. Differences Between AMD* Xilinx* Memory and Intel® FPGA Memory 4.2.1.3. Determining Memory Block and Mapping Ports 4.2.1.4. Memory Port Mapping 4.2.1.5. Example: Converting Simple Dual-Port RAM
4.2.1.2. Differences Between AMD* Xilinx* Memory and Intel® FPGA Memory x
4.2.1.2.1. Memory Mode 4.2.1.2.2. Clocking Mode 4.2.1.2.3. Write and Read Operation Triggering 4.2.1.2.4. Read-During-Write Operation at the Same Address 4.2.1.2.5. Error Correction Code (ECC) 4.2.1.2.6. Byte Enable 4.2.1.2.7. Address Clock Enable 4.2.1.2.8. Parity Bit Support 4.2.1.2.9. Memory Initialization 4.2.1.2.10. Output Synchronous Set/Reset
4.2.2. Converting Mixed-Mode Clock Manager (MMCM) to Phase-Locked Loop (PLL) x
4.2.2.1. Feature Comparison 4.2.2.2. Port Mapping Reference 4.2.2.3. Example: Converting AMD* Xilinx* MMCM into an Intel® PLL
4.2.3. Converting Multipliers x
4.2.3.1. Feature Comparison 4.2.3.2. Port Mapping 4.2.3.3. Example: Converting to the LPM_MULT IP Core 4.2.3.4. Example: Converting to the Intel® FPGA Multiply Adder IP core
4.3. Setting Equivalent AMD* Xilinx* Design Constraints x
4.3.1. Device Constraints 4.3.2. Placement Constraints 4.3.3. Timing Constraints 4.3.4. Retimer Constraints
4.3.1. Device Constraints x
4.3.1.1. DRIVE 4.3.1.2. SLEW 4.3.1.3. IOB 4.3.1.4. IOSTANDARD 4.3.1.5. KEEP
4.3.2. Placement Constraints x
4.3.2.1. PBLOCK 4.3.2.2. PACKAGE_PIN 4.3.2.3. LOC & BEL 4.3.2.4. PROHIBIT
4.3.2.1. PBLOCK x
4.3.2.1.1. Differences Between PBLOCK and Logic Lock Regions
4.3.3. Timing Constraints x
4.3.3.1. Clock Domain Crossing
4.4. Setting Up the Simulation Environment x
4.4.1. Simulation Levels 4.4.2. HDL Support for EDA Simulators 4.4.3. Value Change Dump (VCD) Support 4.4.4. Simulating Intel FPGA IP Cores
1. Introduction to Intel® FPGA Design Flow for AMD* Xilinx* Users
2. Technology Comparison
3. FPGA Tools Comparison
4. AMD* Xilinx* to Intel® FPGA Design Conversion
5. Conclusion
6. AN 307: Intel® FPGA Design Flow for AMD* Xilinx* Users Archives
7. Document Revision History for Intel® FPGA Design Flow for AMD* Xilinx* Users

4.2.1.2.5. Error Correction Code (ECC)

AMD* Xilinx* and Intel® FPGA RAMs use Error Correction Code (ECC) to detect errors in the memory array, and present the corrected single-bit error data on the output.

Table 45.  Comparison of ECC Support and Status Output Signals for Intel® FPGA and AMD* Xilinx* RAMs
  Intel® FPGA AMD* Xilinx*
ECC support
  • Built-in support for eSRAM and M20K type of Embedded Memory Block selected in simple dual-port mode.
  • Intel® FPGA also provides a dedicated soft IP ECC core that is flexibly implemented in your design, and is not restricted by the type of memory block used. For more information about the ECC IP core, refer to the Intel® FPGA Integer Arithmetic IP Cores User Guide.
For UltraScale+* and 7-series devices in simple dual-port RAM.
Status Signal Indicates the status of the M20K block using a three-bit status flag eccstatus[1..0] Indicates the status of the data read using two status outputs:
  • SBITERR
  • DBITERR
Note: Intel® FPGA does not support using ECC with the byte-enable or coherent read features.
Related Information

ECC Parity Flip

The ECC parity flip feature is available only on Intel Agilex® 7 and Intel® Stratix® 10 devices.

The ECC parity flip feature dynamically flips the parity value generated in the encoder of M20K blocks to observe the ECC behavior through simulation.

When the ECC Encoder Bypass (eccencbypass) port is high, the built-in ECC encoder values are XOR-ed with the 8 parity bits through the parity ports to generate a new set of encoder value. When the ECC Encoder Bypass port is low, the encoder generates the parity bits according to the data input during a write process.

The following table shows an example to construct an 8-bit data width for the parity port.

Table 46.  Example of Setting the 8-Bit Parity Ports
Parity Bit Sequence ECC Feature Is the ECC Decoder able to Recognize and Correct the Data Bit?
00000001 Single-error correction Yes
00000011 Double-adjacent-error correction Yes
00000111 Triple-adjacent-error correction Yes
00000101 Triple-adjacent-error correction Yes
00010011 Non-adjacent double/triple correction/detection No guarantee

For more information about ECC, refer to the chapter about Embedded Memory Blocks in your target device handbook.

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