Intel® FPGA Power and Thermal Calculator User Guide

Download PDF
ID 683445
Date 9/26/2024
Public
Document Table of Contents
Document Table of Contents x
Answers to Top FAQs 1. Overview of the Intel® FPGA Power and Thermal Calculator 2. Estimating Power Consumption with the Intel® FPGA Power and Thermal Calculator 3. Intel® FPGA Power and Thermal Calculator Graphical User Interface 4. Intel® FPGA Power and Thermal Calculator Pages 5. Factors Affecting the Accuracy of the Intel® FPGA PTC 6. Intel® FPGA Power and Thermal Calculator User Guide Archive 7. Document Revision History for the Intel® FPGA Power and Thermal Calculator User Guide A. Measuring Static Power
1. Overview of the Intel® FPGA Power and Thermal Calculator x
1.1. Accessing the Intel FPGA Power and Thermal Calculators 1.2. Intel® FPGA PTC Power Model Status 1.3. Definitions of Power Terms Used in this Document
2. Estimating Power Consumption with the Intel® FPGA Power and Thermal Calculator x
2.1. Estimating Power Before Starting the FPGA Design 2.2. Estimating Power While Creating the FPGA Design 2.3. Estimating Power After Completing the FPGA Design 2.4. Estimating Power for Dual-Core Devices
2.2. Estimating Power While Creating the FPGA Design x
2.2.1. Importing a .qptc File Generated in the Quartus® Prime Power Analyzer
3. Intel® FPGA Power and Thermal Calculator Graphical User Interface x
3.1. Intel® FPGA PTC Select Family Dialog Box 3.2. Intel® FPGA PTC Primary GUI Components 3.3. Intel® FPGA PTC - IP Wizard 3.4. Intel® FPGA PTC Searchable Drop-Down Lists 3.5. Deleting Rows from Data Entry Pages 3.6. Finding Resources Using the Find Dialog Box
3.2. Intel® FPGA PTC Primary GUI Components x
3.2.1. Intel® FPGA PTC Data Entry Pages 3.2.2. Intel® FPGA PTC Design Hierarchy 3.2.3. Intel® FPGA PTC IP Power Summary 3.2.4. Intel® FPGA PTC Field Types 3.2.5. Intel® FPGA PTC Data Entry Error Messages
3.2.2. Intel® FPGA PTC Design Hierarchy x
3.2.2.1. Using Design Hierarchies in the Intel® FPGA Power and Thermal Calculator 3.2.2.2. Entering Hierarchy Information Into the Intel® FPGA PTC 3.2.2.3. Exporting, Importing, Duplicating, Renaming, and Deleting Hierarchies in the Intel® FPGA PTC 3.2.2.4. Bulk Editing Hierarchies in the Intel FPGA PTC
3.2.4. Intel® FPGA PTC Field Types x
3.2.4.1. Intel® FPGA PTC Input Field Dependencies
4. Intel® FPGA Power and Thermal Calculator Pages x
4.1. Intel® FPGA PTC - Power Summary/Navigation 4.2. Intel® FPGA PTC - Common Page Elements 4.3. Intel® FPGA PTC - Main Page 4.4. Intel® FPGA PTC - Logic Page 4.5. Intel® FPGA PTC - RAM Page 4.6. Intel® FPGA PTC - DSP Page 4.7. Intel® FPGA PTC - Clock Page 4.8. Intel® FPGA PTC - PLL Page 4.9. Intel® FPGA PTC - I/O Page 4.10. Intel® FPGA PTC - Transceiver Page 4.11. Intel® FPGA PTC - HPS Page 4.12. Intel® FPGA PTC - Crypto Page 4.13. Intel FPGA PTC - NOC Page 4.14. Intel® FPGA PTC - HBM Page 4.15. Intel® FPGA PTC - Thermal Page 4.16. Intel® FPGA PTC - Report Page
4.3. Intel® FPGA PTC - Main Page x
4.3.1. Intel® FPGA PTC - Device Selection and Thermal Analysis Windows
4.10. Intel® FPGA PTC - Transceiver Page x
4.10.1. Estimating E-Tile Channel PLL Power with the Intel Power and Thermal Calculator
5. Factors Affecting the Accuracy of the Intel® FPGA PTC x
5.1. Toggle Rate 5.2. I/O Bank Allocation
Answers to Top FAQs
1. Overview of the Intel® FPGA Power and Thermal Calculator
2. Estimating Power Consumption with the Intel® FPGA Power and Thermal Calculator
3. Intel® FPGA Power and Thermal Calculator Graphical User Interface
4. Intel® FPGA Power and Thermal Calculator Pages
5. Factors Affecting the Accuracy of the Intel® FPGA PTC
6. Intel® FPGA Power and Thermal Calculator User Guide Archive
7. Document Revision History for the Intel® FPGA Power and Thermal Calculator User Guide
A. Measuring Static Power

5.2. I/O Bank Allocation

The I/O Bank Allocation feature in the Intel® FPGA Power and Thermal Calculator (PTC) is available for Agilex™ 7 devices, and ensures that I/O banks are correctly allocated for proper calculation of thermals.

The Intel® FPGA PTC does not allocate power of I/O elements in the FPGA core die uniformly; rather, power contributions of I/O elements are allocated according to their physical locations in the die. The thermal solver uses this power allocation to calculate the temperature map of the die.

If the I/O bank locations are not specified correctly, the power of I/O elements may get allocated incorrectly, to a single bank or to the wrong banks. In such scenarios, the thermal solver still produces a result; however, due to the increased power density, a hot spot may incorrectly occur in the I/O section and erroneously increase the maximum thermals.

The I/O Bank Allocation feature allows you to specify location of I/O elements to banks, thus ensuring that power contributions of I/O banks are allocated correctly, and that there is no miscalculation of thermals.

Related Information
Level Two Title