Early Power Estimator User Guide

Download PDF
ID 683272
Date 7/16/2021
Public
Document Table of Contents
Document Table of Contents x
1. Early Power Estimator Overview 2. Setting Up the Early Power Estimator 3. Early Power Estimator Worksheets 4. Factors Affecting the Early Power Estimator Spreadsheet Accuracy A. Additional Information for Early Power Estimator User Guide
1. Early Power Estimator Overview x
1.1. Release Information 1.2. Power Model Status for Supported Device Families
2. Setting Up the Early Power Estimator x
2.1. System Requirements 2.2. Download and Install the Early Power Estimator 2.3. Estimating Power Consumption
2.2. Download and Install the Early Power Estimator x
2.2.1. Changing the Macro Security Level in Microsoft Excel 2003 2.2.2. Changing the Macro Security Level in Microsoft Excel 2007 2.2.3. Changing the Macro Security Level in Microsoft Excel 2010
2.3. Estimating Power Consumption x
2.3.1. Estimating Power Consumption Before Starting the FPGA Design 2.3.2. Estimating Power Consumption While Creating the FPGA Design 2.3.3. Estimating Power Consumption After Completing the FPGA Design
2.3.1. Estimating Power Consumption Before Starting the FPGA Design x
2.3.1.1. Entering Information into the Early Power Estimator
2.3.1.1. Entering Information into the Early Power Estimator x
2.3.1.1.1. Manually Entering Values
2.3.2. Estimating Power Consumption While Creating the FPGA Design x
2.3.2.1. Importing a File
2.3.2.1. Importing a File x
2.3.2.1.1. Generate the EPE File 2.3.2.1.2. Import Data into the EPE Spreadsheet
3. Early Power Estimator Worksheets x
3.1. Main Worksheet 3.2. Logic Worksheet 3.3. RAM Worksheet 3.4. DSP Worksheet 3.5. I/O Worksheet 3.6. PLL Worksheet 3.7. Clock Worksheet 3.8. HSDI Worksheet 3.9. XCVR Worksheet 3.10. HMC Worksheet 3.11. IP Worksheet 3.12. HPS Worksheet 3.13. Report Worksheet 3.14. Enpirion Worksheet
3.1. Main Worksheet x
3.1.1. Input Parameter 3.1.2. Thermal Power 3.1.3. Power Tree Design 3.1.4. Thermal Analysis
3.1.4. Thermal Analysis x
3.1.4.1. Not Using a Heat Sink 3.1.4.2. Using a Heat Sink
3.13. Report Worksheet x
3.13.1. Static Power and Dynamic Current per Voltage Rail 3.13.2. Power Up Current 3.13.3. Power Breakout for Multiple Voltage Supplies 3.13.4. Power Regulator Settings
4. Factors Affecting the Early Power Estimator Spreadsheet Accuracy x
4.1. Toggle Rate 4.2. Airflow 4.3. Temperature 4.4. Heat Sink
A. Additional Information for Early Power Estimator User Guide x
A.1. Document Revision History for Early Power Estimator User Guide
1. Early Power Estimator Overview
2. Setting Up the Early Power Estimator
3. Early Power Estimator Worksheets
4. Factors Affecting the Early Power Estimator Spreadsheet Accuracy
A. Additional Information for Early Power Estimator User Guide

3.1.4. Thermal Analysis

The following figure shows the Thermal Analysis section in the Main worksheet, including the junction temperature (TJ), total junction-to-ambient thermal resistance (θJA), and the maximum allowed ambient temperature (TA) values. For details about the values of the thermal parameters not listed in this user guide, click the Details button.

Figure 5. Thermal Analysis Section of the EPE Spreadsheet
Table 5.  Thermal Analysis Section Information
Column Heading Description
Junction Temp, TJ (°C)

The device junction temperature estimation based on supplied thermal parameters.

The junction temperature is determined by dissipating the total thermal power through the top of the chip and through the board (if selected). For detailed calculations, click the Details button.

θJA Junction-Ambient

The junction-to-ambient thermal resistance between the device and ambient air (in °C/W).

Represents the increase in temperature between ambient and junction for every W of additional power dissipation.

Maximum Allowed TA (°C) A guideline for the maximum ambient temperature (in °C) that you can subject the device to without violating the maximum junction temperature, based on the supplied cooling solution and device temperature grade.

You can directly enter or automatically compute the junction temperature based on the information provided. To enter the junction temperature, select User Entered T in the Input Parameters section. To automatically compute the junction temperature, select Auto Computed T in the Input Parameters section.

When automatically computing the junction temperature, the ambient temperature, airflow, heat sink solution, and board thermal model of the device determine the junction temperature in °C. Junction temperature is the estimated operating junction temperature based on your device and thermal conditions.

You can consider the device as a heat source and the junction temperature is the temperature of the device. While the temperature typically varies across the device, to simplify the analysis, you can assume that the temperature of the device is constant regardless of where it is measured.

Power from the device can be dissipated through different paths. Different paths become significant depending on the thermal properties of the system. The significance of power dissipation paths vary depending on whether or not a heat sink is used for the device.


Section Content
Not Using a Heat Sink
Using a Heat Sink

Level Two Title