Intel® Programmable Acceleration Card (PAC) with Intel® Arria® 10 GX FPGA Data Sheet

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ID 683226
Date 10/26/2020
Public
Document Table of Contents
Document Table of Contents x
1. Introduction 2. Overview 3. System Compatibility 4. Mechanical Information 5. Thermal Specifications 6. FPGA Interface Manager 7. Board Management Controller 8. PLDM Commands for the Board Management Controller A. Regulatory Information B. References C. Revision History
2. Overview x
2.1. Views of the Intel® PAC with Intel® Arria® 10 GX FPGA 2.2. Overview of Product Features
2.2. Overview of Product Features x
2.2.1. Intel® Arria® 10 GX FPGA 2.2.2. On-Board Memory 2.2.3. Interfaces and Dimensions 2.2.4. Software 2.2.5. Power 2.2.6. CPLD 2.2.7. QSFP+ 2.2.8. Control and Support
2.2.8. Control and Support x
2.2.8.1. PCIe Overview 2.2.8.2. Board Management Controller Overview
4. Mechanical Information x
4.1. Air Duct Disassembly
5. Thermal Specifications x
5.1. Thermal Test Performance Results
6. FPGA Interface Manager x
6.1. Updating the FIM
7. Board Management Controller x
7.1. Features 7.2. Device Peripheral Table 7.3. Updating the BMC Configuration and Firmware
7.1. Features x
7.1.1. BMC Voltage and Thermal Handling
8. PLDM Commands for the Board Management Controller x
8.1. I2C/SMBus Address 8.2. Supported SMBus Commands 8.3. Supported MCTP Commands 8.4. Supported PLDM Commands 8.5. Defined Platform Descriptor Records 8.6. Sensor and Threshold Information
8.3. Supported MCTP Commands x
8.3.1. MCTP Control Messages
8.4. Supported PLDM Commands x
8.4.1. PLDM Base Specification Commands 8.4.2. PLDM for Platform Monitoring and Control Specification Commands
1. Introduction
2. Overview
3. System Compatibility
4. Mechanical Information
5. Thermal Specifications
6. FPGA Interface Manager
7. Board Management Controller
8. PLDM Commands for the Board Management Controller
A. Regulatory Information
B. References
C. Revision History

5. Thermal Specifications

This acceleration card is thermally limited to dissipate no more than 45 W on the FPGA. FPGA junction temperature must not exceed 95°C. Make sure the temperature of the QSFP+ module is within the vendor specification, usually 70°C or 85°C.

  • Operating Temperature: 95 °C
  • Shutdown Temperature: 100 °C
Refer to the Power Estimator Guide to avoid exceeding 95 °C. Refer to AN 872: Thermal and Power Guidelines: For Intel Programmable Acceleration Card with Intel Arria 10 GX FPGA to verify and ensure that the AFU operates within the power supported by the Intel® PAC with Intel® Arria® 10 GX FPGA.

AFU Developers should use the Arria 10 PowerPlay Early Power Estimator and the Intel® Quartus® Prime Power Analyzer to estimate power consumption.

Figure 8. Airflow Pattern

Section Content
Thermal Test Performance Results

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