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Ixiasoft
2.2.5. Power
- 66 W Thermal Design Power (TDP)
- The TDP is based on the max current, per the PCIe specification, of 5.5A on the 12V rail.
- As the developers or solution provider, you must ensure that the AFU does not exceed this limit or the limit provided by the qualified server vendor. Functionality and reliability of the server is not supported for AFUs that exceed the specification.
- Up to 45 W FPGA power consumption
- The PAC source power is from the 12V rail of the PCIe* edge connector. The PAC does not draw power from the 3.3V rail.