AN 763: Intel® Arria® 10 SoC Device Design Guidelines

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ID 683192
Date 5/17/2022
Public
Document Table of Contents
Document Table of Contents x
1. Overview of Design Guidelines for Intel® Arria® 10 SoC FPGAs 2. Guidelines for Interconnecting the Intel® Arria® 10 HPS and FPGA 3. Design Guidelines for HPS Portion of Arria 10 SoC FPGAs 4. Board Design Guidelines for Arria 10 SoC FPGAs 5. Embedded Software Design Guidelines for Arria 10 SoC FPGAs
1. Overview of Design Guidelines for Intel® Arria® 10 SoC FPGAs x
1.1. SoC FPGA Designer's Checklist 1.2. Overview of HPS Design Guidelines for SoC FPGA design 1.3. Overview of Board Design Guidelines for SoC FPGA Design 1.4. Overview of Embedded Software Design Guidelines for SoC FPGA Design 1.5. Overview of Design Guidelines for Intel® Arria® 10 SoC FPGAs Revision History
2. Guidelines for Interconnecting the Intel® Arria® 10 HPS and FPGA x
2.1. Overview of HPS Memory-Mapped Interfaces 2.2. Recommended System Topologies 2.3. Guidelines for Interconnecting the Intel® Arria® 10 HPS and FPGA Revision History
2.1. Overview of HPS Memory-Mapped Interfaces x
2.1.1. HPS-to-FPGA Bridge 2.1.2. Lightweight HPS-to-FPGA Bridge 2.1.3. FPGA-to-HPS Bridge 2.1.4. FPGA-to-SDRAM Ports 2.1.5. Interface Bandwidths
2.2. Recommended System Topologies x
2.2.1. HPS Accesses to FPGA Fabric 2.2.2. Maintaining Cache Coherency 2.2.3. MPU Sharing Data with FPGA 2.2.4. Examples of Cacheable and Non-Cacheable Data Accesses From the FPGA
2.2.4. Examples of Cacheable and Non-Cacheable Data Accesses From the FPGA x
2.2.4.1. Example 1: FPGA Reading Data from HPS SDRAM Directly 2.2.4.2. Example 2: FPGA Writing Data into HPS SDRAM Directly 2.2.4.3. Example 3: FPGA Reading Cache Coherent Data from HPS 2.2.4.4. Example 4: FPGA Writing Cache Coherent Data to HPS
3. Design Guidelines for HPS Portion of Arria 10 SoC FPGAs x
3.1. Start your SoC FPGA design here 3.2. Design Considerations for Connecting Device I/O to HPS Peripherals and Memory 3.3. HPS Clocking and Reset Design Considerations 3.4. HPS EMIF Design Considerations 3.5. DMA Considerations 3.6. Design Guidelines for HPS Portion of Intel® Arria® 10 SoC FPGAs Revision History
3.1. Start your SoC FPGA design here x
3.1.1. Recommended Starting Point for HPS-to-FPGA Interface Designs 3.1.2. Determining your SoC FPGA Topology
3.2. Design Considerations for Connecting Device I/O to HPS Peripherals and Memory x
3.2.1. HPS Pin Multiplexing Design Considerations 3.2.2. HPS I/O Settings: Constraints and Drive Strengths
3.3. HPS Clocking and Reset Design Considerations x
3.3.1. HPS Clock Planning 3.3.2. Early Pin Planning and I/O Assignment Analysis 3.3.3. Pin Features and Connections for HPS Clocks, Reset and PoR 3.3.4. Internal Clocks 3.3.5. HPS Reset During FPGA Reconfiguration and FPGA Configuration Failures 3.3.6. HPS Peripheral Reset Management
3.4. HPS EMIF Design Considerations x
3.4.1. Considerations for Connecting HPS to SDRAM 3.4.2. HPS SDRAM I/O Locations 3.4.3. Integrating the Arria 10 HPS EMIF with the SoC FPGA Device 3.4.4. HPS Memory Debug
3.4.2. HPS SDRAM I/O Locations x
3.4.2.1. I/O Bank 2K, Lanes 0,1,2 (Addr/Cmd) 3.4.2.2. I/O Bank 2K, Lane 3 (ECC) 3.4.2.3. I/O Bank, 2J (Data) 3.4.2.4. I/O Bank, 2I (Data, 64-, 72-bit interfaces)
3.5. DMA Considerations x
3.5.1. Choosing a DMA Controller 3.5.2. Optimizing DMA Master Bandwidth through HPS Interconnect
4. Board Design Guidelines for Arria 10 SoC FPGAs x
4.1. Power On Board Bring Up and Boot ROM/Boot Loader Debugging 4.2. FPGA Reconfiguration 4.3. HPS Power Design Considerations 4.4. Boundary Scan for HPS 4.5. Design Guidelines for HPS Interfaces 4.6. Connection Guidelines for Unused HPS Block 4.7. Board Design Guidelines for Intel® Arria® 10 SoC FPGAs Revision History
4.2. FPGA Reconfiguration x
4.2.1. Flash Update with HPS Reboot 4.2.2. Partial Reconfiguration of the SoC FPGA
4.3. HPS Power Design Considerations x
4.3.1. Early System and Board Planning 4.3.2. Design Considerations for HPS and FPGA Power Supplies for SoC FPGA devices 4.3.3. Pin Connection Considerations for Board Designs 4.3.4. Power Analysis 4.3.5. Power Optimization
4.3.1. Early System and Board Planning x
4.3.1.1. Early Power Estimation
4.3.1.1. Early Power Estimation x
4.3.1.1.1. Main Worksheet 4.3.1.1.2. IO Worksheet 4.3.1.1.3. IO-IP Worksheet 4.3.1.1.4. HPS Worksheet
4.3.2. Design Considerations for HPS and FPGA Power Supplies for SoC FPGA devices x
4.3.2.1. Consider Device Power Consumption and HPS Performance 4.3.2.2. Consider Desired HPS Boot Clock Frequency
4.3.3. Pin Connection Considerations for Board Designs x
4.3.3.1. Device Power-Up 4.3.3.2. Power Pin Connections and Power Supplies
4.3.5. Power Optimization x
4.3.5.1. Processor and Memory Clock Speeds 4.3.5.2. MPU Standby Modes and Dynamic Clock Gating 4.3.5.3. Managing Peripheral Power 4.3.5.4. Managing Power by Shutting Down Supplies
4.5. Design Guidelines for HPS Interfaces x
4.5.1. HPS EMAC PHY Interfaces 4.5.2. USB Interface Design Guidelines 4.5.3. QSPI Flash Interface Design Guidelines 4.5.4. SD/MMC and eMMC Card Interface Design Guidelines 4.5.5. Provide Flash Memory Reset for QSPI and SD/MMC/eMMC 4.5.6. NAND Flash Interface Design Guidelines 4.5.7. UART Interface Design Guidelines 4.5.8. I2C Interface Design Guidelines
4.5.1. HPS EMAC PHY Interfaces x
4.5.1.1. PHY Interfaces Connected Through Shared I/O 4.5.1.2. PHY Interfaces Connected Through FPGA I/O 4.5.1.3. MDIO 4.5.1.4. Common PHY Interface Design Considerations
4.5.1.1. PHY Interfaces Connected Through Shared I/O x
4.5.1.1.1. RMII 4.5.1.1.2. RGMII
4.5.1.2. PHY Interfaces Connected Through FPGA I/O x
4.5.1.2.1. GMII/MII GUIDELINE: Apply timing constraints and verify timing with Timing Analyzer. GUIDELINE: Register interface I/O at the FPGA I/O boundary. GUIDELINE: Consider transmit timing in MII mode. 4.5.1.2.2. Adapting to RMII 4.5.1.2.3. Adapting to SGMII
4.5.1.4. Common PHY Interface Design Considerations x
4.5.1.4.1. Signal Integrity
5. Embedded Software Design Guidelines for Arria 10 SoC FPGAs x
5.1. Embedded Software for HPS Design Guidelines 5.2. Support and Documentation 5.3. Embedded Software Design Guidelines for Intel® Arria® 10 SoC FPGAs Revision History
5.1. Embedded Software for HPS Design Guidelines x
5.1.1. Purpose 5.1.2. Assembling the components of your Software Development Platform 5.1.3. Selecting an Operating System for your application 5.1.4. Assembling your Software Development Platform for Linux 5.1.5. Assembling your Software Development Platform for a Bare-Metal Application 5.1.6. Assembling your Software Development Platform for Partner OS or RTOS 5.1.7. Choosing Boot Loader Software 5.1.8. Selecting Software Tools for Development, Debug and Trace 5.1.9. Board Bring Up Considerations 5.1.10. Boot and Configuration Design Considerations 5.1.11. Flash Device Driver Design Considerations 5.1.12. HPS ECC Design Considerations 5.1.13. Security Design Considerations 5.1.14. Embedded Software Debugging and Trace
5.1.2. Assembling the components of your Software Development Platform x
5.1.2.1. Golden Hardware Reference Design (GHRD)
5.1.3. Selecting an Operating System for your application x
5.1.3.1. Using Linux or RTOS 5.1.3.2. Developing a Bare-Metal Application 5.1.3.3. Using the Bootloader as a Bare-Metal Framework 5.1.3.4. Using Symmetrical vs. Asymmetrical Multiprocessing (SMP vs. AMP) Modes
5.1.4. Assembling your Software Development Platform for Linux x
5.1.4.1. Golden System Reference Design (GSRD) for Linux 5.1.4.2. GSRD for Linux Build Flow 5.1.4.3. Source Code Management Considerations 5.1.4.4. Linux Device Tree Design Considerations
5.1.8. Selecting Software Tools for Development, Debug and Trace x
5.1.8.1. Selecting Software Build Tools 5.1.8.2. Selecting Software Debug Tools 5.1.8.3. Selecting Software Trace Tools
5.1.9. Board Bring Up Considerations x
5.1.9.1. Plan the SDRAM Initialization
5.1.10. Boot and Configuration Design Considerations x
5.1.10.1. Boot Design Considerations 5.1.10.2. Configuration
5.1.10.1. Boot Design Considerations x
5.1.10.1.1. Boot Source 5.1.10.1.2. Select Desired Flash Device 5.1.10.1.3. BSEL Options 5.1.10.1.4. Boot Clock 5.1.10.1.5. Determine Boot Fuses Usage 5.1.10.1.6. CSEL Options 5.1.10.1.7. Determine Flash Programming Method 5.1.10.1.8. Selecting NAND Flash Devices 5.1.10.1.9. Selecting QSPI Flash Devices 5.1.10.1.10. Reference Materials
5.1.10.2. Configuration x
5.1.10.2.1. Traditional Configuration 5.1.10.2.2. HPS-Initiated Configuration
5.1.12. HPS ECC Design Considerations x
5.1.12.1. General ECC Design Considerations 5.1.12.2. ECC for External SDRAM Interface 5.1.12.3. ECC for L2 Cache Data Memory 5.1.12.4. ECC for Flash Memory
5.2. Support and Documentation x
5.2.1. Support 5.2.2. Hardware Documentation 5.2.3. Software Documentation
5.2.3. Software Documentation x
5.2.3.1. Example of Prebuilt Bootloaders for the Intel® Arria® 10 SoC Development Kit
1. Overview of Design Guidelines for Intel® Arria® 10 SoC FPGAs
2. Guidelines for Interconnecting the Intel® Arria® 10 HPS and FPGA
3. Design Guidelines for HPS Portion of Arria 10 SoC FPGAs
4. Board Design Guidelines for Arria 10 SoC FPGAs
5. Embedded Software Design Guidelines for Arria 10 SoC FPGAs

4.5.1.2.1. GMII/MII

GMII and MII are only available in Intel® Arria® 10 by driving the EMAC signals into the FPGA core routing logic instead of the Shared I/O, then ultimately to FPGA I/O pins or to internal registers in the FPGA core.

GUIDELINE: Apply timing constraints and verify timing with Timing Analyzer.

Because routing delays can vary widely in the FPGA core and I/O structures, it is important to read the timing reports, and especially for GMII, create timing constraints. GMII has a 125 MHz clock and is single data rate unlike RGMII. GMII does not have the same considerations for CLK-to-DATA skew though; its signals are automatically centered by design by being launched with the negative edge and captured with the rising edge.

GUIDELINE: Register interface I/O at the FPGA I/O boundary.

With core and I/O delays easily exceeding 8 ns, Intel® recommends to register these buses in each direction in I/O Element (IOE) registers, so they remain aligned as they travel across the core FPGA logic fabric. On the transmit data and control, maintain the clock-to-data/control relationship by latching these signals on the falling edge of the emac[0,1,2]_gtx_clk output from the HPS EMAC. Latch the receive data and control at the FPGA I/O inputs on the rising edge of the RX_CLK sourced by the PHY.

GUIDELINE: Consider transmit timing in MII mode.

MII is 25 MHz when the PHY is in 100 Mbps mode and 2.5 MHz when the PHY is in 10 Mbps mode, so the shortest clock period is 40 ns. The PHY sources the clock for both transmit and receive directions. Because the transmit timing is relative to the TX_CLK clock provided by the PHY, the turnaround time may be of concern, but this is usually not an issue due to the long 40 ns clock period.

Since the reference clock is transmitted through the FPGA, then out for the data – the round-trip delay must be less than 25 ns as there is a 15 ns input setup time. Note that the transmit data and control are launched into the FPGA fabric by the HPS EMAC transmit path logic on the negative edge of the PHY-sourced TX_CLK, which removes 20 ns of the 40 ns clock-to-setup timing budget.

With the round-trip clock path delay on the data arrival timing incurring PHY-to-SoC board propagation delay plus the internal path delay from the SoC pin to and through the HPS EMAC transmit clock mux taking away from the remaining 20 ns setup timing budget, it may be necessary to retime the transmit data and control to the rising edge of the phy_txclk_o clock output registers in the FPGA fabric for MII mode transmit data and control.

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