AN 763: Intel® Arria® 10 SoC Device Design Guidelines

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ID 683192
Date 5/17/2022
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Document Table of Contents
Document Table of Contents x
1. Overview of Design Guidelines for Intel® Arria® 10 SoC FPGAs 2. Guidelines for Interconnecting the Intel® Arria® 10 HPS and FPGA 3. Design Guidelines for HPS Portion of Arria 10 SoC FPGAs 4. Board Design Guidelines for Arria 10 SoC FPGAs 5. Embedded Software Design Guidelines for Arria 10 SoC FPGAs
1. Overview of Design Guidelines for Intel® Arria® 10 SoC FPGAs x
1.1. SoC FPGA Designer's Checklist 1.2. Overview of HPS Design Guidelines for SoC FPGA design 1.3. Overview of Board Design Guidelines for SoC FPGA Design 1.4. Overview of Embedded Software Design Guidelines for SoC FPGA Design 1.5. Overview of Design Guidelines for Intel® Arria® 10 SoC FPGAs Revision History
2. Guidelines for Interconnecting the Intel® Arria® 10 HPS and FPGA x
2.1. Overview of HPS Memory-Mapped Interfaces 2.2. Recommended System Topologies 2.3. Guidelines for Interconnecting the Intel® Arria® 10 HPS and FPGA Revision History
2.1. Overview of HPS Memory-Mapped Interfaces x
2.1.1. HPS-to-FPGA Bridge 2.1.2. Lightweight HPS-to-FPGA Bridge 2.1.3. FPGA-to-HPS Bridge 2.1.4. FPGA-to-SDRAM Ports 2.1.5. Interface Bandwidths
2.2. Recommended System Topologies x
2.2.1. HPS Accesses to FPGA Fabric 2.2.2. Maintaining Cache Coherency 2.2.3. MPU Sharing Data with FPGA 2.2.4. Examples of Cacheable and Non-Cacheable Data Accesses From the FPGA
2.2.4. Examples of Cacheable and Non-Cacheable Data Accesses From the FPGA x
2.2.4.1. Example 1: FPGA Reading Data from HPS SDRAM Directly 2.2.4.2. Example 2: FPGA Writing Data into HPS SDRAM Directly 2.2.4.3. Example 3: FPGA Reading Cache Coherent Data from HPS 2.2.4.4. Example 4: FPGA Writing Cache Coherent Data to HPS
3. Design Guidelines for HPS Portion of Arria 10 SoC FPGAs x
3.1. Start your SoC FPGA design here 3.2. Design Considerations for Connecting Device I/O to HPS Peripherals and Memory 3.3. HPS Clocking and Reset Design Considerations 3.4. HPS EMIF Design Considerations 3.5. DMA Considerations 3.6. Design Guidelines for HPS Portion of Intel® Arria® 10 SoC FPGAs Revision History
3.1. Start your SoC FPGA design here x
3.1.1. Recommended Starting Point for HPS-to-FPGA Interface Designs 3.1.2. Determining your SoC FPGA Topology
3.2. Design Considerations for Connecting Device I/O to HPS Peripherals and Memory x
3.2.1. HPS Pin Multiplexing Design Considerations 3.2.2. HPS I/O Settings: Constraints and Drive Strengths
3.3. HPS Clocking and Reset Design Considerations x
3.3.1. HPS Clock Planning 3.3.2. Early Pin Planning and I/O Assignment Analysis 3.3.3. Pin Features and Connections for HPS Clocks, Reset and PoR 3.3.4. Internal Clocks 3.3.5. HPS Reset During FPGA Reconfiguration and FPGA Configuration Failures 3.3.6. HPS Peripheral Reset Management
3.4. HPS EMIF Design Considerations x
3.4.1. Considerations for Connecting HPS to SDRAM Instantiating the Intel® Arria® 10 HPS EMIF IP GUIDELINE: Instantiate the " Intel® Arria® 10 External Memory Interfaces for HPS" IP in Platform Designer. GUIDELINE: Connect the hps_emif conduit to the HPS component GUIDELINE: Make sure the HPS EMIF IP block is not reset while the HPS is accessing external SDRAM or resources in the L3 SDRAM Interconnect. GUIDELINE: Ensure that the HPS memory controller Data Mask (DM) pins are enabled. GUIDELINE: Ensure that you choose only DDR3 or DDR4 components or modules in configurations that are supported by the Arria 10 EMIF for HPS IP and your specific device/package combination. 3.4.2. HPS SDRAM I/O Locations 3.4.3. Integrating the Arria 10 HPS EMIF with the SoC FPGA Device 3.4.4. HPS Memory Debug
3.4.2. HPS SDRAM I/O Locations x
3.4.2.1. I/O Bank 2K, Lanes 0,1,2 (Addr/Cmd) 3.4.2.2. I/O Bank 2K, Lane 3 (ECC) 3.4.2.3. I/O Bank, 2J (Data) 3.4.2.4. I/O Bank, 2I (Data, 64-, 72-bit interfaces)
3.5. DMA Considerations x
3.5.1. Choosing a DMA Controller 3.5.2. Optimizing DMA Master Bandwidth through HPS Interconnect
4. Board Design Guidelines for Arria 10 SoC FPGAs x
4.1. Power On Board Bring Up and Boot ROM/Boot Loader Debugging 4.2. FPGA Reconfiguration 4.3. HPS Power Design Considerations 4.4. Boundary Scan for HPS 4.5. Design Guidelines for HPS Interfaces 4.6. Connection Guidelines for Unused HPS Block 4.7. Board Design Guidelines for Intel® Arria® 10 SoC FPGAs Revision History
4.2. FPGA Reconfiguration x
4.2.1. Flash Update with HPS Reboot 4.2.2. Partial Reconfiguration of the SoC FPGA
4.3. HPS Power Design Considerations x
4.3.1. Early System and Board Planning 4.3.2. Design Considerations for HPS and FPGA Power Supplies for SoC FPGA devices 4.3.3. Pin Connection Considerations for Board Designs 4.3.4. Power Analysis 4.3.5. Power Optimization
4.3.1. Early System and Board Planning x
4.3.1.1. Early Power Estimation
4.3.1.1. Early Power Estimation x
4.3.1.1.1. Main Worksheet 4.3.1.1.2. IO Worksheet 4.3.1.1.3. IO-IP Worksheet 4.3.1.1.4. HPS Worksheet
4.3.2. Design Considerations for HPS and FPGA Power Supplies for SoC FPGA devices x
4.3.2.1. Consider Device Power Consumption and HPS Performance 4.3.2.2. Consider Desired HPS Boot Clock Frequency
4.3.3. Pin Connection Considerations for Board Designs x
4.3.3.1. Device Power-Up 4.3.3.2. Power Pin Connections and Power Supplies
4.3.5. Power Optimization x
4.3.5.1. Processor and Memory Clock Speeds 4.3.5.2. MPU Standby Modes and Dynamic Clock Gating 4.3.5.3. Managing Peripheral Power 4.3.5.4. Managing Power by Shutting Down Supplies
4.5. Design Guidelines for HPS Interfaces x
4.5.1. HPS EMAC PHY Interfaces 4.5.2. USB Interface Design Guidelines 4.5.3. QSPI Flash Interface Design Guidelines 4.5.4. SD/MMC and eMMC Card Interface Design Guidelines 4.5.5. Provide Flash Memory Reset for QSPI and SD/MMC/eMMC 4.5.6. NAND Flash Interface Design Guidelines 4.5.7. UART Interface Design Guidelines 4.5.8. I2C Interface Design Guidelines
4.5.1. HPS EMAC PHY Interfaces x
4.5.1.1. PHY Interfaces Connected Through Shared I/O 4.5.1.2. PHY Interfaces Connected Through FPGA I/O 4.5.1.3. MDIO 4.5.1.4. Common PHY Interface Design Considerations
4.5.1.1. PHY Interfaces Connected Through Shared I/O x
4.5.1.1.1. RMII 4.5.1.1.2. RGMII
4.5.1.2. PHY Interfaces Connected Through FPGA I/O x
4.5.1.2.1. GMII/MII 4.5.1.2.2. Adapting to RMII 4.5.1.2.3. Adapting to SGMII
4.5.1.4. Common PHY Interface Design Considerations x
4.5.1.4.1. Signal Integrity
5. Embedded Software Design Guidelines for Arria 10 SoC FPGAs x
5.1. Embedded Software for HPS Design Guidelines 5.2. Support and Documentation 5.3. Embedded Software Design Guidelines for Intel® Arria® 10 SoC FPGAs Revision History
5.1. Embedded Software for HPS Design Guidelines x
5.1.1. Purpose 5.1.2. Assembling the components of your Software Development Platform 5.1.3. Selecting an Operating System for your application 5.1.4. Assembling your Software Development Platform for Linux 5.1.5. Assembling your Software Development Platform for a Bare-Metal Application 5.1.6. Assembling your Software Development Platform for Partner OS or RTOS 5.1.7. Choosing Boot Loader Software 5.1.8. Selecting Software Tools for Development, Debug and Trace 5.1.9. Board Bring Up Considerations 5.1.10. Boot and Configuration Design Considerations 5.1.11. Flash Device Driver Design Considerations 5.1.12. HPS ECC Design Considerations 5.1.13. Security Design Considerations 5.1.14. Embedded Software Debugging and Trace
5.1.2. Assembling the components of your Software Development Platform x
5.1.2.1. Golden Hardware Reference Design (GHRD)
5.1.3. Selecting an Operating System for your application x
5.1.3.1. Using Linux or RTOS 5.1.3.2. Developing a Bare-Metal Application 5.1.3.3. Using the Bootloader as a Bare-Metal Framework 5.1.3.4. Using Symmetrical vs. Asymmetrical Multiprocessing (SMP vs. AMP) Modes
5.1.4. Assembling your Software Development Platform for Linux x
5.1.4.1. Golden System Reference Design (GSRD) for Linux 5.1.4.2. GSRD for Linux Build Flow 5.1.4.3. Source Code Management Considerations 5.1.4.4. Linux Device Tree Design Considerations
5.1.8. Selecting Software Tools for Development, Debug and Trace x
5.1.8.1. Selecting Software Build Tools 5.1.8.2. Selecting Software Debug Tools 5.1.8.3. Selecting Software Trace Tools
5.1.9. Board Bring Up Considerations x
5.1.9.1. Plan the SDRAM Initialization
5.1.10. Boot and Configuration Design Considerations x
5.1.10.1. Boot Design Considerations 5.1.10.2. Configuration
5.1.10.1. Boot Design Considerations x
5.1.10.1.1. Boot Source 5.1.10.1.2. Select Desired Flash Device 5.1.10.1.3. BSEL Options 5.1.10.1.4. Boot Clock 5.1.10.1.5. Determine Boot Fuses Usage 5.1.10.1.6. CSEL Options 5.1.10.1.7. Determine Flash Programming Method 5.1.10.1.8. Selecting NAND Flash Devices 5.1.10.1.9. Selecting QSPI Flash Devices 5.1.10.1.10. Reference Materials
5.1.10.2. Configuration x
5.1.10.2.1. Traditional Configuration 5.1.10.2.2. HPS-Initiated Configuration
5.1.12. HPS ECC Design Considerations x
5.1.12.1. General ECC Design Considerations 5.1.12.2. ECC for External SDRAM Interface 5.1.12.3. ECC for L2 Cache Data Memory 5.1.12.4. ECC for Flash Memory
5.2. Support and Documentation x
5.2.1. Support 5.2.2. Hardware Documentation 5.2.3. Software Documentation
5.2.3. Software Documentation x
5.2.3.1. Example of Prebuilt Bootloaders for the Intel® Arria® 10 SoC Development Kit
1. Overview of Design Guidelines for Intel® Arria® 10 SoC FPGAs
2. Guidelines for Interconnecting the Intel® Arria® 10 HPS and FPGA
3. Design Guidelines for HPS Portion of Arria 10 SoC FPGAs
4. Board Design Guidelines for Arria 10 SoC FPGAs
5. Embedded Software Design Guidelines for Arria 10 SoC FPGAs

3.4.1. Considerations for Connecting HPS to SDRAM

The hard memory controller for the Intel® Arria® 10 HPS is located in the FPGA I/O columns along with the other hardware memory controllers. The HPS can use only one hard memory controller bank, and it is located closest to the HPS block in I/O bank 2K, is where the address/command and ECC signals reside. Use I/O Bank 2J for 16-bit and 32-bit interface DQ/DQS data group signals. I/O Bank 2I, available only in the KF40 package, is used for 64-bit interface DQ/DQS data group signals for wider. Bank 2I is for the upper 32-bits of 64-bit interfaces.

Instantiating the Intel® Arria® 10 HPS EMIF IP

Connecting external SDRAM to the Intel® Arria® 10 HPS requires the use of an EMIF IP that is specific to the HPS. Follow the below guidelines for properly instantiating and configuring the correct EMIF IP for the HPS.

GUIDELINE: Instantiate the " Intel® Arria® 10 External Memory Interfaces for HPS" IP in Platform Designer.

You must use a specific EMIF IP in Platform Designer to connect the HPS to external SDRAM. This Platform Designer component is named “ Intel® Arria® 10 External Memory Interfaces for HPS” and can be found in the “IP Catalog” pane inPlatform Designer in the “Hard Processor Components” subgroup under the “Processors and Peripherals” group.

During compilation, Intel® Quartus® Prime uses the settings in this IP (memory type, width, timings and others) to generate the calibration algorithm for I/O AUX block. The code is executed during configuration of the device in order to set up and calibrate the HPS EMIF interface.

GUIDELINE: Connect the hps_emif conduit to the HPS component

The hard memory controller connected to the HPS has a dedicated connection that must be connected in Platform Designer. The Intel® Arria® 10 EMIF for HPS IP component exposes this connection through a conduit called hps_emif that must be connected to the HPS component’s “emif” conduit.

Figure 7. HPS Component Connected to the hps_emif

GUIDELINE: Make sure the HPS EMIF IP block is not reset while the HPS is accessing external SDRAM or resources in the L3 SDRAM Interconnect.

Asserting reset to the HPS EMIF IP block should coincide with the HPS reset assertion unless the application is capable of saving and recovering context in co-ordination with HPS EMIF IP reset assertion. This can be achieved by connecting the HPS EMIF reset input to one or a combination of resets from the following sources: HPS reset outputs (e.g. h2f_reset, h2f_cold_reset), other resets in the system that also source an HPS cold or warm reset input (e.g. HPS_nPOR, HPS_nRST, FPGA-to-HPS cold/warm reset requests).

If the HPS EMIF IP is reset without resetting the HPS as described above, the application must put the L3 SDRAM Interconnect in reset using the brgmodrst register, bit 6 (ddrsch) in the Reset Manager before HPS EMIF IP reset assertion and not release it until after the HPS EMIF IOPLL has locked. Failure to do so can result in locking up the processor on subsequent accesses to external SDRAM or resources in the L3 SDRAM Interconnect.

GUIDELINE: Ensure that the HPS memory controller Data Mask (DM) pins are enabled.

When you instantiate the memory controller in Platform Designer, you must select the checkbox to enable the data mask pins. If this control is not enabled, data corruption occurs any time a master accesses data in SDRAM that is smaller than the native word size of the memory.

GUIDELINE: Ensure that you choose only DDR3 or DDR4 components or modules in configurations that are supported by the Arria 10 EMIF for HPS IP and your specific device/package combination.

Intel® 's External Memory Interface Spec Estimator is a parametric tool that allows you to compare supported external memory interface types, configurations and maximum performance characteristics in Intel® FPGA and SoC devices.
Note: Not all device and package combinations support 64-/72-bit wide interfaces.

For more information about the External Memory Interface Spec Estimator, refer to the External Memory Interface web page on the Intel FPGA website.

For more information, refer to the "External Memory Interfaces in Arria 10 Devices" chapter in the Intel® Arria® 10 Core Fabric and General Purpose I/Os Handbook.

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