AN 763: Intel® Arria® 10 SoC Device Design Guidelines

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ID 683192
Date 5/17/2022
Public
Document Table of Contents
Document Table of Contents x
1. Overview of Design Guidelines for Intel® Arria® 10 SoC FPGAs 2. Guidelines for Interconnecting the Intel® Arria® 10 HPS and FPGA 3. Design Guidelines for HPS Portion of Arria 10 SoC FPGAs 4. Board Design Guidelines for Arria 10 SoC FPGAs 5. Embedded Software Design Guidelines for Arria 10 SoC FPGAs
1. Overview of Design Guidelines for Intel® Arria® 10 SoC FPGAs x
1.1. SoC FPGA Designer's Checklist 1.2. Overview of HPS Design Guidelines for SoC FPGA design 1.3. Overview of Board Design Guidelines for SoC FPGA Design 1.4. Overview of Embedded Software Design Guidelines for SoC FPGA Design 1.5. Overview of Design Guidelines for Intel® Arria® 10 SoC FPGAs Revision History
2. Guidelines for Interconnecting the Intel® Arria® 10 HPS and FPGA x
2.1. Overview of HPS Memory-Mapped Interfaces 2.2. Recommended System Topologies 2.3. Guidelines for Interconnecting the Intel® Arria® 10 HPS and FPGA Revision History
2.1. Overview of HPS Memory-Mapped Interfaces x
2.1.1. HPS-to-FPGA Bridge 2.1.2. Lightweight HPS-to-FPGA Bridge 2.1.3. FPGA-to-HPS Bridge 2.1.4. FPGA-to-SDRAM Ports 2.1.5. Interface Bandwidths
2.2. Recommended System Topologies x
2.2.1. HPS Accesses to FPGA Fabric 2.2.2. Maintaining Cache Coherency 2.2.3. MPU Sharing Data with FPGA 2.2.4. Examples of Cacheable and Non-Cacheable Data Accesses From the FPGA
2.2.4. Examples of Cacheable and Non-Cacheable Data Accesses From the FPGA x
2.2.4.1. Example 1: FPGA Reading Data from HPS SDRAM Directly 2.2.4.2. Example 2: FPGA Writing Data into HPS SDRAM Directly 2.2.4.3. Example 3: FPGA Reading Cache Coherent Data from HPS 2.2.4.4. Example 4: FPGA Writing Cache Coherent Data to HPS
3. Design Guidelines for HPS Portion of Arria 10 SoC FPGAs x
3.1. Start your SoC FPGA design here 3.2. Design Considerations for Connecting Device I/O to HPS Peripherals and Memory 3.3. HPS Clocking and Reset Design Considerations 3.4. HPS EMIF Design Considerations 3.5. DMA Considerations 3.6. Design Guidelines for HPS Portion of Intel® Arria® 10 SoC FPGAs Revision History
3.1. Start your SoC FPGA design here x
3.1.1. Recommended Starting Point for HPS-to-FPGA Interface Designs 3.1.2. Determining your SoC FPGA Topology
3.2. Design Considerations for Connecting Device I/O to HPS Peripherals and Memory x
3.2.1. HPS Pin Multiplexing Design Considerations 3.2.2. HPS I/O Settings: Constraints and Drive Strengths
3.3. HPS Clocking and Reset Design Considerations x
3.3.1. HPS Clock Planning 3.3.2. Early Pin Planning and I/O Assignment Analysis 3.3.3. Pin Features and Connections for HPS Clocks, Reset and PoR 3.3.4. Internal Clocks 3.3.5. HPS Reset During FPGA Reconfiguration and FPGA Configuration Failures 3.3.6. HPS Peripheral Reset Management
3.4. HPS EMIF Design Considerations x
3.4.1. Considerations for Connecting HPS to SDRAM 3.4.2. HPS SDRAM I/O Locations 3.4.3. Integrating the Arria 10 HPS EMIF with the SoC FPGA Device 3.4.4. HPS Memory Debug
3.4.2. HPS SDRAM I/O Locations x
3.4.2.1. I/O Bank 2K, Lanes 0,1,2 (Addr/Cmd) 3.4.2.2. I/O Bank 2K, Lane 3 (ECC) 3.4.2.3. I/O Bank, 2J (Data) 3.4.2.4. I/O Bank, 2I (Data, 64-, 72-bit interfaces)
3.5. DMA Considerations x
3.5.1. Choosing a DMA Controller 3.5.2. Optimizing DMA Master Bandwidth through HPS Interconnect
4. Board Design Guidelines for Arria 10 SoC FPGAs x
4.1. Power On Board Bring Up and Boot ROM/Boot Loader Debugging 4.2. FPGA Reconfiguration 4.3. HPS Power Design Considerations 4.4. Boundary Scan for HPS 4.5. Design Guidelines for HPS Interfaces 4.6. Connection Guidelines for Unused HPS Block 4.7. Board Design Guidelines for Intel® Arria® 10 SoC FPGAs Revision History
4.2. FPGA Reconfiguration x
4.2.1. Flash Update with HPS Reboot 4.2.2. Partial Reconfiguration of the SoC FPGA
4.3. HPS Power Design Considerations x
4.3.1. Early System and Board Planning 4.3.2. Design Considerations for HPS and FPGA Power Supplies for SoC FPGA devices 4.3.3. Pin Connection Considerations for Board Designs 4.3.4. Power Analysis 4.3.5. Power Optimization
4.3.1. Early System and Board Planning x
4.3.1.1. Early Power Estimation
4.3.1.1. Early Power Estimation x
4.3.1.1.1. Main Worksheet 4.3.1.1.2. IO Worksheet 4.3.1.1.3. IO-IP Worksheet 4.3.1.1.4. HPS Worksheet
4.3.2. Design Considerations for HPS and FPGA Power Supplies for SoC FPGA devices x
4.3.2.1. Consider Device Power Consumption and HPS Performance 4.3.2.2. Consider Desired HPS Boot Clock Frequency
4.3.3. Pin Connection Considerations for Board Designs x
4.3.3.1. Device Power-Up 4.3.3.2. Power Pin Connections and Power Supplies
4.3.5. Power Optimization x
4.3.5.1. Processor and Memory Clock Speeds 4.3.5.2. MPU Standby Modes and Dynamic Clock Gating 4.3.5.3. Managing Peripheral Power 4.3.5.4. Managing Power by Shutting Down Supplies
4.5. Design Guidelines for HPS Interfaces x
4.5.1. HPS EMAC PHY Interfaces 4.5.2. USB Interface Design Guidelines 4.5.3. QSPI Flash Interface Design Guidelines 4.5.4. SD/MMC and eMMC Card Interface Design Guidelines 4.5.5. Provide Flash Memory Reset for QSPI and SD/MMC/eMMC 4.5.6. NAND Flash Interface Design Guidelines 4.5.7. UART Interface Design Guidelines 4.5.8. I2C Interface Design Guidelines
4.5.1. HPS EMAC PHY Interfaces x
4.5.1.1. PHY Interfaces Connected Through Shared I/O 4.5.1.2. PHY Interfaces Connected Through FPGA I/O 4.5.1.3. MDIO 4.5.1.4. Common PHY Interface Design Considerations
4.5.1.1. PHY Interfaces Connected Through Shared I/O x
4.5.1.1.1. RMII 4.5.1.1.2. RGMII
4.5.1.2. PHY Interfaces Connected Through FPGA I/O x
4.5.1.2.1. GMII/MII 4.5.1.2.2. Adapting to RMII 4.5.1.2.3. Adapting to SGMII
4.5.1.4. Common PHY Interface Design Considerations x
4.5.1.4.1. Signal Integrity
5. Embedded Software Design Guidelines for Arria 10 SoC FPGAs x
5.1. Embedded Software for HPS Design Guidelines 5.2. Support and Documentation 5.3. Embedded Software Design Guidelines for Intel® Arria® 10 SoC FPGAs Revision History
5.1. Embedded Software for HPS Design Guidelines x
5.1.1. Purpose 5.1.2. Assembling the components of your Software Development Platform 5.1.3. Selecting an Operating System for your application 5.1.4. Assembling your Software Development Platform for Linux 5.1.5. Assembling your Software Development Platform for a Bare-Metal Application 5.1.6. Assembling your Software Development Platform for Partner OS or RTOS 5.1.7. Choosing Boot Loader Software 5.1.8. Selecting Software Tools for Development, Debug and Trace 5.1.9. Board Bring Up Considerations 5.1.10. Boot and Configuration Design Considerations 5.1.11. Flash Device Driver Design Considerations 5.1.12. HPS ECC Design Considerations 5.1.13. Security Design Considerations 5.1.14. Embedded Software Debugging and Trace
5.1.2. Assembling the components of your Software Development Platform x
5.1.2.1. Golden Hardware Reference Design (GHRD)
5.1.3. Selecting an Operating System for your application x
5.1.3.1. Using Linux or RTOS 5.1.3.2. Developing a Bare-Metal Application 5.1.3.3. Using the Bootloader as a Bare-Metal Framework 5.1.3.4. Using Symmetrical vs. Asymmetrical Multiprocessing (SMP vs. AMP) Modes
5.1.4. Assembling your Software Development Platform for Linux x
5.1.4.1. Golden System Reference Design (GSRD) for Linux 5.1.4.2. GSRD for Linux Build Flow 5.1.4.3. Source Code Management Considerations 5.1.4.4. Linux Device Tree Design Considerations
5.1.8. Selecting Software Tools for Development, Debug and Trace x
5.1.8.1. Selecting Software Build Tools 5.1.8.2. Selecting Software Debug Tools 5.1.8.3. Selecting Software Trace Tools
5.1.9. Board Bring Up Considerations x
5.1.9.1. Plan the SDRAM Initialization
5.1.10. Boot and Configuration Design Considerations x
5.1.10.1. Boot Design Considerations 5.1.10.2. Configuration
5.1.10.1. Boot Design Considerations x
5.1.10.1.1. Boot Source GUIDELINE: Determine which boot source is to be supported. 5.1.10.1.2. Select Desired Flash Device 5.1.10.1.3. BSEL Options 5.1.10.1.4. Boot Clock 5.1.10.1.5. Determine Boot Fuses Usage 5.1.10.1.6. CSEL Options 5.1.10.1.7. Determine Flash Programming Method 5.1.10.1.8. Selecting NAND Flash Devices 5.1.10.1.9. Selecting QSPI Flash Devices 5.1.10.1.10. Reference Materials
5.1.10.2. Configuration x
5.1.10.2.1. Traditional Configuration 5.1.10.2.2. HPS-Initiated Configuration
5.1.12. HPS ECC Design Considerations x
5.1.12.1. General ECC Design Considerations 5.1.12.2. ECC for External SDRAM Interface 5.1.12.3. ECC for L2 Cache Data Memory 5.1.12.4. ECC for Flash Memory
5.2. Support and Documentation x
5.2.1. Support 5.2.2. Hardware Documentation 5.2.3. Software Documentation
5.2.3. Software Documentation x
5.2.3.1. Example of Prebuilt Bootloaders for the Intel® Arria® 10 SoC Development Kit
1. Overview of Design Guidelines for Intel® Arria® 10 SoC FPGAs
2. Guidelines for Interconnecting the Intel® Arria® 10 HPS and FPGA
3. Design Guidelines for HPS Portion of Arria 10 SoC FPGAs
4. Board Design Guidelines for Arria 10 SoC FPGAs
5. Embedded Software Design Guidelines for Arria 10 SoC FPGAs

5.1.10.1.1. Boot Source

GUIDELINE: Determine which boot source is to be supported.

  • The HPS of the Intel® Arria® 10 SoC can be booted from a variety of sources:
    • SD/MMC Flash
    • QSPI Flash
    • NAND Flash
    • FPGA Fabric
    Note: More than one source can be supported. For example, most of the development could be done with an SD card, which is more convenient, and then the final testing and production release could target booting from QSPI.
Each possible boot source has its own considerations:
  • SD cards are cheap, universally available, and have large storage capacities. Industrial versions are available, with improved reliability. They are managed NAND flash, so wear leveling and bad block management are performed internally.
  • eMMC devices have smaller packages, are available in large capacities, and can be more reliable than SD. They are not removable, which can be a plus, allowing more rugged operation.
  • QSPI devices are very reliable, typically with a minimum of 100,000 erase cycles per sector. However they have a reduced capacity as compared to the other options. They are typically used as a boot source, but not as an application filesystem.
  • NAND devices are available in large sizes, but they are unmanaged NAND, which means that techniques such as wear leveling and bad block management must be implemented in software.
  • FPGA boot allows the HPS to boot without the need of an external Flash device. The FPGA boot memory can be synthesized out of FPGA resources (typically pre-initialized embedded memory blocks) or can be memory connected to the FPGA such as an external SRAM or SDRAM. In order to boot from the FPGA, the FPGA must be configured using a traditional configuration mechanism.
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