Intel® Quartus® Prime Pro Edition User Guide: Power Analysis and Optimization

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ID 683174
Date 12/04/2023
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Document Table of Contents
Document Table of Contents x
1. Answers to Top FAQs 2. Power Analysis 3. Power Optimization 4. Power Analysis and Optimization Document Archive A. Intel® Quartus® Prime Pro Edition User Guides
2. Power Analysis x
2.1. Power Analysis Tools 2.2. Running the Power Analyzer 2.3. Specifying Power Analyzer Input 2.4. Viewing Power Analysis Reports 2.5. Power Analysis in Modular Design Flows 2.6. Scripting Support 2.7. Power Analysis Revision History
2.3. Specifying Power Analyzer Input x
2.3.1. Settings for Power Analysis 2.3.2. Specifying Signal Activity Data 2.3.3. Specifying the Default Toggle Rate 2.3.4. Specifying Toggle Rates for Specific Nodes 2.3.5. Avoiding Simulation Node Name Match
2.3.2. Specifying Signal Activity Data x
2.3.2.1. Using Simulation Signal Activity Data in Power Analysis 2.3.2.2. Signal Activities from RTL (Functional) Simulation, Supplemented by Vectorless Estimation 2.3.2.3. Signal Activities from Vectorless Estimation and User-Supplied Input Pin Activities 2.3.2.4. Signal Activities from User Defaults Only
2.3.2.1. Using Simulation Signal Activity Data in Power Analysis x
2.3.2.1.1. Generating Signal Activity Data for Power Analysis 2.3.2.1.2. Generating Standard Delay Output for Power Analysis 2.3.2.1.3. Simulation Glitch Filtering
2.3.2.2. Signal Activities from RTL (Functional) Simulation, Supplemented by Vectorless Estimation x
2.3.2.2.1. RTL Simulation Limitation
2.3.4. Specifying Toggle Rates for Specific Nodes x
2.3.4.1. Clock Node Toggle Rates
2.5. Power Analysis in Modular Design Flows x
2.5.1. Complete Design Simulation Power Analysis Flow 2.5.2. Modular Design Simulation Power Analysis Flow 2.5.3. Multiple Simulation Power Analysis Flow 2.5.4. Overlapping Simulation Power Analysis Flow 2.5.5. Partial Design Simulation Power Analysis Flow 2.5.6. Vectorless Estimation Power Analysis Flow
2.5.5. Partial Design Simulation Power Analysis Flow x
2.5.5.1. Specifying Start and End Time for Signal Activity Calculations
2.6. Scripting Support x
2.6.1. Running the Power Analyzer from the Command–Line
3. Power Optimization x
3.1. Factors Affecting Power Consumption 3.2. Design Space Explorer II for Power-Driven Optimization 3.3. Power-Driven Compilation 3.4. Design Guidelines 3.5. Power Optimization Advisor 3.6. Power Optimization Revision History
3.1. Factors Affecting Power Consumption x
3.1.1. Design Activity and Power Analysis 3.1.2. Device Selection 3.1.3. Environmental Conditions 3.1.4. Device Resource Usage 3.1.5. Signal Activity
3.1.4. Device Resource Usage x
3.1.4.1. Number, Type, and Loading of I/O Pins 3.1.4.2. Number and Type of Hard Logic Blocks 3.1.4.3. Number and Type of Global Signals
3.1.5. Signal Activity x
3.1.5.1. Toggle Rate 3.1.5.2. Static Probability
3.3. Power-Driven Compilation x
3.3.1. Power-Driven Synthesis 3.3.2. Power-Driven Fitter 3.3.3. Area-Driven Synthesis 3.3.4. Gate-Level Register Retiming 3.3.5. Intel® Quartus® Prime Compiler Settings 3.3.6. Assignment Editor Options
3.3.1. Power-Driven Synthesis x
3.3.1.1. Memory Block Optimization 3.3.1.2. Power-Aware Logic Mapping 3.3.1.3. Power-Aware Memory Balancing
3.4. Design Guidelines x
3.4.1. Clock Power Management 3.4.2. Pipelining and Retiming 3.4.3. Architectural Optimization 3.4.4. I/O Power Guidelines 3.4.5. Dynamically Controlled On-Chip Terminations (OCT) 3.4.6. Memory Optimization (M20K/MLAB) 3.4.7. DDR Memory Controller Settings 3.4.8. DSP Implementation 3.4.9. Reducing High-Speed Tile (HST) Usage 3.4.10. Unused Transceiver Channels 3.4.11. Periphery Power reduction XCVR Settings
3.4.1. Clock Power Management x
3.4.1.1. Clock Gating 3.4.1.2. Clock Enable in Memory Blocks 3.4.1.3. LAB Clock Power 3.4.1.4. Clock Enables 3.4.1.5. Global Signals 3.4.1.6. Merge Clocks
3.4.1.1. Clock Gating x
3.4.1.1.1. Root Clock Gate 3.4.1.1.2. Sector Clock Gate 3.4.1.1.3. I/O PLL Clock Gate
3.4.1.3. LAB Clock Power x
3.4.1.3.1. LAB-Wide Clock Enable Example
3.4.1.5. Global Signals x
3.4.1.5.1. Viewing Clock Details in the Chip Planner
3.4.6. Memory Optimization (M20K/MLAB) x
3.4.6.1. Implementation 3.4.6.2. Rd/Wr Enables
3.4.11. Periphery Power reduction XCVR Settings x
3.4.11.1. Transceiver Settings 3.4.11.2. I/O Current Strength
3.5. Power Optimization Advisor x
3.5.1. Set Realistic Timing Constraints 3.5.2. Appropriate Device Family 3.5.3. Dynamic Power 3.5.4. Static Power 3.5.5. Appropriate I/O Standards 3.5.6. Use RAM Blocks 3.5.7. Shut Down RAM Blocks 3.5.8. Clock Enables on Logic 3.5.9. Pipeline Logic to Reduce Glitching
3.5.1. Set Realistic Timing Constraints x
3.5.1.1. Find Timing Information
1. Answers to Top FAQs
2. Power Analysis
3. Power Optimization
4. Power Analysis and Optimization Document Archive
A. Intel® Quartus® Prime Pro Edition User Guides

3.1.3. Environmental Conditions

The main environmental parameters affecting junction temperature are operating temperature and the cooling solution. Operating temperature primarily affects device static power consumption. Higher junction temperatures result in higher static power consumption. The device thermal power and cooling solution that you use must keep the device junction temperature within the maximum operating range for the device.

The following table lists the environmental conditions that influence power consumption.

Table 8.  Environmental Conditions that Affect Power Consumption
Environmental Condition Description
Airflow Measures how quickly the device replaces heated air from the vicinity of the device with air at ambient temperature.

You can either specify airflow as “still air” when you are not using a fan, or as the linear feet per minute rating of the fan in the system. Higher airflow decreases thermal resistance.

Heat Sink and Thermal Compound A heat sink allows more efficient heat transfer from the device to the surrounding area because of its large surface area exposed to the air. The thermal compound that interfaces the heat sink to the device also influences the rate of heat dissipation. The case-to-ambient thermal resistance (θCA) parameter describes the cooling capacity of the heat sink and thermal compound employed at a given airflow. Larger heat sinks and more effective thermal compounds reduce θCA.
Junction Temperature The junction temperature of a device is equal to: 
TJunction=TAmbient+PThermal·θJA
in which θJA is the total thermal resistance from the device transistors to the environment, in degrees Celsius per watt. The value θJA is equal to the sum of the junction-to-case (package) thermal resistance (θJC), and the case-to-ambient thermal resistance (θCA) of the cooling solution.
Board Thermal Model The junction-to-board thermal resistance (θJB) is the thermal resistance of the path through the board, in degrees Celsius per watt. To compute junction temperature, you can use this board thermal model along with the board temperature, the top-of-chip θJA and ambient temperatures.
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