CFD |
Computational Fluid Dynamic, a numerical analysis method for solving the conjugated heat transfer problems. |
CTM |
Compact Thermal Model, a geometric model that is used as an input to CFD tool. |
EPE |
Early Power Estimator, a tool that estimates the power consumption of the FPGA device. |
FPGA |
Field Programmable Gate Array |
HBM |
High Bandwidth Memory |
IHS |
Integrated Heat Spreader - case of an Intel® Stratix® 10 FPGA. |
MCM |
Multi-Chip Module - an integrated circuit (IC) with more than one die. |
SCM |
Single Chip Module |
TCASE |
Integrated Heat Spreader or Case Temperature. The case temperature of a component is measured with an attached heat sink. This temperature is measured at the top geometric center of the package case/die. |
TDP |
Thermal Design Power, the power dissipated in a die that is used for thermal analysis purposes. |
TA |
Ambient Temperature, measured locally surrounding the FPGA. The ambient temperature should be measured just upstream of a passive heat sink or at the fan inlet for an active heat sink. |
TCORE |
Core Fabric Die Temperature |
TJ |
Junction Temperature |
TJ-MAX |
Maximum Junction Temperature, a maximum allowable absolute temperature rating of the device or a targeted value. |
TTDP |
Total Thermal Design Power, the power dissipated in the device that is used for thermal analysis purposes. |
TIM |
Thermal Interface Material |
TSD |
Temperature Sensor Diode |