Thermal Design User Guide: Agilex™ 5 FPGAs and SoCs

ID 814008
Date 4/01/2024
Public
Document Table of Contents

1. Introduction to Agilex™ 5 FPGA Thermal Design Guidelines

Updated for:
Intel® Quartus® Prime Design Suite 24.1
Agilex™ 5 FPGAs are a single-die FPGA packaged in a lidless flip-chip ball grid array (BGA). This package does not have an integrated heat spreader (IHS), and the heat sink must be directly installed on top of the die with a thermal interface material (TIM) that you provide.

Thermal analysis of this device requires the use of the Agilex™ 5 Power and Thermal Calculator (PTC). The PTC provides power dissipation and other relevant thermal parameters to be used in the analysis. This document provides methodology, examples, and other relevant data for use when designing with Agilex™ 5 FPGAs.

Thermal design for Agilex™ 5 devices requires that you are familiar with the following topics:

  • Agilex™ 5 mechanical construction.
  • Agilex™ 5 CTMs construction.
  • The Power and Thermal Calculator for Agilex™ 5 FPGAs.
  • General FPGA thermal design considerations.