External Memory Interfaces Agilex™ 7 M-Series FPGA IP User Guide

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Date 4/01/2024
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Document Table of Contents
Document Table of Contents x
1. About the External Memory Interfaces Agilex™ 7 M-Series FPGA IP 2. Agilex™ 7 M-Series FPGA EMIF IP – Introduction 3. Agilex™ 7 M-Series FPGA EMIF IP – Product Architecture 4. Agilex™ 7 M-Series FPGA EMIF IP – End-User Signals 5. Agilex™ 7 M-Series FPGA EMIF IP – Simulating Memory IP 6. Agilex™ 7 M-Series FPGA EMIF IP – DDR4 Support 7. Agilex™ 7 M-Series FPGA EMIF IP – DDR5 Support 8. Agilex™ 7 M-Series FPGA EMIF IP – LPDDR5 Support 9. Agilex™ 7 M-Series FPGA EMIF IP – Timing Closure 10. Agilex™ 7 M-Series FPGA EMIF IP – Controller Optimization 11. Agilex™ 7 M-Series FPGA EMIF IP – Debugging 12. Document Revision History for External Memory Interfaces Agilex™ 7 M-Series FPGA IP User Guide
1. About the External Memory Interfaces Agilex™ 7 M-Series FPGA IP x
1.1. Release Information
2. Agilex™ 7 M-Series FPGA EMIF IP – Introduction x
2.1. Agilex™ 7 M-Series EMIF IP Protocol and Feature Support 2.2. Agilex™ 7 M-Series EMIF IP Design Flow 2.3. Agilex™ 7 M-Series EMIF IP Design Checklist
3. Agilex™ 7 M-Series FPGA EMIF IP – Product Architecture x
3.1. Agilex™ 7 M-Series EMIF Architecture: Introduction 3.2. Agilex™ 7 M-Series EMIF Sequencer 3.3. Agilex™ 7 M-Series EMIF Controller 3.4. Agilex™ 7 M-Series EMIF IP for Hard Processor Subsystem (HPS)
3.1. Agilex™ 7 M-Series EMIF Architecture: Introduction x
3.1.1. Agilex™ 7 M-Series EMIF Architecture: I/O Subsystem 3.1.2. Agilex™ 7 M-Series EMIF Architecture: I/O SSM 3.1.3. Agilex™ 7 M-Series EMIF Architecture: I/O Bank 3.1.4. Agilex™ 7 M-Series EMIF Architecture: I/O Lane 3.1.5. Agilex™ 7 M-Series EMIF Architecture: Input DQS Clock Tree 3.1.6. Agilex™ 7 M-Series EMIF Architecture: PHY Clock Tree 3.1.7. Agilex™ 7 M-Series EMIF Architecture: PLL Reference Clock Networks 3.1.8. Agilex™ 7 M-Series EMIF Architecture: Clock Phase Alignment 3.1.9. User Clock in Different Core Access Modes
3.1.3. Agilex™ 7 M-Series EMIF Architecture: I/O Bank x
3.1.3.1. Lockstep Configuration 3.1.3.2. DDR4 Pin Placement 3.1.3.3. DDR5 Pin Placement 3.1.3.4. LPDDR5 Pin Placement 3.1.3.5. I/O Sub-Bank Usage
3.2. Agilex™ 7 M-Series EMIF Sequencer x
3.2.1. Agilex™ 7 M-Series Mailbox Structure and Register Definitions
3.2.1. Agilex™ 7 M-Series Mailbox Structure and Register Definitions x
3.2.1.1. Mailbox Supported Commands 3.2.1.2. Mailbox Command Definitions
3.3. Agilex™ 7 M-Series EMIF Controller x
3.3.1. Hard Memory Controller
3.3.1. Hard Memory Controller x
3.3.1.1. Hard Memory Controller Features
4. Agilex™ 7 M-Series FPGA EMIF IP – End-User Signals x
4.1. Agilex™ 7 M-Series FPGA EMIF IP Interfaces for DDR4 4.2. Agilex™ 7 M-Series FPGA EMIF IP Interfaces for DDR5 4.3. Agilex™ 7 M-Series FPGA EMIF IP Interfaces for LPDDR5 4.4. Agilex™ 7 M-Series FPGA EMIF IP Interfaces for EMIF Calibration Component
4.1. Agilex™ 7 M-Series FPGA EMIF IP Interfaces for DDR4 x
4.1.1. ref_clk for EMIF 4.1.2. core_init_n for EMIF 4.1.3. usr_async_clk for EMIF 4.1.4. usr_clk for EMIF 4.1.5. usr_rst_n for EMIF 4.1.6. s0_axi4 for EMIF 4.1.7. mem for EMIF 4.1.8. oct for EMIF
4.2. Agilex™ 7 M-Series FPGA EMIF IP Interfaces for DDR5 x
4.2.1. ref_clk for EMIF 4.2.2. core_init_n for EMIF 4.2.3. usr_async_clk for EMIF 4.2.4. usr_clk for EMIF 4.2.5. usr_rst_n for EMIF 4.2.6. s0_axi4 for EMIF 4.2.7. mem for EMIF 4.2.8. i3c for EMIF 4.2.9. mem_lbd for EMIF 4.2.10. mem_lbs for EMIF 4.2.11. oct for EMIF
4.3. Agilex™ 7 M-Series FPGA EMIF IP Interfaces for LPDDR5 x
4.3.1. ref_clk for EMIF 4.3.2. core_init_n for EMIF 4.3.3. usr_async_clk for EMIF 4.3.4. usr_clk for EMIF 4.3.5. usr_rst_n for EMIF 4.3.6. s0_axi4 for EMIF 4.3.7. mem for EMIF 4.3.8. oct for EMIF
4.4. Agilex™ 7 M-Series FPGA EMIF IP Interfaces for EMIF Calibration Component x
4.4.1. s0_axi4lite_clk for EMIF 4.4.2. s0_axi4lite_rst_n for EMIF 4.4.3. s0_axi4lite for EMIF
5. Agilex™ 7 M-Series FPGA EMIF IP – Simulating Memory IP x
5.1. Simulation Walkthrough
5.1. Simulation Walkthrough x
5.1.1. Calibration 5.1.2. Simulation Scripts 5.1.3. Functional Simulation with Verilog HDL 5.1.4. Simulating the Design Example
6. Agilex™ 7 M-Series FPGA EMIF IP – DDR4 Support x
6.1. Agilex™ 7 M-Series FPGA EMIF IP Parameters for DDR4 6.2. Agilex™ 7 M-Series FPGA EMIF IP Pin and Resource Planning 6.3. DDR4 Board Design Guidelines
6.1. Agilex™ 7 M-Series FPGA EMIF IP Parameters for DDR4 x
6.1.1. Agilex™ 7 FPGA EMIF IP Parameter for DDR4 6.1.2. Agilex™ 7 FPGA EMIF Memory Device Description IP (DDR4) Parameter Descriptions 6.1.3. Agilex™ 7 FPGA EMIF Calibration IP Parameter Descriptions
6.2. Agilex™ 7 M-Series FPGA EMIF IP Pin and Resource Planning x
6.2.1. Agilex™ 7 M-Series FPGA EMIF IP Interface Pins 6.2.2. Agilex™ 7 M-Series FPGA EMIF IP Resources 6.2.3. Pin Guidelines for Agilex™ 7 M-Series FPGA EMIF IP 6.2.4. Pin Placements for Agilex™ 7 M-Series FPGA DDR4 EMIF IP
6.2.1. Agilex™ 7 M-Series FPGA EMIF IP Interface Pins x
6.2.1.1. Estimating Pin Requirements 6.2.1.2. DIMM Options 6.2.1.3. Maximum Number of Interfaces
6.2.2. Agilex™ 7 M-Series FPGA EMIF IP Resources x
6.2.2.1. OCT 6.2.2.2. PLL
6.2.4. Pin Placements for Agilex™ 7 M-Series FPGA DDR4 EMIF IP x
6.2.4.1. Address and Command Pin Placement for DDR4 6.2.4.2. DDR4 Data Width Mapping 6.2.4.3. General Guidelines - DDR4 6.2.4.4. x4 DIMM Implementation 6.2.4.5. Specific Pin Connection Requirements 6.2.4.6. Command and Address Signals 6.2.4.7. Clock Signals 6.2.4.8. Data, Data Strobes, DM/DBI, and Optional ECC Signals
6.3. DDR4 Board Design Guidelines x
6.3.1. Terminations for DDR4 with Agilex™ 7 M-Series Devices 6.3.2. General Layout Routing Guidelines 6.3.3. Reference Stackup 6.3.4. Agilex™ 7 M-Series EMIF-Specific Routing Guidelines for Various DDR4 Topologies 6.3.5. DDR4 Routing Guidelines: Discrete (Component) Topologies
6.3.1. Terminations for DDR4 with Agilex™ 7 M-Series Devices x
6.3.1.1. Dynamic On-Chip Termination (OCT) 6.3.1.2. Dynamic On-Die Termination (ODT) in DDR4 6.3.1.3. Choosing Terminations on Agilex™ 7 M-Series FPGA Devices 6.3.1.4. On-Chip Termination Recommendations for Agilex™ 7 M-Series FPGA Devices
6.3.4. Agilex™ 7 M-Series EMIF-Specific Routing Guidelines for Various DDR4 Topologies x
6.3.4.1. One DIMM per Channel (1DPC) for UDIMM, RDIMM, and SODIMM DDR4 Topologies 6.3.4.2. Skew Matching Guidelines for DIMM Configurations 6.3.4.3. Power Delivery Recommendations for the Memory / DIMM Side
6.3.5. DDR4 Routing Guidelines: Discrete (Component) Topologies x
6.3.5.1. Single Rank x 8 Discrete (Component) Topology 6.3.5.2. Single Rank x 16 Discrete (Component) Topology 6.3.5.3. ADDR/CMD Reference Voltage/RESET Signal Routing Guidelines for Single Rank x 8 and Single Rank x 16 Discrete (Component) Topologies 6.3.5.4. Skew Matching Guidelines for DDR4 Discrete Configurations 6.3.5.5. Power Delivery Recommendations for DDR4 Discrete Configurations 6.3.5.6. Agilex™ 7 M-Series EMIF Pin Swapping Guidelines
6.3.5.6. Agilex™ 7 M-Series EMIF Pin Swapping Guidelines x
6.3.5.6.1. DDR4 Byte Lane Swapping 6.3.5.6.2. DDR4 Address and Command and CLK Lane 6.3.5.6.3. DDR4 Interface x8 Data Lane 6.3.5.6.4. DDR4 Interface x4 Data Lane 6.3.5.6.5. Pin Swizzling
7. Agilex™ 7 M-Series FPGA EMIF IP – DDR5 Support x
7.1. Agilex™ 7 M-Series FPGA EMIF IP Parameters for DDR5 7.2. Agilex™ 7 M-Series FPGA EMIF IP Pin and Resource Planning 7.3. DDR5 Board Design Guidelines
7.1. Agilex™ 7 M-Series FPGA EMIF IP Parameters for DDR5 x
7.1.1. Agilex™ 7 FPGA EMIF IP Parameter for DDR5 7.1.2. Agilex™ 7 FPGA EMIF Memory Device Description IP (DDR5) Parameter Descriptions 7.1.3. Agilex™ 7 FPGA EMIF Calibration IP Parameter Descriptions
7.2. Agilex™ 7 M-Series FPGA EMIF IP Pin and Resource Planning x
7.2.1. Agilex™ 7 M-Series FPGA EMIF IP Interface Pins 7.2.2. Agilex™ 7 M-Series FPGA EMIF IP Resources 7.2.3. Pin Guidelines for Agilex™ 7 M-Series FPGA EMIF IP 7.2.4. Pin Placements for Agilex™ 7 M-Series FPGA DDR5 EMIF IP 7.2.5. Agilex™ 7 M-Series EMIF Pin Swapping Guidelines
7.2.1. Agilex™ 7 M-Series FPGA EMIF IP Interface Pins x
7.2.1.1. Estimating Pin Requirements 7.2.1.2. DIMM Options 7.2.1.3. Maximum Number of Interfaces
7.2.2. Agilex™ 7 M-Series FPGA EMIF IP Resources x
7.2.2.1. OCT 7.2.2.2. PLL
7.2.3. Pin Guidelines for Agilex™ 7 M-Series FPGA EMIF IP x
7.2.3.1. General Guidelines - DDR5 7.2.3.2. x4 DIMM Implementation 7.2.3.3. Specific Pin Connection Requirements 7.2.3.4. Command and Address Signals 7.2.3.5. Clock Signals 7.2.3.6. Data, Data Strobes, DM, and Optional ECC Signals
7.2.4. Pin Placements for Agilex™ 7 M-Series FPGA DDR5 EMIF IP x
7.2.4.1. Address and Command Pin Placement for DDR5 7.2.4.2. DDR5 Data Width Mapping
7.2.5. Agilex™ 7 M-Series EMIF Pin Swapping Guidelines x
7.2.5.1. DDR5 Byte Lane Swapping 7.2.5.2. DDR5 Address and Command and CLK Lane 7.2.5.3. DDR5 Interface x8 Data Lane 7.2.5.4. DDR5 Interface x4 Data Lane 7.2.5.5. Pin Swizzling
7.3. DDR5 Board Design Guidelines x
7.3.1. PCB Stack-up and Design Considerations 7.3.2. General Design Considerations 7.3.3. DDR Differential Signals Routing 7.3.4. Ground Plane and Return Path 7.3.5. RDIMM, UDIMM, and SODIMM Break-in Layout Guidelines 7.3.6. DRAM Break-in Layout Guidelines 7.3.7. DDR5 PCB Layout Guidelines 7.3.8. DDR5 Simulation Strategy
7.3.7. DDR5 PCB Layout Guidelines x
7.3.7.1. DDR5 Discrete Component/Memory Down Topology: up to 40-Bit Interface (1 Rank x8 or x16, 2 Rank x8 or x16) 7.3.7.2. Routing Guidelines for DDR5 Memory Down: 1 Rank or 2 Rank (x8 bit or x16 bit) Configurations 7.3.7.3. Routing Guidelines for DDR5 RDIMM, UDIMM, and SODIMM Configurations 7.3.7.4. Example of a DDR5 layout on Intel FPGA Platform Board
8. Agilex™ 7 M-Series FPGA EMIF IP – LPDDR5 Support x
8.1. Agilex™ 7 M-Series FPGA EMIF IP Parameters for LPDDR5 8.2. Agilex™ 7 M-Series FPGA EMIF IP Pin and Resource Planning 8.3. LPDDR5 Board Design Guidelines
8.1. Agilex™ 7 M-Series FPGA EMIF IP Parameters for LPDDR5 x
8.1.1. Agilex™ 7 FPGA EMIF IP Parameter for LPDDR5 8.1.2. Agilex™ 7 FPGA EMIF Memory Device Description IP (LPDDR5) Parameter Descriptions 8.1.3. Agilex™ 7 FPGA EMIF Calibration IP Parameter Descriptions
8.2. Agilex™ 7 M-Series FPGA EMIF IP Pin and Resource Planning x
8.2.1. Agilex™ 7 M-Series FPGA EMIF IP Interface Pins 8.2.2. Agilex™ 7 M-Series FPGA EMIF IP Resources 8.2.3. Pin Guidelines for Agilex™ 7 M-Series FPGA EMIF IP 8.2.4. Pin Placements for Agilex™ 7 M-Series FPGA LPDDR5 EMIF IP
8.2.1. Agilex™ 7 M-Series FPGA EMIF IP Interface Pins x
8.2.1.1. Estimating Pin Requirements 8.2.1.2. DIMM Options 8.2.1.3. Maximum Number of Interfaces
8.2.2. Agilex™ 7 M-Series FPGA EMIF IP Resources x
8.2.2.1. OCT 8.2.2.2. PLL
8.2.3. Pin Guidelines for Agilex™ 7 M-Series FPGA EMIF IP x
8.2.3.1. General Guidelines - LPDDR5 8.2.3.2. Specific Pin Connection Requirements 8.2.3.3. Command and Address Signals 8.2.3.4. Clock Signals
8.2.4. Pin Placements for Agilex™ 7 M-Series FPGA LPDDR5 EMIF IP x
8.2.4.1. Address and Command Pin Placement for LPDDR5 8.2.4.2. LPDDR5 Data Width Mapping 8.2.4.3. LPDDR5 Byte Lane Swapping
8.3. LPDDR5 Board Design Guidelines x
8.3.1. PCB Stack-up and Design Considerations 8.3.2. General Design Considerations 8.3.3. DDR Differential Signals Routing 8.3.4. Ground Plane and Return Path 8.3.5. DRAM Break-in Layout Guidelines 8.3.6. LPDDR5 PCB Layout Guidelines 8.3.7. LPDDR5 Simulation Strategy
8.3.6. LPDDR5 PCB Layout Guidelines x
8.3.6.1. LPDDR5 Discrete Component/Memory Down Topology (1 Rank or 2 Rank, up to 64 Bit Interface) 8.3.6.2. Supported LPDDR5 Topologies 8.3.6.3. Example of an LPDDR5 Layout on an Intel® FPGA Platform Board
9. Agilex™ 7 M-Series FPGA EMIF IP – Timing Closure x
9.1. Timing Closure 9.2. Optimizing Timing
9.1. Timing Closure x
9.1.1. Timing Analysis
9.1.1. Timing Analysis x
9.1.1.1. PHY or Core
10. Agilex™ 7 M-Series FPGA EMIF IP – Controller Optimization x
10.1. Interface Standard 10.2. Bank Management Efficiency 10.3. Data Transfer 10.4. Improving Controller Efficiency
10.4. Improving Controller Efficiency x
10.4.1. Frequency of Operation 10.4.2. Series of Reads or Writes
11. Agilex™ 7 M-Series FPGA EMIF IP – Debugging x
11.1. Interface Configuration Performance Issues 11.2. Functional Issue Evaluation 11.3. Timing Issue Characteristics 11.4. Verifying Memory IP Using the Signal Tap Logic Analyzer 11.5. Debugging with the External Memory Interface Debug Toolkit 11.6. Generating Traffic with the Test Engine IP 11.7. Guidelines for Developing HDL for Traffic Generator
11.1. Interface Configuration Performance Issues x
11.1.1. Interface Configuration Bottleneck and Efficiency Issues
11.2. Functional Issue Evaluation x
11.2.1. Intel® IP Memory Model 11.2.2. Vendor Memory Model 11.2.3. Transcript Window Messages
11.3. Timing Issue Characteristics x
11.3.1. Evaluating FPGA Timing Issues 11.3.2. Evaluating External Memory Interface Timing Issues
11.5. Debugging with the External Memory Interface Debug Toolkit x
11.5.1. Prerequisites for Using the EMIF Debug Toolkit 11.5.2. Configuring Your Design to Use the EMIF Debug Toolkit 11.5.3. Launching the EMIF Debug Toolkit 11.5.4. Using the EMIF Debug Toolkit
11.5.4. Using the EMIF Debug Toolkit x
11.5.4.1. Rerunning Calibration 11.5.4.2. Rerunning the Test Engine 11.5.4.3. Saving Debug Print 11.5.4.4. Calibration Reports 11.5.4.5. Driver Margining Tab 11.5.4.6. Pin Delay Settings Tab
1. About the External Memory Interfaces Agilex™ 7 M-Series FPGA IP
2. Agilex™ 7 M-Series FPGA EMIF IP – Introduction
3. Agilex™ 7 M-Series FPGA EMIF IP – Product Architecture
4. Agilex™ 7 M-Series FPGA EMIF IP – End-User Signals
5. Agilex™ 7 M-Series FPGA EMIF IP – Simulating Memory IP
6. Agilex™ 7 M-Series FPGA EMIF IP – DDR4 Support
7. Agilex™ 7 M-Series FPGA EMIF IP – DDR5 Support
8. Agilex™ 7 M-Series FPGA EMIF IP – LPDDR5 Support
9. Agilex™ 7 M-Series FPGA EMIF IP – Timing Closure
10. Agilex™ 7 M-Series FPGA EMIF IP – Controller Optimization
11. Agilex™ 7 M-Series FPGA EMIF IP – Debugging
12. Document Revision History for External Memory Interfaces Agilex™ 7 M-Series FPGA IP User Guide

8.3.1. PCB Stack-up and Design Considerations

The following figure shows an example of an 18-layer PCB stackup that has been used for LPDDR5 on an Intel platform board. You may use other stackups (thin such as PCIE board, or thick board), provided you follow the recommendations in these guidelines.

Figure 53. 18-Layer Thin Board Type-4 PCB with Micro Via, Stacked Via, Buried Via and Through Via

The following figure shows an example of a 22-layer thick PCB stackup, as used with some Intel platform boards and development kits.

Figure 54. 22-Layer Thick Type-4 Board Stack-up, High Performance with Micro Via and PTH, with and without Backdrill

A high-quality type-4 PCB uses not only plated-through-hole (PTH) vias to connect from the top to bottom layer, but also stacked vias, micro vias, and buried vias to connect between layers. For example, a full-height stacked via of an 18 layer PCB consists of a combination of dual-stacked micro vias and buried vias. The following figure shows a cross-sectional comparison of a PTH and stacked via.

Figure 55. Cross-sectional Comparison of Plated-Through Hole Via and Stacked Via

To support maximum data rate operation, LPDDR5 board design requires a high-quality PCB stackup using micro vias, buried vias, or stacked vias to reduce crosstalk for high performance. Reducing the length of signal via is essential to minimizing the crosstalk between signals.

A type-3 PCB with zero-built up layers and PTH vias which is used to implement a DDR4 design can also be used for LPDDR5 designs if backdrill is implemented to reach the maximum supported data rate.

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