Intel Agilex® 7 General-Purpose I/O User Guide: M-Series

Download PDF
ID 772138
Date 9/11/2023
Public

A newer version of this document is available. Customers should click here to go to the newest version.

Document Table of Contents
Document Table of Contents x
1. Intel Agilex® 7 M-Series General-Purpose I/O Overview 2. Intel Agilex® 7 M-Series GPIO-B Banks 3. Intel Agilex® 7 M-Series HPS I/O Banks 4. Intel Agilex® 7 M-Series SDM I/O Banks 5. Intel Agilex® 7 M-Series I/O Troubleshooting Guidelines 6. GPIO Intel® FPGA IP 7. Programmable I/O Features Description 8. Documentation Related to the Intel Agilex® 7 General-Purpose I/O User Guide: M-Series 9. Document Revision History for the Intel Agilex® 7 General-Purpose I/O User Guide: M-Series
1. Intel Agilex® 7 M-Series General-Purpose I/O Overview x
1.1. Package Selection and I/O Vertical Migration Support 1.2. Types of I/O Banks
2. Intel Agilex® 7 M-Series GPIO-B Banks x
2.1. GPIO-B Bank Overview 2.2. GPIO-B Features 2.3. GPIO-B Implementation Guide 2.4. GPIO-B Termination 2.5. GPIO-B Design Guidelines 2.6. GPIO-B Simulation
2.1. GPIO-B Bank Overview x
2.1.1. GPIO-B Bank Structure 2.1.2. GPIO-B Buffers and Registers
2.2. GPIO-B Features x
2.2.1. Supported I/O Standards for GPIO-B Banks 2.2.2. GPIO-B Buffer Behavior 2.2.3. Programmable I/O Element Features for the GPIO-B Bank
2.2.3. Programmable I/O Element Features for the GPIO-B Bank x
2.2.3.1. Guidelines: Programmable Output Slew Rate Control 2.2.3.2. Guidelines: Programmable Pull-Up Resistor 2.2.3.3. Guidelines: Programmable De-Emphasis 2.2.3.4. Guidelines: Programmable Receiver Equalization Calibration
2.3. GPIO-B Implementation Guide x
2.3.1. I/O Assignments with the Intel® Quartus® Prime Assignment Editor 2.3.2. Assigning Pin I/O Standards in the Intel® Quartus® Prime Pin Planner
2.3.1. I/O Assignments with the Intel® Quartus® Prime Assignment Editor x
2.3.1.1. Assigning Pin I/O Standards in the Intel® Quartus® Prime Assignment Editor 2.3.1.2. Assigning Programmable IOE Features in the Intel® Quartus® Prime Assignment Editor 2.3.1.3. GPIO-B Programmable IOE Features Assignment Names and Settings
2.4. GPIO-B Termination x
2.4.1. Single-Ended I/O Termination in M-Series Devices 2.4.2. True Differential Signaling I/O Termination
2.4.1. Single-Ended I/O Termination in M-Series Devices x
2.4.1.1. Single-Ended I/O Standard OCT Termination 2.4.1.2. OCT Calibration Block 2.4.1.3. Single-Ended I/O Standards External Termination 2.4.1.4. Single-Ended I/O Termination Implementation Guide
2.4.1.1. Single-Ended I/O Standard OCT Termination x
2.4.1.1.1. RS OCT 2.4.1.1.2. RT OCT 2.4.1.1.3. Dynamic OCT
2.4.1.4. Single-Ended I/O Termination Implementation Guide x
2.4.1.4.1. Configuring OCT Using the Assignment Editor 2.4.1.4.2. OCT Features Assignment Names and Settings
2.4.2. True Differential Signaling I/O Termination x
2.4.2.1. True Differential Signaling I/O Standard OCT Termination 2.4.2.2. True Differential Signaling I/O Standard External Termination
2.4.2.1. True Differential Signaling I/O Standard OCT Termination x
2.4.2.1.1. Configuring Differential Input RD OCT Using the Assignment Editor 2.4.2.1.2. Guidelines: Differential Input RD OCT
2.5. GPIO-B Design Guidelines x
2.5.1. I/O Standard Placement Restrictions for True Differential I/Os 2.5.2. Placement Restrictions for True Differential and Single-Ended I/O Standards in the Same or Adjacent GPIO-B Bank 2.5.3. VREF Sources and Input Standards Grouping 2.5.4. GPIO-B Pin Restrictions for External Memory Interfaces 2.5.5. RZQ Pin Requirement 2.5.6. I/O Standards Implementation Based on VCCIO_PIO Voltages 2.5.7. I/O Standard Selection and I/O Bank Supply Compatibility Check 2.5.8. Simultaneous Switching Noise 2.5.9. HPS Shared I/O Requirements 2.5.10. Clocking Requirements 2.5.11. SDM Shared I/O Requirements 2.5.12. Unused Pins 2.5.13. VCCIO_PIO Supply for Unused GPIO-B Banks 2.5.14. GPIO-B Pins During Power Sequencing 2.5.15. Drive Strength Requirement for GPIO-B Input Pins 2.5.16. Maximum DC Current Restrictions 2.5.17. 1.05 V, 1.1 V, or 1.2 V I/O Interface Voltage Level Compatibility 2.5.18. Connection to True Differential Signaling Input Buffers During Device Reconfiguration 2.5.19. LVSTL700 I/O Standards Differential Pin Pair Requirements 2.5.20. Implementing a Pseudo Open Drain 2.5.21. Allowed Duration for Using RT OCT 2.5.22. Single-Ended Strobe Signal Differential Pin Pair Restriction
2.6. GPIO-B Simulation x
2.6.1. IBIS Models 2.6.2. IBIS-AMI Models 2.6.3. HSPICE* Models 2.6.4. Net Length Reports
3. Intel Agilex® 7 M-Series HPS I/O Banks x
3.1. HPS I/O Bank Overview 3.2. HPS I/O Features 3.3. HPS I/O Implementation Guide 3.4. HPS I/O Design Guidelines 3.5. HPS I/O Simulation
3.2. HPS I/O Features x
3.2.1. Supported I/O Standards for HPS I/O Banks 3.2.2. Programmable I/O Element Features for the HPS I/O Bank 3.2.3. HPS I/O Buffer Behavior
3.3. HPS I/O Implementation Guide x
3.3.1. Configuring Open Drain Feature for the HPS I/O 3.3.2. I/O Assignments with the Intel® Quartus® Prime Assignment Editor 3.3.3. Assigning Pin I/O Standards in the Intel® Quartus® Prime Pin Planner
3.3.2. I/O Assignments with the Intel® Quartus® Prime Assignment Editor x
3.3.2.1. Assigning Programmable IOE Features in the Intel® Quartus® Prime Assignment Editor 3.3.2.2. HPS I/O Programmable IOE Features Assignment Names and Settings
3.4. HPS I/O Design Guidelines x
3.4.1. HPS I/O Pins During Power Sequencing 3.4.2. HPS Shared I/O Requirements
3.5. HPS I/O Simulation x
3.5.1. HPS IBIS Models 3.5.2. Net Length Reports
4. Intel Agilex® 7 M-Series SDM I/O Banks x
4.1. SDM I/O Bank Overview 4.2. SDM I/O Features 4.3. SDM I/O Design Guidelines 4.4. SDM I/O Simulation
4.2. SDM I/O Features x
4.2.1. Supported I/O Standards for SDM I/O Banks 4.2.2. SDM I/O Buffer Behavior 4.2.3. I/O Standards and Features for Configuration Pins
4.3. SDM I/O Design Guidelines x
4.3.1. SDM I/O Pins During Power Sequencing 4.3.2. Avalon® Streaming Interface Dedicated Configuration Pins
4.4. SDM I/O Simulation x
4.4.1. SDM IBIS Models 4.4.2. Net Length Reports
6. GPIO Intel® FPGA IP x
6.1. Release Information for GPIO Intel® FPGA IP 6.2. Generating the GPIO Intel® FPGA IP 6.3. GPIO Intel® FPGA IP Parameter Settings 6.4. GPIO Intel® FPGA IP Interface Signals 6.5. GPIO Intel® FPGA IP Architecture 6.6. Verifying Resource Utilization and Design Performance 6.7. GPIO Intel® FPGA IP Timing 6.8. GPIO Intel® FPGA IP Design Examples
6.2. Generating the GPIO Intel® FPGA IP x
6.2.1. Intel® FPGA IP Generation Output
6.3. GPIO Intel® FPGA IP Parameter Settings x
6.3.1. Guideline: Swap datain_h and datain_l Ports in Migrated IP
6.4. GPIO Intel® FPGA IP Interface Signals x
6.4.1. Shared Signals 6.4.2. Data Bit-Order for Data Interface 6.4.3. Input and Output Bus High and Low Bits 6.4.4. Data Interface Signals and Corresponding Clocks
6.5. GPIO Intel® FPGA IP Architecture x
6.5.1. GPIO Intel® FPGA IP Data Paths 6.5.2. Register Packing
6.5.1. GPIO Intel® FPGA IP Data Paths x
6.5.1.1. Input Path 6.5.1.2. Output and Output Enable Paths
6.7. GPIO Intel® FPGA IP Timing x
6.7.1. Timing Components 6.7.2. Delay Elements 6.7.3. Timing Analysis 6.7.4. Timing Closure Guidelines
6.7.3. Timing Analysis x
6.7.3.1. Single Data Rate Input Register 6.7.3.2. DDIO Input Register 6.7.3.3. Single Data Rate Output Register 6.7.3.4. DDIO Output Register
6.8. GPIO Intel® FPGA IP Design Examples x
6.8.1. GPIO Intel® FPGA IP Synthesizable Intel® Quartus® Prime Design Example 6.8.2. GPIO Intel® FPGA IP Simulation Design Example
7. Programmable I/O Features Description x
7.1. Programmable Pre-Emphasis 7.2. Programmable De-Emphasis 7.3. Programmable Differential Output Voltage 7.4. Continuous Time Linear Equalization 7.5. Decision Feedback Equalization
1. Intel Agilex® 7 M-Series General-Purpose I/O Overview
2. Intel Agilex® 7 M-Series GPIO-B Banks
3. Intel Agilex® 7 M-Series HPS I/O Banks
4. Intel Agilex® 7 M-Series SDM I/O Banks
5. Intel Agilex® 7 M-Series I/O Troubleshooting Guidelines
6. GPIO Intel® FPGA IP
7. Programmable I/O Features Description
8. Documentation Related to the Intel Agilex® 7 General-Purpose I/O User Guide: M-Series
9. Document Revision History for the Intel Agilex® 7 General-Purpose I/O User Guide: M-Series

2.4.1.1.1. RS OCT

M-Series devices support RS OCT with and without calibration.
Table 11.  RS OCT Schemes
OCT Scheme Description
RS without calibration
  • Available on output buffer only.
  • Driver-impedance matching provides the I/O driver with a controlled output impedance that closely matches the impedance of the transmission line.
RS with calibration
  • The RS OCT calibration circuit uses the impedance of the external resistor connected to the RZQ pin as a reference.
  • During calibration, the circuit continuously alters the impedance of the I/O buffer until the value reaches the target impedance, which is a predetermined ratio to the reference resistance.
  • The calibration occurs at the end of the device configuration. When the calibration circuit finds the correct impedance, the circuit stops changing the characteristics of the drivers.
  • In EMIF mode, you may trigger recalibration during user-mode.
Figure 7. RS OCT without Calibration This figure shows the RS as the total impedance of the output buffer.
Figure 8. RS OCT with Calibration This figure shows the RS as the total impedance of the output buffer.
Table 12.  Selectable I/O Standards for RS OCT for GPIO-B BanksThe default values are in bold font.
I/O Standard RS OCT without Calibration5 (Ω) RS OCT with Calibration (Ω)
1.3 V LVCMOS 34, 40 —
1.2 V LVCMOS 34, 40 —
1.1 V LVCMOS 34, 40 —
1.05 V LVCMOS 34, 40 —
SSTL-12 34, 40 34, 40
HSTL-12 34, 40 34, 40
HSUL-12 34, 40 34, 40
POD12 34, 40 34, 40
POD11 34, 40 34, 40
LVSTL11 34, 40 34, 40
LVSTL105 34, 40 34, 40
LVSTL700 — 40
Differential SSTL-12 34, 40 34, 40
Differential HSTL-12 34, 40 34, 40
Differential HSUL-12 34, 40 34, 40
Differential POD12 34, 40 34, 40
Differential POD11 34, 40 34, 40
Differential LVSTL11 34, 40 34, 40
Differential LVSTL105 34, 40 34, 40
Differential LVSTL700 — 40
SLVS-400 — 45, 50
5 Supported only in GPIO mode.
Level Two Title