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1. About the Nios® V Embedded Processor
2. Nios® V Processor Hardware System Design with Intel® Quartus® Prime Software and Platform Designer
3. Nios® V Processor Software System Design
4. Nios® V Processor Configuration and Booting Solutions
5. Nios® V Processor - Using the MicroC/TCP-IP Stack
6. Nios® V Processor Debugging, Verifying, and Simulating
7. Nios® V Processor — Remote System Update
8. Nios® V Processor — Using Custom Instruction
9. Nios® V Embedded Processor Design Handbook Archives
10. Document Revision History for the Nios® V Embedded Processor Design Handbook
4.1. Introduction
4.2. Linking Applications
4.3. Nios® V Processor Booting Methods
4.4. Introduction to Nios® V Processor Booting Methods
4.5. Nios® V Processor Booting from Configuration QSPI Flash
4.6. Nios® V Processor Booting from On-Chip Memory (OCRAM)
4.7. Nios® V Processor Booting from Tightly Coupled Memory (TCM)
4.8. Summary of Nios® V Processor Vector Configuration and BSP Settings
6.5.1. Prerequisites
6.5.2. Setting Up and Generating Your Simulation Environment in Platform Designer
6.5.3. Creating Nios V Processor Software
6.5.4. Generating Memory Initialization File
6.5.5. Generating System Simulation Files
6.5.6. Running Simulation in the QuestaSim Simulator Using Command Line
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4.7.1. Nios® V Processor Application Executes in-place from TCM
The tightly coupled memories are initialized during FPGA configuration with data from a Nios® V processor application image. This data is built into the FPGA configuration bitstream. This process eliminates the need for a boot copier, as the Nios® V processor application is already in place at system reset.
Figure 81. Nios® V Processor Application Executes In-Place from OCRAM when FPGA Device Configured from QSPI Flash
Figure 82. Design, Configuration, and Booting Flow