AN 944: Thermal Modeling for Agilex™ 7 FPGAs with the Intel® FPGA Power and Thermal Calculator

ID 683810
Date 9/19/2024
Public

3. Agilex™ 7 FPGA Package Mechanical Design

An Agilex™ 7 FPGA comes in a ball grid array (BGA) package with a copper integrated heat spreader (IHS). The BGA package can be square or rectangle, and can contain up to three types of dies, as follows:

  • Core fabric die. This is the main FPGA die, which contains the basic logic resources, and is available in various sizes and grades. All Agilex™ 7 devices have a single core fabric die.
  • Transceiver die. Transceiver dies are offered in four types: H-Tile, E-Tile, F-Tile, and R-tile. Each transceiver tile type supports certain protocols and transceiver speeds. Depending on the package size, an Agilex™ 7 device can support up to 4 transceiver dies.
  • HBM die. The HBM die is available in 4 high or 8 high configurations. Not all Agilex™ 7 packages have HBM, however those that do can have either one or two HBM dies.

All packages contain solder thermal interface material (TIM1) for enhanced thermal performance.