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1. Answers to Top FAQs
2. Signal Integrity Analysis with Third-Party Tools
3. Reviewing Printed Circuit Board Schematics with the Intel® Quartus® Prime Software
4. Siemens EDA PCB Design Tools Support
5. Cadence Board Design Tools Support
6. Intel Quartus Prime Pro Edition User Guide: PCB Design Tools Document Archives
A. Intel® Quartus® Prime Pro Edition User Guides
2.4.1. IBIS Model Access and Customization Flows
2.4.2. Elements of an IBIS Model
2.4.3. Customizing IBIS Models
2.4.4. Design Simulation Using the Siemens EDA HyperLynx* Software
2.4.5. Configuring LineSim to Use Intel IBIS Models
2.4.6. Integrating Intel IBIS Models into LineSim Simulations
2.4.7. Running and Interpreting LineSim Simulations
2.4.3.1. Customizing Downloaded IBIS Models for Intel® Stratix® 10 Devices, Intel® Arria® 10 Devices, and Intel® Cyclone® 10 GX Devices
2.4.3.2. Generate Custom IBIS Models with the EDA Netlist Writer GUI for Intel® Stratix® 10 Devices, Intel® Arria® 10 Devices, and Intel® Cyclone® 10 GX Devices
2.4.3.3. Customizing IBIS Model Files for Intel Agilex® 7 Devices
2.5.1. Supported Devices and Signaling
2.5.2. Accessing HSPICE Simulation Kits
2.5.3. The Double Counting Problem in HSPICE Simulations
2.5.4. HSPICE Writer Tool Flow
2.5.5. Running an HSPICE Simulation
2.5.6. Interpreting the Results of an Output Simulation
2.5.7. Interpreting the Results of an Input Simulation
2.5.8. Viewing and Interpreting Tabular Simulation Results
2.5.9. Viewing Graphical Simulation Results
2.5.10. Making Design Adjustments Based on HSPICE Simulations
2.5.11. Sample Input for I/O HSPICE Simulation Deck
2.5.12. Sample Output for I/O HSPICE Simulation Deck
2.5.13. Advanced Topics
2.5.4.1. Applying I/O Assignments
2.5.4.2. Enabling HSPICE Writer
2.5.4.3. Enabling HSPICE Writer Using Assignments
2.5.4.4. Naming Conventions for HSPICE Files
2.5.4.5. Invoking HSPICE Writer
2.5.4.6. Invoking HSPICE Writer from the Command Line
2.5.4.7. Customizing Automatically Generated HSPICE Decks
2.5.12.1. Header Comment
2.5.12.2. Simulation Conditions
2.5.12.3. Simulation Options
2.5.12.4. Constant Definition
2.5.12.5. I/O Buffer Netlist
2.5.12.6. Drive Strength
2.5.12.7. Slew Rate and Delay Chain
2.5.12.8. I/O Buffer Instantiation
2.5.12.9. Board and Trace Termination
2.5.12.10. Double-Counting Compensation Circuitry
2.5.12.11. Simulation Analysis
3.1. Reviewing Intel® Quartus® Prime Software Settings
3.2. Reviewing Device Pin-Out Information in the Fitter Report
3.3. Reviewing Compilation Error and Warning Messages
3.4. Using Additional Intel® Quartus® Prime Software Features
3.5. Using Additional Intel® Quartus® Prime Software Tools
3.6. Reviewing Printed Circuit Board Schematics with the Intel® Quartus® Prime Software Revision History
5.1. Cadence PCB Design Tools Support
5.2. Product Comparison
5.3. FPGA-to-PCB Design Flow
5.4. Setting Up the Intel® Quartus® Prime Software
5.5. FPGA-to-Board Integration with the Cadence Allegro Design Entry HDL Software
5.6. FPGA-to-Board Integration with Cadence Allegro Design Entry CIS Software
5.7. Cadence Board Design Tools Support Revision History
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2.3. FPGA to Board Signal Integrity Analysis Flow
Board signal integrity analysis can take place at any point in the FPGA design process and is often performed before and after board layout. If it is performed early in the process as part of a pre-PCB layout analysis, the models used for simulations can be more generic.
These models can be changed as much as required to see how adjustments improve timing or signal integrity and help with the design and routing of the PCB. Simulations and the resulting changes made at this stage allow you to analyze “what if” scenarios to plan and implement your design better. To assist with early board signal integrity analysis, you can download generic IBIS model files for each device family and obtain HSPICE buffer simulation kits from the “Board Level Tools” section of the EDA Tool Support Resource Center.
Typically, if board signal integrity analysis is performed late in the design, it is used for a post-layout verification. The inputs and outputs of the FPGA are defined, and required board routing topologies and constraints are known. Simulations can help you find problems that might still exist in the FPGA or board design before fabrication and assembly. In either case, a simple process flow illustrates how to create accurate IBIS and HSPICE models from a design in the Intel® Quartus® Prime software and transfer them to third-party simulation tools.
Your design depends on the type of model, IBIS or HSPICE, that you use for your simulations. When you understand the steps in the analysis flow, refer to the section of this chapter that corresponds to the model type you are using.
Figure 1. Third-Party Board Signal Integrity Analysis Flow