Intel® Quartus® Prime Pro Edition User Guide: PCB Design Tools

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ID 683768
Date 8/01/2023
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Document Table of Contents
Document Table of Contents x
1. Answers to Top FAQs 2. Signal Integrity Analysis with Third-Party Tools 3. Reviewing Printed Circuit Board Schematics with the Intel® Quartus® Prime Software 4. Siemens EDA PCB Design Tools Support 5. Cadence Board Design Tools Support 6. Intel Quartus Prime Pro Edition User Guide: PCB Design Tools Document Archives A. Intel® Quartus® Prime Pro Edition User Guides
2. Signal Integrity Analysis with Third-Party Tools x
2.1. Signal Integrity Analysis with Third-Party Tools 2.2. I/O Model Selection: IBIS or HSPICE 2.3. FPGA to Board Signal Integrity Analysis Flow 2.4. Simulation with IBIS Models 2.5. Simulation with HSPICE Models 2.6. Signal Integrity Analysis with Third-Party Tools Document Revision History
2.1. Signal Integrity Analysis with Third-Party Tools x
2.1.1. What's New In This Version 2.1.2. Signal Integrity Simulations with HSPICE and IBIS Models
2.3. FPGA to Board Signal Integrity Analysis Flow x
2.3.1. Create I/O and Board Trace Model Assignments 2.3.2. Customize the Output Files 2.3.3. Set Up and Run Simulations in Third-Party Tools 2.3.4. Interpret Simulation Results
2.4. Simulation with IBIS Models x
2.4.1. IBIS Model Access and Customization Flows 2.4.2. Elements of an IBIS Model 2.4.3. Customizing IBIS Models 2.4.4. Design Simulation Using the Siemens EDA HyperLynx* Software 2.4.5. Configuring LineSim to Use Intel IBIS Models 2.4.6. Integrating Intel IBIS Models into LineSim Simulations 2.4.7. Running and Interpreting LineSim Simulations
2.4.3. Customizing IBIS Models x
2.4.3.1. Customizing Downloaded IBIS Models for Intel® Stratix® 10 Devices, Intel® Arria® 10 Devices, and Intel® Cyclone® 10 GX Devices 2.4.3.2. Generate Custom IBIS Models with the EDA Netlist Writer GUI for Intel® Stratix® 10 Devices, Intel® Arria® 10 Devices, and Intel® Cyclone® 10 GX Devices 2.4.3.3. Customizing IBIS Model Files for Intel Agilex® 7 Devices
2.5. Simulation with HSPICE Models x
2.5.1. Supported Devices and Signaling 2.5.2. Accessing HSPICE Simulation Kits 2.5.3. The Double Counting Problem in HSPICE Simulations 2.5.4. HSPICE Writer Tool Flow 2.5.5. Running an HSPICE Simulation 2.5.6. Interpreting the Results of an Output Simulation 2.5.7. Interpreting the Results of an Input Simulation 2.5.8. Viewing and Interpreting Tabular Simulation Results 2.5.9. Viewing Graphical Simulation Results 2.5.10. Making Design Adjustments Based on HSPICE Simulations 2.5.11. Sample Input for I/O HSPICE Simulation Deck 2.5.12. Sample Output for I/O HSPICE Simulation Deck 2.5.13. Advanced Topics
2.5.3. The Double Counting Problem in HSPICE Simulations x
2.5.3.1. Defining the Double Counting Problem 2.5.3.2. The Solution to Double Counting
2.5.4. HSPICE Writer Tool Flow x
2.5.4.1. Applying I/O Assignments 2.5.4.2. Enabling HSPICE Writer 2.5.4.3. Enabling HSPICE Writer Using Assignments 2.5.4.4. Naming Conventions for HSPICE Files 2.5.4.5. Invoking HSPICE Writer 2.5.4.6. Invoking HSPICE Writer from the Command Line 2.5.4.7. Customizing Automatically Generated HSPICE Decks
2.5.11. Sample Input for I/O HSPICE Simulation Deck x
2.5.11.1. Header Comment  Sample Header Comment Block 2.5.11.2. Simulation Conditions 2.5.11.3. Simulation Options 2.5.11.4. Constant Definition 2.5.11.5. Buffer Netlist 2.5.11.6. Drive Strength 2.5.11.7. I/O Buffer Instantiation 2.5.11.8. Board Trace and Termination 2.5.11.9. Stimulus Model 2.5.11.10. Simulation Analysis
2.5.12. Sample Output for I/O HSPICE Simulation Deck x
2.5.12.1. Header Comment 2.5.12.2. Simulation Conditions 2.5.12.3. Simulation Options 2.5.12.4. Constant Definition 2.5.12.5. I/O Buffer Netlist 2.5.12.6. Drive Strength 2.5.12.7. Slew Rate and Delay Chain 2.5.12.8. I/O Buffer Instantiation 2.5.12.9. Board and Trace Termination 2.5.12.10. Double-Counting Compensation Circuitry 2.5.12.11. Simulation Analysis
2.5.13. Advanced Topics x
2.5.13.1. PVT Simulations 2.5.13.2. Hold Time Analysis 2.5.13.3. I/O Voltage Variations 2.5.13.4. Correlation Report
3. Reviewing Printed Circuit Board Schematics with the Intel® Quartus® Prime Software x
3.1. Reviewing Intel® Quartus® Prime Software Settings 3.2. Reviewing Device Pin-Out Information in the Fitter Report 3.3. Reviewing Compilation Error and Warning Messages 3.4. Using Additional Intel® Quartus® Prime Software Features 3.5. Using Additional Intel® Quartus® Prime Software Tools 3.6. Reviewing Printed Circuit Board Schematics with the Intel® Quartus® Prime Software Revision History
3.1. Reviewing Intel® Quartus® Prime Software Settings x
3.1.1. Device and Pins Options Dialog Box Settings
3.1.1. Device and Pins Options Dialog Box Settings x
3.1.1.1. Configuration Settings 3.1.1.2. Unused Pin Settings 3.1.1.3. Dual-Purpose Pins Settings 3.1.1.4. Voltage Settings 3.1.1.5. Error Detection CRC Settings
3.5. Using Additional Intel® Quartus® Prime Software Tools x
3.5.1. Pin Planner
4. Siemens EDA PCB Design Tools Support x
4.1. Integrating with DxDesigner 4.2. Siemens EDA PCB Design Tools Support Revision History
4.1. Integrating with DxDesigner x
4.1.1. DxDesigner Project Settings 4.1.2. Creating Schematic Symbols in DxDesigner
5. Cadence Board Design Tools Support x
5.1. Cadence PCB Design Tools Support 5.2. Product Comparison 5.3. FPGA-to-PCB Design Flow 5.4. Setting Up the Intel® Quartus® Prime Software 5.5. FPGA-to-Board Integration with the Cadence Allegro Design Entry HDL Software 5.6. FPGA-to-Board Integration with Cadence Allegro Design Entry CIS Software 5.7. Cadence Board Design Tools Support Revision History
5.3. FPGA-to-PCB Design Flow x
5.3.1. Integrating Intel FPGA Designs
5.4. Setting Up the Intel® Quartus® Prime Software x
5.4.1. Generating a .pin File
5.5. FPGA-to-Board Integration with the Cadence Allegro Design Entry HDL Software x
5.5.1. Creating Symbols 5.5.2. Instantiating the Symbol in the Cadence Allegro Design Entry HDL Software
5.5.1. Creating Symbols x
5.5.1.1. Cadence Allegro PCB Librarian Part Developer Tool
5.5.1.1. Cadence Allegro PCB Librarian Part Developer Tool x
5.5.1.1.1. Cadence Allegro PCB Librarian Part Developer Tool in the Design Flow 5.5.1.1.2. Import and Export Wizard 5.5.1.1.3. Editing and Fracturing Symbol 5.5.1.1.4. Updating FPGA Symbols
5.6. FPGA-to-Board Integration with Cadence Allegro Design Entry CIS Software x
5.6.1. Creating a Cadence Allegro Design Entry CIS Project 5.6.2. Generating a Part 5.6.3. Generating Schematic Symbol 5.6.4. Splitting a Part 5.6.5. Instantiating a Symbol in a Design Entry CIS Schematic 5.6.6. Intel Libraries for the Cadence Allegro Design Entry CIS Software
5.6.6. Intel Libraries for the Cadence Allegro Design Entry CIS Software x
5.6.6.1. Using the Intel-provided Libraries with your Cadence Allegro Design Entry CIS Project
1. Answers to Top FAQs
2. Signal Integrity Analysis with Third-Party Tools
3. Reviewing Printed Circuit Board Schematics with the Intel® Quartus® Prime Software
4. Siemens EDA PCB Design Tools Support
5. Cadence Board Design Tools Support
6. Intel Quartus Prime Pro Edition User Guide: PCB Design Tools Document Archives
A. Intel® Quartus® Prime Pro Edition User Guides

2.5.11.1. Header Comment

The first block of an input simulation spice deck is the header comment. The purpose of this block is to provide an easily readable summary of how the simulation file has been automatically configured by the Intel® Quartus® Prime software.

This block has two main components: The first component summarizes the I/O configuration relevant information such as device, speed grade, and so on. The second component specifies the exact test condition that the Intel® Quartus® Prime software assumes for the given I/O standard.

 Sample Header Comment Block

* Intel Quartus Prime HSPICE Writer I/O Simulation Deck*
* This spice simulation deck was automatically generated by
* Quartus for the following IO settings:
*
* Device: EP2S60F1020C3
* Speed Grade: C3
* Pin: AA4 (out96)
* Bank: IO Bank 6 (Row I/O)
* I/O Standard: LVTTL, 12mA
* OCT: Off
*
* Intel Quartus Prime’s default I/O timing delays assume the following slow
* corner simulation conditions.
*
* Specified Test Conditions For Intel Quartus Prime Tco
* Temperature: 85C (Slowest Temperature Corner)
* Transistor Model: TT (Typical Transistor Corner)
* Vccn: 3.135V (Vccn_min = Nominal - 5%)
* Vccpd: 2.97V (Vccpd_min = Nominal - 10%)
* Load: No Load
* Vtt: 1.5675V (Voltage reference is Vccn/2)
*
* Note: The I/O transistors are specified to operate at least as
* fast as the TT transistor corner, actual production
* devices can be as fast as the FF corner. Any simulations
* for hold times should be conducted using the fast process
* corner with the following simulation conditions.
* Temperature: 0C (Fastest Commercial Temperature Corner **)
* Transistor Model: FF (Fastest Transistor Corner)
* Vccn: 1.98V (Vccn_hold = Nominal + 10%)
* Vccpd: 3.63V (Vccpd_hold = Nominal + 10%)
* Vtt: 0.95V (Vtt_hold = Vccn/2 - 40mV)
* Vcc: 1.25V (Vcc_hold = Maximum Recommended)
* Package Model: Short-circuit from pad to pin (no parasitics)
*
* Warnings:
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