Intel® Quartus® Prime Pro Edition User Guide: PCB Design Tools

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ID 683768
Date 8/01/2023
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Document Table of Contents
Document Table of Contents x
1. Answers to Top FAQs 2. Signal Integrity Analysis with Third-Party Tools 3. Reviewing Printed Circuit Board Schematics with the Intel® Quartus® Prime Software 4. Siemens EDA PCB Design Tools Support 5. Cadence Board Design Tools Support 6. Intel Quartus Prime Pro Edition User Guide: PCB Design Tools Document Archives A. Intel® Quartus® Prime Pro Edition User Guides
2. Signal Integrity Analysis with Third-Party Tools x
2.1. Signal Integrity Analysis with Third-Party Tools 2.2. I/O Model Selection: IBIS or HSPICE 2.3. FPGA to Board Signal Integrity Analysis Flow 2.4. Simulation with IBIS Models 2.5. Simulation with HSPICE Models 2.6. Signal Integrity Analysis with Third-Party Tools Document Revision History
2.1. Signal Integrity Analysis with Third-Party Tools x
2.1.1. What's New In This Version 2.1.2. Signal Integrity Simulations with HSPICE and IBIS Models
2.3. FPGA to Board Signal Integrity Analysis Flow x
2.3.1. Create I/O and Board Trace Model Assignments 2.3.2. Customize the Output Files 2.3.3. Set Up and Run Simulations in Third-Party Tools 2.3.4. Interpret Simulation Results
2.4. Simulation with IBIS Models x
2.4.1. IBIS Model Access and Customization Flows 2.4.2. Elements of an IBIS Model 2.4.3. Customizing IBIS Models 2.4.4. Design Simulation Using the Siemens EDA HyperLynx* Software 2.4.5. Configuring LineSim to Use Intel IBIS Models 2.4.6. Integrating Intel IBIS Models into LineSim Simulations 2.4.7. Running and Interpreting LineSim Simulations
2.4.3. Customizing IBIS Models x
2.4.3.1. Customizing Downloaded IBIS Models for Intel® Stratix® 10 Devices, Intel® Arria® 10 Devices, and Intel® Cyclone® 10 GX Devices 2.4.3.2. Generate Custom IBIS Models with the EDA Netlist Writer GUI for Intel® Stratix® 10 Devices, Intel® Arria® 10 Devices, and Intel® Cyclone® 10 GX Devices 2.4.3.3. Customizing IBIS Model Files for Intel Agilex® 7 Devices
2.5. Simulation with HSPICE Models x
2.5.1. Supported Devices and Signaling 2.5.2. Accessing HSPICE Simulation Kits 2.5.3. The Double Counting Problem in HSPICE Simulations 2.5.4. HSPICE Writer Tool Flow 2.5.5. Running an HSPICE Simulation 2.5.6. Interpreting the Results of an Output Simulation 2.5.7. Interpreting the Results of an Input Simulation 2.5.8. Viewing and Interpreting Tabular Simulation Results 2.5.9. Viewing Graphical Simulation Results 2.5.10. Making Design Adjustments Based on HSPICE Simulations 2.5.11. Sample Input for I/O HSPICE Simulation Deck 2.5.12. Sample Output for I/O HSPICE Simulation Deck 2.5.13. Advanced Topics
2.5.3. The Double Counting Problem in HSPICE Simulations x
2.5.3.1. Defining the Double Counting Problem 2.5.3.2. The Solution to Double Counting
2.5.4. HSPICE Writer Tool Flow x
2.5.4.1. Applying I/O Assignments 2.5.4.2. Enabling HSPICE Writer 2.5.4.3. Enabling HSPICE Writer Using Assignments 2.5.4.4. Naming Conventions for HSPICE Files 2.5.4.5. Invoking HSPICE Writer 2.5.4.6. Invoking HSPICE Writer from the Command Line 2.5.4.7. Customizing Automatically Generated HSPICE Decks
2.5.11. Sample Input for I/O HSPICE Simulation Deck x
2.5.11.1. Header Comment 2.5.11.2. Simulation Conditions 2.5.11.3. Simulation Options 2.5.11.4. Constant Definition 2.5.11.5. Buffer Netlist 2.5.11.6. Drive Strength 2.5.11.7. I/O Buffer Instantiation 2.5.11.8. Board Trace and Termination 2.5.11.9. Stimulus Model 2.5.11.10. Simulation Analysis
2.5.12. Sample Output for I/O HSPICE Simulation Deck x
2.5.12.1. Header Comment 2.5.12.2. Simulation Conditions 2.5.12.3. Simulation Options 2.5.12.4. Constant Definition 2.5.12.5. I/O Buffer Netlist 2.5.12.6. Drive Strength 2.5.12.7. Slew Rate and Delay Chain 2.5.12.8. I/O Buffer Instantiation 2.5.12.9. Board and Trace Termination 2.5.12.10. Double-Counting Compensation Circuitry   (Part of )Double-Counting Compensation Circuitry Block 2.5.12.11. Simulation Analysis
2.5.13. Advanced Topics x
2.5.13.1. PVT Simulations 2.5.13.2. Hold Time Analysis 2.5.13.3. I/O Voltage Variations 2.5.13.4. Correlation Report
3. Reviewing Printed Circuit Board Schematics with the Intel® Quartus® Prime Software x
3.1. Reviewing Intel® Quartus® Prime Software Settings 3.2. Reviewing Device Pin-Out Information in the Fitter Report 3.3. Reviewing Compilation Error and Warning Messages 3.4. Using Additional Intel® Quartus® Prime Software Features 3.5. Using Additional Intel® Quartus® Prime Software Tools 3.6. Reviewing Printed Circuit Board Schematics with the Intel® Quartus® Prime Software Revision History
3.1. Reviewing Intel® Quartus® Prime Software Settings x
3.1.1. Device and Pins Options Dialog Box Settings
3.1.1. Device and Pins Options Dialog Box Settings x
3.1.1.1. Configuration Settings 3.1.1.2. Unused Pin Settings 3.1.1.3. Dual-Purpose Pins Settings 3.1.1.4. Voltage Settings 3.1.1.5. Error Detection CRC Settings
3.5. Using Additional Intel® Quartus® Prime Software Tools x
3.5.1. Pin Planner
4. Siemens EDA PCB Design Tools Support x
4.1. Integrating with DxDesigner 4.2. Siemens EDA PCB Design Tools Support Revision History
4.1. Integrating with DxDesigner x
4.1.1. DxDesigner Project Settings 4.1.2. Creating Schematic Symbols in DxDesigner
5. Cadence Board Design Tools Support x
5.1. Cadence PCB Design Tools Support 5.2. Product Comparison 5.3. FPGA-to-PCB Design Flow 5.4. Setting Up the Intel® Quartus® Prime Software 5.5. FPGA-to-Board Integration with the Cadence Allegro Design Entry HDL Software 5.6. FPGA-to-Board Integration with Cadence Allegro Design Entry CIS Software 5.7. Cadence Board Design Tools Support Revision History
5.3. FPGA-to-PCB Design Flow x
5.3.1. Integrating Intel FPGA Designs
5.4. Setting Up the Intel® Quartus® Prime Software x
5.4.1. Generating a .pin File
5.5. FPGA-to-Board Integration with the Cadence Allegro Design Entry HDL Software x
5.5.1. Creating Symbols 5.5.2. Instantiating the Symbol in the Cadence Allegro Design Entry HDL Software
5.5.1. Creating Symbols x
5.5.1.1. Cadence Allegro PCB Librarian Part Developer Tool
5.5.1.1. Cadence Allegro PCB Librarian Part Developer Tool x
5.5.1.1.1. Cadence Allegro PCB Librarian Part Developer Tool in the Design Flow 5.5.1.1.2. Import and Export Wizard 5.5.1.1.3. Editing and Fracturing Symbol 5.5.1.1.4. Updating FPGA Symbols
5.6. FPGA-to-Board Integration with Cadence Allegro Design Entry CIS Software x
5.6.1. Creating a Cadence Allegro Design Entry CIS Project 5.6.2. Generating a Part 5.6.3. Generating Schematic Symbol 5.6.4. Splitting a Part 5.6.5. Instantiating a Symbol in a Design Entry CIS Schematic 5.6.6. Intel Libraries for the Cadence Allegro Design Entry CIS Software
5.6.6. Intel Libraries for the Cadence Allegro Design Entry CIS Software x
5.6.6.1. Using the Intel-provided Libraries with your Cadence Allegro Design Entry CIS Project
1. Answers to Top FAQs
2. Signal Integrity Analysis with Third-Party Tools
3. Reviewing Printed Circuit Board Schematics with the Intel® Quartus® Prime Software
4. Siemens EDA PCB Design Tools Support
5. Cadence Board Design Tools Support
6. Intel Quartus Prime Pro Edition User Guide: PCB Design Tools Document Archives
A. Intel® Quartus® Prime Pro Edition User Guides

2.5.12.10. Double-Counting Compensation Circuitry

The double-counting compensation circuitry block of the simulation SPICE deck instantiates a second I/O buffer that is used to measure double-counting. The buffer is configured identically to the user I/O buffer but is connected to the Intel® Quartus® Prime software test load. The simulated delay of this second buffer can be interpreted as the amount of double-counting between the Intel® Quartus® Prime software and HSPICE Writer simulated results.

As the amount of double-counting is constant for a given I/O standard on a given pin, consider separating the double-counting circuitry from the simulation file. In doing so, you can perform any number of I/O simulations while referencing the delay only once.

  (Part of )Double-Counting Compensation Circuitry Block

* Double Counting Compensation Circuitry
*
* The following circuit is designed to calculate the amount of
* double counting between Intel Quartus Prime and the HSPICE models. If
* you have not changed the default simulation temperature or
* transistor corner this spice deck automatically compensates the double
counting.
* In the event you wish to
* simulate an IO at a different temperature or transistor corner
* you need to remove this section of code and manually
* account for double counting. A description of Intel’s
* recommended procedure for this process can be found in the
* Intel Quartus Prime HSPICE Writer AppNote.
* Supply Voltages Settings
.param vcn_tl=3.135
.param vpd_tl=2.97
* Test Load Constant Definition
vopdrain_tl opdrain_tl 0 0
vrambh_tl rambh_tl 0 0
vrpullup_tl rpullup_tl 0 0
* Instantiate Power Supplies
vvccn_tl vccn_tl 0 vcn_tl
vvssn_tl vssn_tl 0 0
vvccpd_tl vccpd_tl 0 vpd_tl
* Instantiate I/O Buffer
xhio_testload din oeb opdrain_tl die_tl rambh_tl
+ rpcdn4 rpcdn3 rpcdn2 rpcdn1 rpcdn0
+ rpcdp4 rpcdp3 rpcdp2 rpcdp1 rpcdp0
+ rpullup_tl vccn_tl vccpd_tl vcpad0_tl hio_buf
* Internal Loading on Pad
xlvds_input_testload die_tl vss vccn_tl lvds_input_load
xlvds_oct_testload die_tl vss vccpd_tl vccn_tl vcpad0_tl vccn_tl
lvds_oct_load
* I/O Buffer Package Model
* - Single-ended I/O standard on a Row I/O
.lib ‘lib/package.lib’ hio
xpkg die pin hio_pkg
* Default Intel Test Load
* - 3.3V LVTTL default test condition is an open load
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