External Memory Interfaces Intel® Stratix® 10 FPGA IP User Guide

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ID 683741
Date 3/11/2022
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Document Table of Contents
Document Table of Contents x
1. Release Information 2. External Memory Interfaces Intel® Stratix® 10 FPGA IP Introduction 3. Intel® Stratix® 10 EMIF IP Product Architecture 4. Intel® Stratix® 10 EMIF IP End-User Signals 5. Intel® Stratix® 10 EMIF – Simulating Memory IP 6. Intel® Stratix® 10 EMIF IP for DDR3 7. Intel® Stratix® 10 EMIF IP for DDR4 8. Intel® Stratix® 10 EMIF IP for QDR II/II+/II+ Xtreme 9. Intel® Stratix® 10 EMIF IP for QDR-IV 10. Intel® Stratix® 10 EMIF IP for RLDRAM 3 11. Intel® Stratix® 10 EMIF IP Timing Closure 12. Optimizing Controller Performance 13. Intel® Stratix® 10 EMIF IP Debugging 14. External Memory Interfaces Intel® Stratix® 10 FPGA IP User Guide Archives 15. Document Revision History for External Memory Interfaces Intel® Stratix® 10 FPGA IP User Guide
2. External Memory Interfaces Intel® Stratix® 10 FPGA IP Introduction x
2.1. Intel® Stratix® 10 EMIF IP Design Flow 2.2. Intel® Stratix® 10 EMIF IP Design Checklist
3. Intel® Stratix® 10 EMIF IP Product Architecture x
3.1. Intel® Stratix® 10 EMIF Architecture: Introduction 3.2. Intel® Stratix® 10 EMIF Sequencer 3.3. Intel® Stratix® 10 EMIF Calibration 3.4. Intel Stratix 10 EMIF IP Controller 3.5. Hardware Resource Sharing Among Multiple Intel® Stratix® 10 EMIFs 3.6. User-requested Reset in Intel® Stratix® 10 EMIF IP 3.7. Intel® Stratix® 10 EMIF for Hard Processor Subsystem 3.8. Intel® Stratix® 10 EMIF Ping Pong PHY
3.1. Intel® Stratix® 10 EMIF Architecture: Introduction x
3.1.1. Intel® Stratix® 10 EMIF Architecture: I/O Subsystem 3.1.2. Intel® Stratix® 10 EMIF Architecture: I/O Column 3.1.3. Intel® Stratix® 10 EMIF Architecture: I/O SSM 3.1.4. Intel® Stratix® 10 EMIF Architecture: I/O Bank 3.1.5. Intel® Stratix® 10 EMIF Architecture: I/O Lane 3.1.6. Intel® Stratix® 10 EMIF Architecture: Input DQS Clock Tree 3.1.7. Intel® Stratix® 10 EMIF Architecture: PHY Clock Tree 3.1.8. Intel® Stratix® 10 EMIF Architecture: PLL Reference Clock Networks 3.1.9. Intel® Stratix® 10 EMIF Architecture: Clock Phase Alignment
3.2. Intel® Stratix® 10 EMIF Sequencer x
3.2.1. Intel® Stratix® 10 EMIF DQS Tracking
3.3. Intel® Stratix® 10 EMIF Calibration x
3.3.1. Intel® Stratix® 10 Calibration Stages 3.3.2. Intel® Stratix® 10 Calibration Stages Descriptions 3.3.3. Intel® Stratix® 10 Calibration Flowchart 3.3.4. Intel® Stratix® 10 Calibration Algorithms
3.4. Intel Stratix 10 EMIF IP Controller x
3.4.1. Hard Memory Controller 3.4.2. Intel® Stratix® 10 Hard Memory Controller Rate Conversion Feature
3.4.1. Hard Memory Controller x
3.4.1.1. Hard Memory Controller Features 3.4.1.2. Hard Memory Controller Main Control Path 3.4.1.3. Data Buffer Controller
3.5. Hardware Resource Sharing Among Multiple Intel® Stratix® 10 EMIFs x
3.5.1. I/O SSM Sharing 3.5.2. I/O Bank Sharing 3.5.3. PLL Reference Clock Sharing 3.5.4. Core Clock Network Sharing
3.7. Intel® Stratix® 10 EMIF for Hard Processor Subsystem x
3.7.1. Restrictions on I/O Bank Usage for Intel® Stratix® 10 EMIF IP with HPS 3.7.2. Using the Legacy EMIF Debug Toolkit with Intel® Stratix® 10 HPS Interfaces 3.7.3. HPS EMIF Simulation
3.8. Intel® Stratix® 10 EMIF Ping Pong PHY x
3.8.1. Intel® Stratix® 10 Ping Pong PHY Feature Description 3.8.2. Intel® Stratix® 10 Ping Pong PHY Architecture 3.8.3. Intel® Stratix® 10 Ping Pong PHY Limitations 3.8.4. Intel® Stratix® 10 Ping Pong PHY Calibration 3.8.5. Using the Ping Pong PHY 3.8.6. Ping Pong PHY Simulation Example Design
4. Intel® Stratix® 10 EMIF IP End-User Signals x
4.1. Interface and Signal Descriptions 4.2. AFI Signals 4.3. AFI 4.0 Timing Diagrams 4.4. Intel® Stratix® 10 Memory Mapped Register (MMR) Tables
4.1. Interface and Signal Descriptions x
4.1.1. Intel Stratix 10 EMIF IP Interfaces for DDR3 4.1.2. Intel Stratix 10 EMIF IP Interfaces for DDR4 4.1.3. Intel Stratix 10 EMIF IP Interfaces for QDR II/II+/II+ Xtreme 4.1.4. Intel Stratix 10 EMIF IP Interfaces for QDR-IV 4.1.5. Intel Stratix 10 EMIF IP Interfaces for RLDRAM 3
4.1.1. Intel Stratix 10 EMIF IP Interfaces for DDR3 x
4.1.1.1. local_reset_req for DDR3 4.1.1.2. local_reset_status for DDR3 4.1.1.3. pll_ref_clk for DDR3 4.1.1.4. pll_locked for DDR3 4.1.1.5. pll_extra_clk_0 for DDR3 4.1.1.6. pll_extra_clk_1 for DDR3 4.1.1.7. pll_extra_clk_2 for DDR3 4.1.1.8. pll_extra_clk_3 for DDR3 4.1.1.9. oct for DDR3 4.1.1.10. mem for DDR3 4.1.1.11. status for DDR3 4.1.1.12. afi_reset_n for DDR3 4.1.1.13. afi_clk for DDR3 4.1.1.14. afi_half_clk for DDR3 4.1.1.15. afi for DDR3 4.1.1.16. emif_usr_reset_n for DDR3 4.1.1.17. emif_usr_clk for DDR3 4.1.1.18. emif_usr_reset_n_sec for DDR3 4.1.1.19. emif_usr_clk_sec for DDR3 4.1.1.20. cal_debug_reset_n for DDR3 4.1.1.21. cal_debug_clk for DDR3 4.1.1.22. cal_debug_out_reset_n for DDR3 4.1.1.23. cal_debug_out_clk for DDR3 4.1.1.24. clks_sharing_master_out for DDR3 4.1.1.25. clks_sharing_slave_in for DDR3 4.1.1.26. clks_sharing_slave_out for DDR3 4.1.1.27. ctrl_amm for DDR3 4.1.1.28. ctrl_auto_precharge for DDR3 4.1.1.29. ctrl_user_priority for DDR3 4.1.1.30. ctrl_ecc_user_interrupt for DDR3 4.1.1.31. ctrl_ecc_readdataerror for DDR3 4.1.1.32. ctrl_ecc_status for DDR3 4.1.1.33. ctrl_mmr_slave for DDR3 4.1.1.34. hps_emif for DDR3 4.1.1.35. cal_debug for DDR3 4.1.1.36. cal_debug_out for DDR3
4.1.2. Intel Stratix 10 EMIF IP Interfaces for DDR4 x
4.1.2.1. local_reset_req for DDR4 4.1.2.2. local_reset_status for DDR4 4.1.2.3. pll_ref_clk for DDR4 4.1.2.4. pll_locked for DDR4 4.1.2.5. pll_extra_clk_0 for DDR4 4.1.2.6. pll_extra_clk_1 for DDR4 4.1.2.7. pll_extra_clk_2 for DDR4 4.1.2.8. pll_extra_clk_3 for DDR4 4.1.2.9. ac_parity_err for DDR4 4.1.2.10. oct for DDR4 4.1.2.11. mem for DDR4 4.1.2.12. status for DDR4 4.1.2.13. afi_reset_n for DDR4 4.1.2.14. afi_clk for DDR4 4.1.2.15. afi_half_clk for DDR4 4.1.2.16. afi for DDR4 4.1.2.17. emif_usr_reset_n for DDR4 4.1.2.18. emif_usr_clk for DDR4 4.1.2.19. emif_usr_reset_n_sec for DDR4 4.1.2.20. emif_usr_clk_sec for DDR4 4.1.2.21. cal_debug_reset_n for DDR4 4.1.2.22. cal_debug_clk for DDR4 4.1.2.23. cal_debug_out_reset_n for DDR4 4.1.2.24. cal_debug_out_clk for DDR4 4.1.2.25. clks_sharing_master_out for DDR4 4.1.2.26. clks_sharing_slave_in for DDR4 4.1.2.27. clks_sharing_slave_out for DDR4 4.1.2.28. ctrl_amm for DDR4 4.1.2.29. ctrl_auto_precharge for DDR4 4.1.2.30. ctrl_user_priority for DDR4 4.1.2.31. ctrl_ecc_user_interrupt for DDR4 4.1.2.32. ctrl_ecc_readdataerror for DDR4 4.1.2.33. ctrl_ecc_status for DDR4 4.1.2.34. ctrl_mmr_slave for DDR4 4.1.2.35. hps_emif for DDR4 4.1.2.36. cal_debug for DDR4 4.1.2.37. cal_debug_out for DDR4
4.1.3. Intel Stratix 10 EMIF IP Interfaces for QDR II/II+/II+ Xtreme x
4.1.3.1. local_reset_req for QDR II/II+/II+ Xtreme 4.1.3.2. local_reset_status for QDR II/II+/II+ Xtreme 4.1.3.3. pll_ref_clk for QDR II/II+/II+ Xtreme 4.1.3.4. pll_locked for QDR II/II+/II+ Xtreme 4.1.3.5. pll_extra_clk_0 for QDR II/II+/II+ Xtreme 4.1.3.6. pll_extra_clk_1 for QDR II/II+/II+ Xtreme 4.1.3.7. pll_extra_clk_2 for QDR II/II+/II+ Xtreme 4.1.3.8. pll_extra_clk_3 for QDR II/II+/II+ Xtreme 4.1.3.9. oct for QDR II/II+/II+ Xtreme 4.1.3.10. mem for QDR II/II+/II+ Xtreme 4.1.3.11. status for QDR II/II+/II+ Xtreme 4.1.3.12. emif_usr_reset_n for QDR II/II+/II+ Xtreme 4.1.3.13. emif_usr_clk for QDR II/II+/II+ Xtreme 4.1.3.14. cal_debug_reset_n for QDR II/II+/II+ Xtreme 4.1.3.15. cal_debug_clk for QDR II/II+/II+ Xtreme 4.1.3.16. cal_debug_out_reset_n for QDR II/II+/II+ Xtreme 4.1.3.17. cal_debug_out_clk for QDR II/II+/II+ Xtreme 4.1.3.18. clks_sharing_master_out for QDR II/II+/II+ Xtreme 4.1.3.19. clks_sharing_slave_in for QDR II/II+/II+ Xtreme 4.1.3.20. clks_sharing_slave_out for QDR II/II+/II+ Xtreme 4.1.3.21. ctrl_amm for QDR II/II+/II+ Xtreme 4.1.3.22. cal_debug for QDR II/II+/II+ Xtreme 4.1.3.23. cal_debug_out for QDR II/II+/II+ Xtreme
4.1.4. Intel Stratix 10 EMIF IP Interfaces for QDR-IV x
4.1.4.1. local_reset_req for QDR-IV 4.1.4.2. local_reset_status for QDR-IV 4.1.4.3. pll_ref_clk for QDR-IV 4.1.4.4. pll_locked for QDR-IV 4.1.4.5. pll_extra_clk_0 for QDR-IV 4.1.4.6. pll_extra_clk_1 for QDR-IV 4.1.4.7. pll_extra_clk_2 for QDR-IV 4.1.4.8. pll_extra_clk_3 for QDR-IV 4.1.4.9. oct for QDR-IV 4.1.4.10. mem for QDR-IV 4.1.4.11. status for QDR-IV 4.1.4.12. afi_reset_n for QDR-IV 4.1.4.13. afi_clk for QDR-IV 4.1.4.14. afi_half_clk for QDR-IV 4.1.4.15. afi for QDR-IV 4.1.4.16. emif_usr_reset_n for QDR-IV 4.1.4.17. emif_usr_clk for QDR-IV 4.1.4.18. cal_debug_reset_n for QDR-IV 4.1.4.19. cal_debug_clk for QDR-IV 4.1.4.20. cal_debug_out_reset_n for QDR-IV 4.1.4.21. cal_debug_out_clk for QDR-IV 4.1.4.22. clks_sharing_master_out for QDR-IV 4.1.4.23. clks_sharing_slave_in for QDR-IV 4.1.4.24. clks_sharing_slave_out for QDR-IV 4.1.4.25. ctrl_amm for QDR-IV 4.1.4.26. cal_debug for QDR-IV 4.1.4.27. cal_debug_out for QDR-IV
4.1.5. Intel Stratix 10 EMIF IP Interfaces for RLDRAM 3 x
4.1.5.1. local_reset_req for RLDRAM 3 4.1.5.2. local_reset_status for RLDRAM 3 4.1.5.3. pll_ref_clk for RLDRAM 3 4.1.5.4. pll_locked for RLDRAM 3 4.1.5.5. pll_extra_clk_0 for RLDRAM 3 4.1.5.6. pll_extra_clk_1 for RLDRAM 3 4.1.5.7. pll_extra_clk_2 for RLDRAM 3 4.1.5.8. pll_extra_clk_3 for RLDRAM 3 4.1.5.9. oct for RLDRAM 3 4.1.5.10. mem for RLDRAM 3 4.1.5.11. status for RLDRAM 3 4.1.5.12. afi_reset_n for RLDRAM 3 4.1.5.13. afi_clk for RLDRAM 3 4.1.5.14. afi_half_clk for RLDRAM 3 4.1.5.15. afi for RLDRAM 3 4.1.5.16. cal_debug_reset_n for RLDRAM 3 4.1.5.17. cal_debug_clk for RLDRAM 3 4.1.5.18. cal_debug_out_reset_n for RLDRAM 3 4.1.5.19. cal_debug_out_clk for RLDRAM 3 4.1.5.20. clks_sharing_master_out for RLDRAM 3 4.1.5.21. clks_sharing_slave_in for RLDRAM 3 4.1.5.22. clks_sharing_slave_out for RLDRAM 3 4.1.5.23. cal_debug for RLDRAM 3 4.1.5.24. cal_debug_out for RLDRAM 3
4.2. AFI Signals x
4.2.1. AFI Clock and Reset Signals 4.2.2. AFI Address and Command Signals 4.2.3. AFI Write Data Signals 4.2.4. AFI Read Data Signals 4.2.5. AFI Calibration Status Signals 4.2.6. AFI Shadow Register Management Signals
4.3. AFI 4.0 Timing Diagrams x
4.3.1. AFI Address and Command Timing Diagrams 4.3.2. AFI Write Sequence Timing Diagrams 4.3.3. AFI Read Sequence Timing Diagrams 4.3.4. AFI Calibration Status Timing Diagram
4.4. Intel® Stratix® 10 Memory Mapped Register (MMR) Tables x
4.4.1. ctrlcfg0 4.4.2. ctrlcfg1 4.4.3. dramtiming0 4.4.4. caltiming0 4.4.5. caltiming1 4.4.6. caltiming2 4.4.7. caltiming3 4.4.8. caltiming4 4.4.9. caltiming9 4.4.10. dramaddrw 4.4.11. sideband0 4.4.12. sideband1 4.4.13. sideband4 4.4.14. sideband6 4.4.15. sideband7 4.4.16. sideband9 4.4.17. sideband11 4.4.18. sideband12 4.4.19. sideband13 4.4.20. sideband14 4.4.21. dramsts 4.4.22. niosreserve0 4.4.23. niosreserve1 4.4.24. sideband16 4.4.25. ecc3: ECC Error and Interrupt Configuration 4.4.26. ecc4: Status and Error Information 4.4.27. ecc5: Address of Most Recent SBE/DBE 4.4.28. ecc6: Address of Most Recent Correction Command Dropped 4.4.29. ecc7: Extension for Address of Most Recent SBE/DBE 4.4.30. ecc8: Extension for Address of Most Recent Correction Command Dropped
5. Intel® Stratix® 10 EMIF – Simulating Memory IP x
5.1. Simulation Options 5.2. HPS EMIF Simulation 5.3. Simulation Walkthrough
5.3. Simulation Walkthrough x
5.3.1. Calibration Modes 5.3.2. Abstract PHY Simulation 5.3.3. Simulation Scripts 5.3.4. Functional Simulation with Verilog HDL 5.3.5. Functional Simulation with VHDL 5.3.6. Simulating the Design Example
5.3.6. Simulating the Design Example x
5.3.6.1. User-requested Reset in Intel® Stratix® 10 EMIF IP
6. Intel® Stratix® 10 EMIF IP for DDR3 x
6.1. Parameter Descriptions 6.2. Register Map IP-XACT Support for Intel® Stratix® 10 EMIF DDR3 IP 6.3. Board Skew Equations 6.4. Pin and Resource Planning 6.5. DDR3 Board Design Guidelines
6.1. Parameter Descriptions x
6.1.1. Intel Stratix 10 EMIF IP DDR3 Parameters: General 6.1.2. Intel Stratix 10 EMIF IP DDR3 Parameters: FPGA I/O 6.1.3. Intel Stratix 10 EMIF IP DDR3 Parameters: Memory 6.1.4. Intel Stratix 10 EMIF IP DDR3 Parameters: Mem I/O 6.1.5. Intel Stratix 10 EMIF IP DDR3 Parameters: Mem Timing 6.1.6. Intel Stratix 10 EMIF IP DDR3 Parameters: Board 6.1.7. Intel Stratix 10 EMIF IP DDR3 Parameters: Controller 6.1.8. Intel Stratix 10 EMIF IP DDR3 Parameters: Diagnostics 6.1.9. Intel Stratix 10 EMIF IP DDR3 Parameters: Example Designs
6.3. Board Skew Equations x
6.3.1. Equations for DDR3 Board Skew Parameters
6.4. Pin and Resource Planning x
6.4.1. Interface Pins 6.4.2. FPGA Resources 6.4.3. Pin Guidelines for Intel® Stratix® 10 EMIF IP
6.4.1. Interface Pins x
6.4.1.1. Estimating Pin Requirements 6.4.1.2. DIMM Options 6.4.1.3. Maximum Number of Interfaces
6.4.2. FPGA Resources x
6.4.2.1. OCT 6.4.2.2. PLL
6.4.3. Pin Guidelines for Intel® Stratix® 10 EMIF IP x
6.4.3.1. General Guidelines 6.4.3.2. x4 DIMM Implementation 6.4.3.3. Command and Address Signals 6.4.3.4. Clock Signals 6.4.3.5. Data, Data Strobes, DM/DBI, and Optional ECC Signals 6.4.3.6. Resource Sharing Guidelines (Multiple Interfaces) 6.4.3.7. Ping-Pong PHY Implementation
6.5. DDR3 Board Design Guidelines x
6.5.1. Terminations and Slew Rates with Intel® Stratix® 10 Devices 6.5.2. Channel Signal Integrity Measurement 6.5.3. Layout Approach 6.5.4. Design Layout Guidelines 6.5.5. Package Deskew
6.5.1. Terminations and Slew Rates with Intel® Stratix® 10 Devices x
6.5.1.1. Dynamic On-Chip Termination (OCT) in Intel® Stratix® 10 Devices 6.5.1.2. Choosing Terminations on Intel® Stratix® 10 Devices 6.5.1.3. On-Chip Termination Recommendations for Intel® Stratix® 10 Devices 6.5.1.4. Slew Rates
6.5.2. Channel Signal Integrity Measurement x
6.5.2.1. Importance of Accurate Channel Signal Integrity Information 6.5.2.2. Understanding Channel Signal Integrity Measurement 6.5.2.3. How to Enter Calculated Channel Signal Integrity Values 6.5.2.4. Guidelines for Calculating DDR3 Channel Signal Integrity
6.5.4. Design Layout Guidelines x
6.5.4.1. General Layout Guidelines 6.5.4.2. Layout Guidelines 6.5.4.3. Length Matching Rules 6.5.4.4. Spacing Guidelines 6.5.4.5. Fly-By Network Design for Clock, Command, and Address Signals
6.5.5. Package Deskew x
6.5.5.1. DQ/DQS/DM Deskew 6.5.5.2. Address and Command Deskew 6.5.5.3. Package Deskew Recommendations for Intel® Stratix® 10 Devices 6.5.5.4. Deskew Example 6.5.5.5. Package Migration
7. Intel® Stratix® 10 EMIF IP for DDR4 x
7.1. Parameter Descriptions 7.2. Register Map IP-XACT Support for Intel® Stratix® 10 EMIF DDR4 IP 7.3. Board Skew Equations 7.4. Pin and Resource Planning 7.5. DDR4 Board Design Guidelines
7.1. Parameter Descriptions x
7.1.1. Intel Stratix 10 EMIF IP DDR4 Parameters: General 7.1.2. Intel Stratix 10 EMIF IP DDR4 Parameters: FPGA I/O 7.1.3. Intel Stratix 10 EMIF IP DDR4 Parameters: Memory 7.1.4. Intel Stratix 10 EMIF IP DDR4 Parameters: Mem I/O 7.1.5. Intel Stratix 10 EMIF IP DDR4 Parameters: Mem Timing 7.1.6. Intel Stratix 10 EMIF IP DDR4 Parameters: Board 7.1.7. Intel Stratix 10 EMIF IP DDR4 Parameters: Controller 7.1.8. Intel Stratix 10 EMIF IP DDR4 Parameters: Diagnostics 7.1.9. Intel Stratix 10 EMIF IP DDR4 Parameters: Example Designs
7.3. Board Skew Equations x
7.3.1. Equations for DDR4 Board Skew Parameters
7.4. Pin and Resource Planning x
7.4.1. Interface Pins 7.4.2. FPGA Resources 7.4.3. Pin Guidelines for Intel® Stratix® 10 EMIF IP 7.4.4. Resource Sharing Guidelines (Multiple Interfaces)
7.4.1. Interface Pins x
7.4.1.1. Estimating Pin Requirements 7.4.1.2. DIMM Options 7.4.1.3. Maximum Number of Interfaces
7.4.2. FPGA Resources x
7.4.2.1. OCT 7.4.2.2. PLL
7.4.3. Pin Guidelines for Intel® Stratix® 10 EMIF IP x
7.4.3.1. General Guidelines 7.4.3.2. x4 DIMM Implementation 7.4.3.3. Command and Address Signals 7.4.3.4. Clock Signals 7.4.3.5. Data, Data Strobes, DM/DBI, and Optional ECC Signals 7.4.3.6. alert_n Pin Termination Recommendation
7.5. DDR4 Board Design Guidelines x
7.5.1. Terminations and Slew Rates with Intel® Stratix® 10 Devices 7.5.2. Channel Signal Integrity Measurement 7.5.3. Layout Approach 7.5.4. Design Layout Guidelines 7.5.5. Package Deskew
7.5.1. Terminations and Slew Rates with Intel® Stratix® 10 Devices x
7.5.1.1. Dynamic On-Chip Termination (OCT) in Intel® Stratix® 10 Devices 7.5.1.2. Dynamic On-Die Termination (ODT) in DDR4 7.5.1.3. Choosing Terminations on Intel® Stratix® 10 Devices 7.5.1.4. On-Chip Termination Recommendations for Intel® Stratix® 10 Devices 7.5.1.5. Slew Rates
7.5.2. Channel Signal Integrity Measurement x
7.5.2.1. Importance of Accurate Channel Signal Integrity Information 7.5.2.2. Understanding Channel Signal Integrity Measurement 7.5.2.3. How to Enter Calculated Channel Signal Integrity Values 7.5.2.4. Guidelines for Calculating DDR4 Channel Signal Integrity
7.5.4. Design Layout Guidelines x
7.5.4.1. General Layout Guidelines 7.5.4.2. Layout Guidelines 7.5.4.3. Length Matching Rules 7.5.4.4. Spacing Guidelines 7.5.4.5. Layout Guidelines for DDR3 and DDR4 SDRAM Wide Interface (>72 bits) 7.5.4.6. Fly-By Network Design for Clock, Command, and Address Signals 7.5.4.7. Clamshell Topology 7.5.4.8. Additional Layout Guidelines for DDR4 Twin-die Devices
7.5.5. Package Deskew x
7.5.5.1. DQ/DQS/DM Deskew 7.5.5.2. Address and Command Deskew 7.5.5.3. Package Deskew Recommendations for Intel® Stratix® 10 Devices 7.5.5.4. Deskew Example 7.5.5.5. Package Migration
8. Intel® Stratix® 10 EMIF IP for QDR II/II+/II+ Xtreme x
8.1. Parameter Descriptions 8.2. Board Skew Equations 8.3. Pin and Resource Planning 8.4. QDR II/II+/II+ Xtreme Board Design Guidelines
8.1. Parameter Descriptions x
8.1.1. Intel Stratix 10 EMIF IP QDR II/II+/II+ Xtreme Parameters: General 8.1.2. Intel Stratix 10 EMIF IP QDR II/II+/II+ Xtreme Parameters: FPGA I/O 8.1.3. Intel Stratix 10 EMIF IP QDR II/II+/II+ Xtreme Parameters: Memory 8.1.4. Intel Stratix 10 EMIF IP QDR II/II+/II+ Xtreme Parameters: Mem Timing 8.1.5. Intel Stratix 10 EMIF IP QDR II/II+/II+ Xtreme Parameters: Board 8.1.6. Intel Stratix 10 EMIF IP QDR II/II+/II+ Xtreme Parameters: Controller 8.1.7. Intel Stratix 10 EMIF IP QDR II/II+/II+ Xtreme Parameters: Diagnostics 8.1.8. Intel Stratix 10 EMIF IP QDR II/II+/II+ Xtreme Parameters: Example Designs
8.2. Board Skew Equations x
8.2.1. Equations for QDRII, QDRII+, and QDRII+ Xtreme Board Skew Parameters
8.3. Pin and Resource Planning x
8.3.1. Interface Pins
8.3.1. Interface Pins x
8.3.1.1. Estimating Pin Requirements 8.3.1.2. Maximum Number of Interfaces 8.3.1.3. FPGA Resources 8.3.1.4. OCT 8.3.1.5. PLL 8.3.1.6. Pin Guidelines for Intel® Stratix® 10 EMIF IP
8.3.1.6. Pin Guidelines for Intel® Stratix® 10 EMIF IP x
8.3.1.6.1. General Guidelines 8.3.1.6.2. QDR II, QDR II+ and QDR II+ Xtreme SRAM Command Signals 8.3.1.6.3. QDR II, QDR II+ and QDR II+ Xtreme SRAM Address Signals 8.3.1.6.4. QDR II, QDR II+, and QDR II+ Xtreme SRAM Clock Signals 8.3.1.6.5. QDR II, QDR II+ and QDR II+ Xtreme SRAM Data, BWS, and QVLD Signals 8.3.1.6.6. Resource Sharing Guidelines (Multiple Interfaces)
8.4. QDR II/II+/II+ Xtreme Board Design Guidelines x
8.4.1. QDR II SRAM Configurations 8.4.2. General Layout Guidelines 8.4.3. QDR II Layout Guidelines 8.4.4. QDR II SRAM Layout Approach 8.4.5. Package Deskew 8.4.6. Package Migration 8.4.7. Slew Rates
9. Intel® Stratix® 10 EMIF IP for QDR-IV x
9.1. Parameter Descriptions 9.2. Board Skew Equations 9.3. Pin and Resource Planning 9.4. QDR-IV Board Design Guidelines
9.1. Parameter Descriptions x
9.1.1. Intel Stratix 10 EMIF IP QDR-IV Parameters: General 9.1.2. Intel Stratix 10 EMIF IP QDR-IV Parameters: FPGA I/O 9.1.3. Intel Stratix 10 EMIF IP QDR-IV Parameters: Memory 9.1.4. Intel Stratix 10 EMIF IP QDR-IV Parameters: Mem Timing 9.1.5. Intel Stratix 10 EMIF IP QDR-IV Parameters: Board 9.1.6. Intel Stratix 10 EMIF IP QDR-IV Parameters: Controller 9.1.7. Intel Stratix 10 EMIF IP QDR-IV Parameters: Diagnostics 9.1.8. Intel Stratix 10 EMIF IP QDR-IV Parameters: Example Designs
9.2. Board Skew Equations x
9.2.1. Equations for QDR-IV Board Skew Parameters
9.3. Pin and Resource Planning x
9.3.1. Interface Pins
9.3.1. Interface Pins x
9.3.1.1. Estimating Pin Requirements 9.3.1.2. Maximum Number of Interfaces 9.3.1.3. FPGA Resources 9.3.1.4. OCT 9.3.1.5. PLL 9.3.1.6. Pin Guidelines for Intel® Stratix® 10 EMIF IP 9.3.1.7. Resource Sharing Guidelines (Multiple Interfaces)
9.3.1.6. Pin Guidelines for Intel® Stratix® 10 EMIF IP x
9.3.1.6.1. General Guidelines 9.3.1.6.2. QDR IV SRAM Commands and Addresses, AP, and AINV Signals 9.3.1.6.3. QDR IV SRAM Clock Signals 9.3.1.6.4. QDR IV SRAM Data, DINV, and QVLD Signals
9.4. QDR-IV Board Design Guidelines x
9.4.1. QDR-IV Layout Approach 9.4.2. General Layout Guidelines 9.4.3. QDR-IV Layout Guidelines 9.4.4. Package Deskew 9.4.5. Package Migration 9.4.6. Slew Rates
10. Intel® Stratix® 10 EMIF IP for RLDRAM 3 x
10.1. Parameter Descriptions 10.2. Board Skew Equations 10.3. Pin and Resource Planning 10.4. RLDRAM 3 Board Design Guidelines
10.1. Parameter Descriptions x
10.1.1. Intel Stratix 10 EMIF IP RLDRAM 3 Parameters: General 10.1.2. Intel Stratix 10 EMIF IP RLDRAM 3 Parameters: FPGA I/O 10.1.3. Intel Stratix 10 EMIF IP RLDRAM 3 Parameters: Memory 10.1.4. Intel Stratix 10 EMIF IP RLDRAM 3 Parameters: Mem Timing 10.1.5. Intel Stratix 10 EMIF IP RLDRAM 3 Parameters: Board 10.1.6. Intel Stratix 10 EMIF IP RLDRAM 3 Parameters: Diagnostics 10.1.7. Intel Stratix 10 EMIF IP RLDRAM 3 Parameters: Example Designs
10.2. Board Skew Equations x
10.2.1. Equations for RLDRAM 3 Board Skew Parameters
10.3. Pin and Resource Planning x
10.3.1. Interface Pins
10.3.1. Interface Pins x
10.3.1.1. Estimating Pin Requirements 10.3.1.2. Maximum Number of Interfaces 10.3.1.3. FPGA Resources 10.3.1.4. OCT 10.3.1.5. PLL 10.3.1.6. Pin Guidelines for Intel® Stratix® 10 EMIF IP 10.3.1.7. Resource Sharing Guidelines (Multiple Interfaces)
10.3.1.6. Pin Guidelines for Intel® Stratix® 10 EMIF IP x
10.3.1.6.1. General Guidelines 10.3.1.6.2. RLDRAM 3 Commands and Addresses 10.3.1.6.3. RLDRAM 3 Clock Signals 10.3.1.6.4. RLDRAM 3 Data, DM and QVLD Signals
10.4. RLDRAM 3 Board Design Guidelines x
10.4.1. RLDRAM 3 Configurations 10.4.2. General Layout Guidelines 10.4.3. RLDRAM 3 Layout Guidelines 10.4.4. Layout Approach 10.4.5. Package Deskew 10.4.6. Package Migration 10.4.7. Slew Rates
11. Intel® Stratix® 10 EMIF IP Timing Closure x
11.1. Timing Closure 11.2. Timing Report DDR 11.3. Optimizing Timing 11.4. Early I/O Timing Estimation
11.1. Timing Closure x
11.1.1. Timing Analysis
11.1.1. Timing Analysis x
11.1.1.1. PHY or Core 11.1.1.2. I/O Timing
11.1.1.2. I/O Timing x
11.1.1.2.1. Read Capture 11.1.1.2.2. Write 11.1.1.2.3. Address and Command 11.1.1.2.4. DQS Gating / Postamble 11.1.1.2.5. Write Leveling
11.4. Early I/O Timing Estimation x
11.4.1. Performing Early I/O Timing Analysis
12. Optimizing Controller Performance x
12.1. Interface Standard 12.2. Bank Management Efficiency 12.3. Data Transfer 12.4. Improving Controller Efficiency
12.4. Improving Controller Efficiency x
12.4.1. Auto-Precharge Commands 12.4.2. Latency 12.4.3. Calibration 12.4.4. Bank Interleaving 12.4.5. Additive Latency and Bank Interleaving 12.4.6. User-Controlled Refresh 12.4.7. Frequency of Operation 12.4.8. Series of Reads or Writes 12.4.9. Data Reordering 12.4.10. Starvation Control 12.4.11. Command Reordering 12.4.12. Bandwidth 12.4.13. Enable Command Priority Control
12.4.2. Latency x
12.4.2.1. Additive Latency
12.4.6. User-Controlled Refresh x
12.4.6.1. Back-to-Back User-Controlled Refresh Usage
13. Intel® Stratix® 10 EMIF IP Debugging x
13.1. Interface Configuration Performance Issues 13.2. Functional Issue Evaluation 13.3. Timing Issue Characteristics 13.4. Verifying Memory IP Using the Signal Tap II Logic Analyzer 13.5. Hardware Debugging Guidelines 13.6. Categorizing Hardware Issues 13.7. Debugging Intel® Stratix® 10 EMIF IP 13.8. Using the Default Traffic Generator 13.9. Using the Configurable Traffic Generator (TG2)
13.1. Interface Configuration Performance Issues x
13.1.1. Interface Configuration Bottleneck and Efficiency Issues
13.2. Functional Issue Evaluation x
13.2.1. Intel® IP Memory Model 13.2.2. Vendor Memory Model 13.2.3. Transcript Window Messages 13.2.4. Modifying the Example Driver to Replicate the Failure
13.3. Timing Issue Characteristics x
13.3.1. Evaluating FPGA Timing Issues 13.3.2. Evaluating External Memory Interface Timing Issues
13.4. Verifying Memory IP Using the Signal Tap II Logic Analyzer x
13.4.1. Signals to Monitor with the Signal Tap II Logic Analyzer
13.5. Hardware Debugging Guidelines x
13.5.1. Create a Simplified Design that Demonstrates the Same Issue 13.5.2. Measure Power Distribution Network 13.5.3. Measure Signal Integrity and Setup and Hold Margin 13.5.4. Vary Voltage 13.5.5. Operate at a Lower Speed 13.5.6. Determine Whether the Issue Exists in Previous Versions of Software 13.5.7. Determine Whether the Issue Exists in the Current Version of Software 13.5.8. Try A Different PCB 13.5.9. Try Other Configurations 13.5.10. Debugging Checklist
13.6. Categorizing Hardware Issues x
13.6.1. Signal Integrity Issues 13.6.2. Hardware and Calibration Issues
13.6.1. Signal Integrity Issues x
13.6.1.1. Characteristics of Signal Integrity Issues 13.6.1.2. Evaluating SignaI Integrity Issues
13.6.1.2. Evaluating SignaI Integrity Issues x
13.6.1.2.1. Skew 13.6.1.2.2. Crosstalk 13.6.1.2.3. Power System 13.6.1.2.4. Clock Signals 13.6.1.2.5. Read Data Valid Window and Eye Diagram 13.6.1.2.6. Write Data Valid Window and Eye Diagram 13.6.1.2.7. OCT and ODT Usage
13.6.2. Hardware and Calibration Issues x
13.6.2.1. Postamble Timing Issues and Margin 13.6.2.2. Intermittent Issue Evaluation
13.7. Debugging Intel® Stratix® 10 EMIF IP x
13.7.1. Debugging With the Legacy External Memory Interface Debug Toolkit 13.7.2. Debugging with the External Memory Interface Unified Calibration Debug Toolkit 13.7.3. On-Chip Debug Port for Intel® Stratix® 10 EMIF IP 13.7.4. Legacy Efficiency Monitor and Protocol Checker 13.7.5. New Efficiency Monitor
13.7.1. Debugging With the Legacy External Memory Interface Debug Toolkit x
13.7.1.1. User Interface 13.7.1.2. Communication 13.7.1.3. Setup and Use 13.7.1.4. Configuring Your EMIF IP for Use with the Legacy Debug Toolkit 13.7.1.5. Reports 13.7.1.6. On-Die Termination Calibration 13.7.1.7. Eye Diagram 13.7.1.8. Driver Margining for Intel® Stratix® 10 EMIF IP 13.7.1.9. Example Tcl Script for Running the Legacy EMIF Debug Toolkit 13.7.1.10. Using the Legacy EMIF Debug Toolkit with Intel® Stratix® 10 HPS Interfaces
13.7.1.4. Configuring Your EMIF IP for Use with the Legacy Debug Toolkit x
13.7.1.4.1. Daisy-Chaining Additional EMIF IP Cores for Debugging 13.7.1.4.2. General Workflow 13.7.1.4.3. Linking the Project to a Device 13.7.1.4.4. Establishing Communication to Connections 13.7.1.4.5. Selecting an Active Interface
13.7.1.8. Driver Margining for Intel® Stratix® 10 EMIF IP x
13.7.1.8.1. Determining Margin
13.7.2. Debugging with the External Memory Interface Unified Calibration Debug Toolkit x
13.7.2.1. Prerequisites for Using the EMIF Unified Calibration Debug Toolkit 13.7.2.2. Configuring a Design to use the EMIF Unified Calibration Debug Toolkit 13.7.2.3. Launching the EMIF Debug Toolkit 13.7.2.4. Using the EMIF Debug Toolkit 13.7.2.5. Exporting Tables 13.7.2.6. Viewing Diagrams in the Eye Viewer 13.7.2.7. Guidelines for Debugging Calibration Issues
13.7.2.2. Configuring a Design to use the EMIF Unified Calibration Debug Toolkit x
13.7.2.2.1. Generating a Design Example with the Debug Toolkit 13.7.2.2.2. Adding Interfaces to an Design Example 13.7.2.2.3. Enabling the EMIF Unified Calibration Debug Toolkit in an Existing Design
13.7.2.4. Using the EMIF Debug Toolkit x
13.7.2.4.1. Memory Configuration Tab 13.7.2.4.2. Calibration Tab 13.7.2.4.3. Calibration Report Tab 13.7.2.4.4. Calibrate Termination Tab 13.7.2.4.5. Vref Margining Tab 13.7.2.4.6. Driver Margining Tab 13.7.2.4.7. ISSP Tab 13.7.2.4.8. Pin Delay Settings Tab
13.7.2.7. Guidelines for Debugging Calibration Issues x
13.7.2.7.1. Debugging Calibration Failure Using Information from the Calibration report 13.7.2.7.2. Debugging Address and Command Leveling Calibration Failure 13.7.2.7.3. Debugging Address and Command Deskew Failure 13.7.2.7.4. Debugging DQS Enable Failure 13.7.2.7.5. Debugging Read Deskew Calibration Failure 13.7.2.7.6. Debugging VREFIN Calibration Failure 13.7.2.7.7. Debugging LFIFO Calibration Failure 13.7.2.7.8. Debugging Write Leveling Failure 13.7.2.7.9. Debugging Write Deskew Calibration Failure 13.7.2.7.10. Debugging VREFOUT Calibration Failure
13.7.3. On-Chip Debug Port for Intel® Stratix® 10 EMIF IP x
13.7.3.1. EMIF On-Chip Debug Port 13.7.3.2. Access Protocol
13.7.4. Legacy Efficiency Monitor and Protocol Checker x
13.7.4.1. Including the Legacy Efficiency Monitor and Protocol Checker in Your Generated IP 13.7.4.2. Running the Legacy Efficiency Monitor with the External Memory Debug Toolkit 13.7.4.3. Communicating Directly to the Legacy Efficiency Monitor and Protocol Checker
13.7.5. New Efficiency Monitor x
13.7.5.1. Enabling the Efficiency Monitor in a Design Example 13.7.5.2. Efficiency Monitor Block Descriptions 13.7.5.3. Control and Status Registers 13.7.5.4. Opening the Efficiency Monitor
13.8. Using the Default Traffic Generator x
13.8.1. Reading the Default Traffic Generator Status 13.8.2. Running Infinite Traffic using the Default Traffic Generator 13.8.3. Changing the Reset Trigger of the Default Traffic Generator 13.8.4. Observing Generated Traffic with Signal Tap
13.9. Using the Configurable Traffic Generator (TG2) x
13.9.1. Enabling the Traffic Generator in a Design Example 13.9.2. Traffic Generator Block Description 13.9.3. Default Traffic Pattern 13.9.4. Configuration and Status Registers 13.9.5. User Pattern 13.9.6. Traffic Generator Status 13.9.7. Starting Traffic with the Traffic Generator 13.9.8. Traffic Generator Configuration User Interface 13.9.9. Examples of Configuring the TG2 Traffic Generator
13.9.5. User Pattern x
13.9.5.1. Test Duration / Instruction pattern 13.9.5.2. Address Pattern 13.9.5.3. Data Pattern and Byte Enable
13.9.5.2. Address Pattern x
13.9.5.2.1. Address Generator Modes 13.9.5.2.2. Address Generator MSB Indices 13.9.5.2.3. Address Generator Effective Width 13.9.5.2.4. Address Generator Relative Frequencies 13.9.5.2.5. Address Pattern Examples - Basic Mode 13.9.5.2.6. Address Pattern Examples - Advanced Mode
13.9.8. Traffic Generator Configuration User Interface x
13.9.8.1. Connecting the Traffic Generator 13.9.8.2. Configuring the Traffic Generator 13.9.8.3. Traffic Generator Preset Selection 13.9.8.4. Traffic Generator Status Report
1. Release Information
2. External Memory Interfaces Intel® Stratix® 10 FPGA IP Introduction
3. Intel® Stratix® 10 EMIF IP Product Architecture
4. Intel® Stratix® 10 EMIF IP End-User Signals
5. Intel® Stratix® 10 EMIF – Simulating Memory IP
6. Intel® Stratix® 10 EMIF IP for DDR3
7. Intel® Stratix® 10 EMIF IP for DDR4
8. Intel® Stratix® 10 EMIF IP for QDR II/II+/II+ Xtreme
9. Intel® Stratix® 10 EMIF IP for QDR-IV
10. Intel® Stratix® 10 EMIF IP for RLDRAM 3
11. Intel® Stratix® 10 EMIF IP Timing Closure
12. Optimizing Controller Performance
13. Intel® Stratix® 10 EMIF IP Debugging
14. External Memory Interfaces Intel® Stratix® 10 FPGA IP User Guide Archives
15. Document Revision History for External Memory Interfaces Intel® Stratix® 10 FPGA IP User Guide

7.1.3. Intel Stratix 10 EMIF IP DDR4 Parameters: Memory

Table 224.  Group: Memory / Topology
Display Name Description
Memory format Specifies the format of the external memory device. The following formats are supported: Component - a Discrete memory device; UDIMM - Unregistered/Unbuffered DIMM where address/control, clock, and data are unbuffered; RDIMM - Registered DIMM where address/control and clock are buffered; LRDIMM - Load Reduction DIMM where address/control, clock, and data are buffered. LRDIMM reduces the load to increase memory speed and supports higher densities than RDIMM; SODIMM - Small Outline DIMM is similar to UDIMM but smaller in size and is typically used for systems with limited space. Some memory protocols may not be available in all formats. (Identifier: MEM_DDR4_FORMAT_ENUM)
DQ width Specifies the total number of data pins in the interface. (Identifier: MEM_DDR4_DQ_WIDTH)
DQ pins per DQS group Specifies the total number of DQ pins per DQS group. (Identifier: MEM_DDR4_DQ_PER_DQS)
Number of clocks Specifies the number of CK/CK# clock pairs exposed by the memory interface. Usually more than 1 pair is required for RDIMM/LRDIMM formats. The value of this parameter depends on the memory device selected; refer to the data sheet for your memory device. (Identifier: MEM_DDR4_CK_WIDTH)
Number of chip selects Specifies the total number of chip selects in the interface, up to a maximum of 4. This parameter applies to discrete components only. (Identifier: MEM_DDR4_DISCRETE_CS_WIDTH)
Number of DIMMs Total number of DIMMs. (Identifier: MEM_DDR4_NUM_OF_DIMMS)
Chip ID width Specifies the number of chip ID pins. Only applicable to registered and load-reduced DIMMs that use 3DS/TSV memory devices. (Identifier: MEM_DDR4_CHIP_ID_WIDTH)
Number of physical ranks per DIMM Number of ranks per DIMM. For LRDIMM, this represents the number of physical ranks on the DIMM behind the memory buffer (Identifier: MEM_DDR4_RANKS_PER_DIMM)
Row address width Specifies the number of row address pins. Refer to the data sheet for your memory device. The density of the selected memory device determines the number of address pins needed for access to all available rows. (Identifier: MEM_DDR4_ROW_ADDR_WIDTH)
Column address width Specifies the number of column address pins. Refer to the data sheet for your memory device. The density of the selected memory device determines the number of address pins needed for access to all available columns. (Identifier: MEM_DDR4_COL_ADDR_WIDTH)
Bank address width Specifies the number of bank address pins. Refer to the data sheet for your memory device. The density of the selected memory device determines the number of bank address pins needed for access to all available banks. (Identifier: MEM_DDR4_BANK_ADDR_WIDTH)
Bank group width Specifies the number of bank group pins. Refer to the data sheet for your memory device. The density of the selected memory device determines the number of bank group pins needed for access to all available bank groups. (Identifier: MEM_DDR4_BANK_GROUP_WIDTH)
Data mask Indicates whether the interface uses data mask (DM) pins. This feature allows specified portions of the data bus to be written to memory (not available in x4 mode). One DM pin exists per DQS group. (Identifier: MEM_DDR4_DM_EN)
Write DBI Indicates whether the interface uses write data bus inversion (DBI). This feature provides better signal integrity and write margin. This feature is unavailable if Data Mask is enabled or in x4 mode. (Identifier: MEM_DDR4_WRITE_DBI)
Read DBI Specifies whether the interface uses read data bus inversion (DBI). Enable this feature for better signal integrity and read margin. This feature is not available in x4 configurations. (Identifier: MEM_DDR4_READ_DBI)
Enable address mirroring for odd chip-selects Enabling address mirroring for multi-CS discrete components. Typically used when components are arranged in a clamshell layout. (Identifier: MEM_DDR4_DISCRETE_MIRROR_ADDRESSING_EN)
Enable address mirroring for odd ranks Enabling address mirroring for dual-rank or quad-rank DIMM. (Identifier: MEM_DDR4_MIRROR_ADDRESSING_EN)
Enable ALERT#/PAR pins Allows address/command calibration, which may provide better margins on the address/command bus. The alert_n signal is not accessible in the AFI or Avalon domains. This means there is no way to know whether a parity error has occurred during user mode. The parity pin is a dedicated pin in the address/command bank, but the alert_n pin can be placed in any bank that spans the memory interface. You should explicitly choose the location of the alert_n pin and place it in the address/command bank. Address/command parity is checked only during calibration, not in user mode. Because the alert_n pin is not accessible via the AFI or Avalon interfaces, changing the address/command parity latency option from the default value in advanced mode register settings, is not recommended. (Identifier: MEM_DDR4_ALERT_PAR_EN)
ALERT# pin placement Specifies placement for the mem_alert_n signal. If you select "I/O Lane with Address/Command Pins", you can pick the I/O lane and pin index in the add/cmd bank with the subsequent drop down menus. If you select "I/O Lane with DQS Group", you can specify the DQS group with which to place the mem_alert_n pin. If you select "Automatically select a location", the IP automatically selects a pin for the mem_alert_n signal. If you select this option, no additional location constraints can be applied to the mem_alert_n pin, or a fitter error will result during compilation. For optimum signal integrity, you should choose "I/O Lane with Address/Command Pins". For interfaces containing multiple memory devices, it is recommended to connect the ALERT# pins together to the ALERT# pin on the FPGA. (Identifier: MEM_DDR4_ALERT_N_PLACEMENT_ENUM)
DQS group of ALERT# Select the DQS group with which the ALERT# pin is placed. (Identifier: MEM_DDR4_ALERT_N_DQS_GROUP)
Address/command I/O lane of ALERT# Select the lane of the Address/Command I/O Tile where ALERT# pin is placed. (Identifier: MEM_DDR4_ALERT_N_AC_LANE)
Pin index of ALERT# Select the pin of the Address/Command I/O Lane where ALERT# pin is placed. (Identifier: MEM_DDR4_ALERT_N_AC_PIN)
Table 225.  Group: Memory / Latency and Burst
Display Name Description
Memory CAS latency setting Specifies the number of clock cycles between the read command and the availability of the first bit of output data at the memory device. Overall read latency equals the additive latency (AL) + the CAS latency (CL). Overall read latency depends on the memory device selected; refer to the datasheet for your device. (Identifier: MEM_DDR4_TCL)
Memory write CAS latency setting Specifies the number of clock cycles from the release of internal write to the latching of the first data in at the memory device. This value depends on the memory device selected; refer to the datasheet for your device. (Identifier: MEM_DDR4_WTCL)
Memory additive CAS latency setting Determines the posted CAS additive latency of the memory device. Enable this feature to improve command and bus efficiency, and increase system bandwidth. (Identifier: MEM_DDR4_ATCL_ENUM)
Table 226.  Group: Memory / Mode Register Settings
Display Name Description
Hide advanced mode register settings Show or hide advanced mode register settings. Changing advanced mode register settings to non-default values is strongly discouraged. (Identifier: MEM_DDR4_HIDE_ADV_MR_SETTINGS)
Addr/CMD parity latency Additional latency incurred by enabling address/command parity check after calibration. Select a value to enable address/command parity with the latency associated with the selected value. Select Disable to disable address/command parity. Address/command is enabled automatically and as-needed during calibration regardless of the value of this setting. (Identifier: MEM_DDR4_AC_PARITY_LATENCY)
Burst Length Specifies the DRAM burst length which determines how many consecutive addresses should be accessed for a given read/write command. (Identifier: MEM_DDR4_BL_ENUM)
Read Burst Type Indicates whether accesses within a given burst are in sequential or interleaved order. Select sequential if you are using the Intel-provided memory controller. (Identifier: MEM_DDR4_BT_ENUM)
Enable the DLL in memory device Enable the DLL in memory device (Identifier: MEM_DDR4_DLL_EN)
Auto self-refresh method Indicates whether to enable or disable auto self-refresh. Auto self-refresh allows the controller to issue self-refresh requests, rather than manually issuing self-refresh in order for memory to retain data. (Identifier: MEM_DDR4_ASR_ENUM)
Write CRC enable Write CRC enable (Identifier: MEM_DDR4_WRITE_CRC)
DDR4 geardown mode Set DDR4 geardown mode for control signals at high frequency (Identifier: MEM_DDR4_GEARDOWN)
Per-DRAM addressability Per-DRAM addressability enable (Identifier: MEM_DDR4_PER_DRAM_ADDR)
Temperature sensor readout Temperature sensor readout enable (Identifier: MEM_DDR4_TEMP_SENSOR_READOUT)
Fine granularity refresh Increased frequency of refresh in exchange for shorter refresh. Shorter tRFC and increased cycle time can produce higher bandwidth. (Identifier: MEM_DDR4_FINE_GRANULARITY_REFRESH)
MPR read format Multipurpose register readout format (Identifier: MEM_DDR4_MPR_READ_FORMAT)
Maximum power down mode Maximum power down mode (Identifier: MEM_DDR4_MAX_POWERDOWN)
Temperature controlled refresh range Indicates temperature controlled refresh range where normal temperature mode covers 0C to 85C and extended mode covers 0C to 95C. (Identifier: MEM_DDR4_TEMP_CONTROLLED_RFSH_RANGE)
Temperature controlled refresh enable Indicates whether to enable temperature controlled refresh, which allows the device to adjust the internal refresh period to be longer than tREFI of the normal temperature range by skipping external refresh commands. (Identifier: MEM_DDR4_TEMP_CONTROLLED_RFSH_ENA)
Internal VrefDQ monitor Indicates whether to enable the internal VrefDQ monitor. (Identifier: MEM_DDR4_INTERNAL_VREFDQ_MONITOR)
CS to Addr/CMD Latency CS to Addr/CMD Latency (CAL mode) for idle state DRAM receiver power reduction (Identifier: MEM_DDR4_CAL_MODE)
Self refresh abort Self refresh abort for latency reduction. (Identifier: MEM_DDR4_SELF_RFSH_ABORT)
Read preamble training mode enable Read preamble training mode enable. (Identifier: MEM_DDR4_READ_PREAMBLE_TRAINING)
Read preamble Number of read preamble cycles. This mode register setting determines the number of cycles DQS (read) will go low before starting to toggle. It is strongly recommended to use the default read preamble setting. (Identifier: MEM_DDR4_READ_PREAMBLE)
Write preamble Write preamble cycles. It is strongly recommended to use the default write preamble setting. (Identifier: MEM_DDR4_WRITE_PREAMBLE)
ODT input buffer during powerdown mode Indicates whether to enable on-die termination (ODT) input buffer during powerdown mode. (Identifier: MEM_DDR4_ODT_IN_POWERDOWN)
Addr/CMD persistent error If set, Addr/CMD parity errors continue to be checked after a previous Addr/CMD parity error (Identifier: MEM_DDR4_AC_PERSISTENT_ERROR)
Level Two Title