External Memory Interfaces Intel® Stratix® 10 FPGA IP User Guide

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ID 683741
Date 3/11/2022
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Document Table of Contents
Document Table of Contents x
1. Release Information 2. External Memory Interfaces Intel® Stratix® 10 FPGA IP Introduction 3. Intel® Stratix® 10 EMIF IP Product Architecture 4. Intel® Stratix® 10 EMIF IP End-User Signals 5. Intel® Stratix® 10 EMIF – Simulating Memory IP 6. Intel® Stratix® 10 EMIF IP for DDR3 7. Intel® Stratix® 10 EMIF IP for DDR4 8. Intel® Stratix® 10 EMIF IP for QDR II/II+/II+ Xtreme 9. Intel® Stratix® 10 EMIF IP for QDR-IV 10. Intel® Stratix® 10 EMIF IP for RLDRAM 3 11. Intel® Stratix® 10 EMIF IP Timing Closure 12. Optimizing Controller Performance 13. Intel® Stratix® 10 EMIF IP Debugging 14. External Memory Interfaces Intel® Stratix® 10 FPGA IP User Guide Archives 15. Document Revision History for External Memory Interfaces Intel® Stratix® 10 FPGA IP User Guide
2. External Memory Interfaces Intel® Stratix® 10 FPGA IP Introduction x
2.1. Intel® Stratix® 10 EMIF IP Design Flow 2.2. Intel® Stratix® 10 EMIF IP Design Checklist
3. Intel® Stratix® 10 EMIF IP Product Architecture x
3.1. Intel® Stratix® 10 EMIF Architecture: Introduction 3.2. Intel® Stratix® 10 EMIF Sequencer 3.3. Intel® Stratix® 10 EMIF Calibration 3.4. Intel Stratix 10 EMIF IP Controller 3.5. Hardware Resource Sharing Among Multiple Intel® Stratix® 10 EMIFs 3.6. User-requested Reset in Intel® Stratix® 10 EMIF IP 3.7. Intel® Stratix® 10 EMIF for Hard Processor Subsystem 3.8. Intel® Stratix® 10 EMIF Ping Pong PHY
3.1. Intel® Stratix® 10 EMIF Architecture: Introduction x
3.1.1. Intel® Stratix® 10 EMIF Architecture: I/O Subsystem 3.1.2. Intel® Stratix® 10 EMIF Architecture: I/O Column 3.1.3. Intel® Stratix® 10 EMIF Architecture: I/O SSM 3.1.4. Intel® Stratix® 10 EMIF Architecture: I/O Bank 3.1.5. Intel® Stratix® 10 EMIF Architecture: I/O Lane 3.1.6. Intel® Stratix® 10 EMIF Architecture: Input DQS Clock Tree 3.1.7. Intel® Stratix® 10 EMIF Architecture: PHY Clock Tree 3.1.8. Intel® Stratix® 10 EMIF Architecture: PLL Reference Clock Networks 3.1.9. Intel® Stratix® 10 EMIF Architecture: Clock Phase Alignment
3.2. Intel® Stratix® 10 EMIF Sequencer x
3.2.1. Intel® Stratix® 10 EMIF DQS Tracking
3.3. Intel® Stratix® 10 EMIF Calibration x
3.3.1. Intel® Stratix® 10 Calibration Stages 3.3.2. Intel® Stratix® 10 Calibration Stages Descriptions 3.3.3. Intel® Stratix® 10 Calibration Flowchart 3.3.4. Intel® Stratix® 10 Calibration Algorithms
3.4. Intel Stratix 10 EMIF IP Controller x
3.4.1. Hard Memory Controller 3.4.2. Intel® Stratix® 10 Hard Memory Controller Rate Conversion Feature
3.4.1. Hard Memory Controller x
3.4.1.1. Hard Memory Controller Features 3.4.1.2. Hard Memory Controller Main Control Path 3.4.1.3. Data Buffer Controller
3.5. Hardware Resource Sharing Among Multiple Intel® Stratix® 10 EMIFs x
3.5.1. I/O SSM Sharing 3.5.2. I/O Bank Sharing 3.5.3. PLL Reference Clock Sharing 3.5.4. Core Clock Network Sharing
3.7. Intel® Stratix® 10 EMIF for Hard Processor Subsystem x
3.7.1. Restrictions on I/O Bank Usage for Intel® Stratix® 10 EMIF IP with HPS 3.7.2. Using the Legacy EMIF Debug Toolkit with Intel® Stratix® 10 HPS Interfaces 3.7.3. HPS EMIF Simulation
3.8. Intel® Stratix® 10 EMIF Ping Pong PHY x
3.8.1. Intel® Stratix® 10 Ping Pong PHY Feature Description 3.8.2. Intel® Stratix® 10 Ping Pong PHY Architecture 3.8.3. Intel® Stratix® 10 Ping Pong PHY Limitations 3.8.4. Intel® Stratix® 10 Ping Pong PHY Calibration 3.8.5. Using the Ping Pong PHY 3.8.6. Ping Pong PHY Simulation Example Design
4. Intel® Stratix® 10 EMIF IP End-User Signals x
4.1. Interface and Signal Descriptions 4.2. AFI Signals 4.3. AFI 4.0 Timing Diagrams 4.4. Intel® Stratix® 10 Memory Mapped Register (MMR) Tables
4.1. Interface and Signal Descriptions x
4.1.1. Intel Stratix 10 EMIF IP Interfaces for DDR3 4.1.2. Intel Stratix 10 EMIF IP Interfaces for DDR4 4.1.3. Intel Stratix 10 EMIF IP Interfaces for QDR II/II+/II+ Xtreme 4.1.4. Intel Stratix 10 EMIF IP Interfaces for QDR-IV 4.1.5. Intel Stratix 10 EMIF IP Interfaces for RLDRAM 3
4.1.1. Intel Stratix 10 EMIF IP Interfaces for DDR3 x
4.1.1.1. local_reset_req for DDR3 4.1.1.2. local_reset_status for DDR3 4.1.1.3. pll_ref_clk for DDR3 4.1.1.4. pll_locked for DDR3 4.1.1.5. pll_extra_clk_0 for DDR3 4.1.1.6. pll_extra_clk_1 for DDR3 4.1.1.7. pll_extra_clk_2 for DDR3 4.1.1.8. pll_extra_clk_3 for DDR3 4.1.1.9. oct for DDR3 4.1.1.10. mem for DDR3 4.1.1.11. status for DDR3 4.1.1.12. afi_reset_n for DDR3 4.1.1.13. afi_clk for DDR3 4.1.1.14. afi_half_clk for DDR3 4.1.1.15. afi for DDR3 4.1.1.16. emif_usr_reset_n for DDR3 4.1.1.17. emif_usr_clk for DDR3 4.1.1.18. emif_usr_reset_n_sec for DDR3 4.1.1.19. emif_usr_clk_sec for DDR3 4.1.1.20. cal_debug_reset_n for DDR3 4.1.1.21. cal_debug_clk for DDR3 4.1.1.22. cal_debug_out_reset_n for DDR3 4.1.1.23. cal_debug_out_clk for DDR3 4.1.1.24. clks_sharing_master_out for DDR3 4.1.1.25. clks_sharing_slave_in for DDR3 4.1.1.26. clks_sharing_slave_out for DDR3 4.1.1.27. ctrl_amm for DDR3 4.1.1.28. ctrl_auto_precharge for DDR3 4.1.1.29. ctrl_user_priority for DDR3 4.1.1.30. ctrl_ecc_user_interrupt for DDR3 4.1.1.31. ctrl_ecc_readdataerror for DDR3 4.1.1.32. ctrl_ecc_status for DDR3 4.1.1.33. ctrl_mmr_slave for DDR3 4.1.1.34. hps_emif for DDR3 4.1.1.35. cal_debug for DDR3 4.1.1.36. cal_debug_out for DDR3
4.1.2. Intel Stratix 10 EMIF IP Interfaces for DDR4 x
4.1.2.1. local_reset_req for DDR4 4.1.2.2. local_reset_status for DDR4 4.1.2.3. pll_ref_clk for DDR4 4.1.2.4. pll_locked for DDR4 4.1.2.5. pll_extra_clk_0 for DDR4 4.1.2.6. pll_extra_clk_1 for DDR4 4.1.2.7. pll_extra_clk_2 for DDR4 4.1.2.8. pll_extra_clk_3 for DDR4 4.1.2.9. ac_parity_err for DDR4 4.1.2.10. oct for DDR4 4.1.2.11. mem for DDR4 4.1.2.12. status for DDR4 4.1.2.13. afi_reset_n for DDR4 4.1.2.14. afi_clk for DDR4 4.1.2.15. afi_half_clk for DDR4 4.1.2.16. afi for DDR4 4.1.2.17. emif_usr_reset_n for DDR4 4.1.2.18. emif_usr_clk for DDR4 4.1.2.19. emif_usr_reset_n_sec for DDR4 4.1.2.20. emif_usr_clk_sec for DDR4 4.1.2.21. cal_debug_reset_n for DDR4 4.1.2.22. cal_debug_clk for DDR4 4.1.2.23. cal_debug_out_reset_n for DDR4 4.1.2.24. cal_debug_out_clk for DDR4 4.1.2.25. clks_sharing_master_out for DDR4 4.1.2.26. clks_sharing_slave_in for DDR4 4.1.2.27. clks_sharing_slave_out for DDR4 4.1.2.28. ctrl_amm for DDR4 4.1.2.29. ctrl_auto_precharge for DDR4 4.1.2.30. ctrl_user_priority for DDR4 4.1.2.31. ctrl_ecc_user_interrupt for DDR4 4.1.2.32. ctrl_ecc_readdataerror for DDR4 4.1.2.33. ctrl_ecc_status for DDR4 4.1.2.34. ctrl_mmr_slave for DDR4 4.1.2.35. hps_emif for DDR4 4.1.2.36. cal_debug for DDR4 4.1.2.37. cal_debug_out for DDR4
4.1.3. Intel Stratix 10 EMIF IP Interfaces for QDR II/II+/II+ Xtreme x
4.1.3.1. local_reset_req for QDR II/II+/II+ Xtreme 4.1.3.2. local_reset_status for QDR II/II+/II+ Xtreme 4.1.3.3. pll_ref_clk for QDR II/II+/II+ Xtreme 4.1.3.4. pll_locked for QDR II/II+/II+ Xtreme 4.1.3.5. pll_extra_clk_0 for QDR II/II+/II+ Xtreme 4.1.3.6. pll_extra_clk_1 for QDR II/II+/II+ Xtreme 4.1.3.7. pll_extra_clk_2 for QDR II/II+/II+ Xtreme 4.1.3.8. pll_extra_clk_3 for QDR II/II+/II+ Xtreme 4.1.3.9. oct for QDR II/II+/II+ Xtreme 4.1.3.10. mem for QDR II/II+/II+ Xtreme 4.1.3.11. status for QDR II/II+/II+ Xtreme 4.1.3.12. emif_usr_reset_n for QDR II/II+/II+ Xtreme 4.1.3.13. emif_usr_clk for QDR II/II+/II+ Xtreme 4.1.3.14. cal_debug_reset_n for QDR II/II+/II+ Xtreme 4.1.3.15. cal_debug_clk for QDR II/II+/II+ Xtreme 4.1.3.16. cal_debug_out_reset_n for QDR II/II+/II+ Xtreme 4.1.3.17. cal_debug_out_clk for QDR II/II+/II+ Xtreme 4.1.3.18. clks_sharing_master_out for QDR II/II+/II+ Xtreme 4.1.3.19. clks_sharing_slave_in for QDR II/II+/II+ Xtreme 4.1.3.20. clks_sharing_slave_out for QDR II/II+/II+ Xtreme 4.1.3.21. ctrl_amm for QDR II/II+/II+ Xtreme 4.1.3.22. cal_debug for QDR II/II+/II+ Xtreme 4.1.3.23. cal_debug_out for QDR II/II+/II+ Xtreme
4.1.4. Intel Stratix 10 EMIF IP Interfaces for QDR-IV x
4.1.4.1. local_reset_req for QDR-IV 4.1.4.2. local_reset_status for QDR-IV 4.1.4.3. pll_ref_clk for QDR-IV 4.1.4.4. pll_locked for QDR-IV 4.1.4.5. pll_extra_clk_0 for QDR-IV 4.1.4.6. pll_extra_clk_1 for QDR-IV 4.1.4.7. pll_extra_clk_2 for QDR-IV 4.1.4.8. pll_extra_clk_3 for QDR-IV 4.1.4.9. oct for QDR-IV 4.1.4.10. mem for QDR-IV 4.1.4.11. status for QDR-IV 4.1.4.12. afi_reset_n for QDR-IV 4.1.4.13. afi_clk for QDR-IV 4.1.4.14. afi_half_clk for QDR-IV 4.1.4.15. afi for QDR-IV 4.1.4.16. emif_usr_reset_n for QDR-IV 4.1.4.17. emif_usr_clk for QDR-IV 4.1.4.18. cal_debug_reset_n for QDR-IV 4.1.4.19. cal_debug_clk for QDR-IV 4.1.4.20. cal_debug_out_reset_n for QDR-IV 4.1.4.21. cal_debug_out_clk for QDR-IV 4.1.4.22. clks_sharing_master_out for QDR-IV 4.1.4.23. clks_sharing_slave_in for QDR-IV 4.1.4.24. clks_sharing_slave_out for QDR-IV 4.1.4.25. ctrl_amm for QDR-IV 4.1.4.26. cal_debug for QDR-IV 4.1.4.27. cal_debug_out for QDR-IV
4.1.5. Intel Stratix 10 EMIF IP Interfaces for RLDRAM 3 x
4.1.5.1. local_reset_req for RLDRAM 3 4.1.5.2. local_reset_status for RLDRAM 3 4.1.5.3. pll_ref_clk for RLDRAM 3 4.1.5.4. pll_locked for RLDRAM 3 4.1.5.5. pll_extra_clk_0 for RLDRAM 3 4.1.5.6. pll_extra_clk_1 for RLDRAM 3 4.1.5.7. pll_extra_clk_2 for RLDRAM 3 4.1.5.8. pll_extra_clk_3 for RLDRAM 3 4.1.5.9. oct for RLDRAM 3 4.1.5.10. mem for RLDRAM 3 4.1.5.11. status for RLDRAM 3 4.1.5.12. afi_reset_n for RLDRAM 3 4.1.5.13. afi_clk for RLDRAM 3 4.1.5.14. afi_half_clk for RLDRAM 3 4.1.5.15. afi for RLDRAM 3 4.1.5.16. cal_debug_reset_n for RLDRAM 3 4.1.5.17. cal_debug_clk for RLDRAM 3 4.1.5.18. cal_debug_out_reset_n for RLDRAM 3 4.1.5.19. cal_debug_out_clk for RLDRAM 3 4.1.5.20. clks_sharing_master_out for RLDRAM 3 4.1.5.21. clks_sharing_slave_in for RLDRAM 3 4.1.5.22. clks_sharing_slave_out for RLDRAM 3 4.1.5.23. cal_debug for RLDRAM 3 4.1.5.24. cal_debug_out for RLDRAM 3
4.2. AFI Signals x
4.2.1. AFI Clock and Reset Signals 4.2.2. AFI Address and Command Signals 4.2.3. AFI Write Data Signals 4.2.4. AFI Read Data Signals 4.2.5. AFI Calibration Status Signals 4.2.6. AFI Shadow Register Management Signals
4.3. AFI 4.0 Timing Diagrams x
4.3.1. AFI Address and Command Timing Diagrams 4.3.2. AFI Write Sequence Timing Diagrams 4.3.3. AFI Read Sequence Timing Diagrams 4.3.4. AFI Calibration Status Timing Diagram
4.4. Intel® Stratix® 10 Memory Mapped Register (MMR) Tables x
4.4.1. ctrlcfg0 4.4.2. ctrlcfg1 4.4.3. dramtiming0 4.4.4. caltiming0 4.4.5. caltiming1 4.4.6. caltiming2 4.4.7. caltiming3 4.4.8. caltiming4 4.4.9. caltiming9 4.4.10. dramaddrw 4.4.11. sideband0 4.4.12. sideband1 4.4.13. sideband4 4.4.14. sideband6 4.4.15. sideband7 4.4.16. sideband9 4.4.17. sideband11 4.4.18. sideband12 4.4.19. sideband13 4.4.20. sideband14 4.4.21. dramsts 4.4.22. niosreserve0 4.4.23. niosreserve1 4.4.24. sideband16 4.4.25. ecc3: ECC Error and Interrupt Configuration 4.4.26. ecc4: Status and Error Information 4.4.27. ecc5: Address of Most Recent SBE/DBE 4.4.28. ecc6: Address of Most Recent Correction Command Dropped 4.4.29. ecc7: Extension for Address of Most Recent SBE/DBE 4.4.30. ecc8: Extension for Address of Most Recent Correction Command Dropped
5. Intel® Stratix® 10 EMIF – Simulating Memory IP x
5.1. Simulation Options 5.2. HPS EMIF Simulation 5.3. Simulation Walkthrough
5.3. Simulation Walkthrough x
5.3.1. Calibration Modes 5.3.2. Abstract PHY Simulation 5.3.3. Simulation Scripts 5.3.4. Functional Simulation with Verilog HDL 5.3.5. Functional Simulation with VHDL 5.3.6. Simulating the Design Example
5.3.6. Simulating the Design Example x
5.3.6.1. User-requested Reset in Intel® Stratix® 10 EMIF IP
6. Intel® Stratix® 10 EMIF IP for DDR3 x
6.1. Parameter Descriptions 6.2. Register Map IP-XACT Support for Intel® Stratix® 10 EMIF DDR3 IP 6.3. Board Skew Equations 6.4. Pin and Resource Planning 6.5. DDR3 Board Design Guidelines
6.1. Parameter Descriptions x
6.1.1. Intel Stratix 10 EMIF IP DDR3 Parameters: General 6.1.2. Intel Stratix 10 EMIF IP DDR3 Parameters: FPGA I/O 6.1.3. Intel Stratix 10 EMIF IP DDR3 Parameters: Memory 6.1.4. Intel Stratix 10 EMIF IP DDR3 Parameters: Mem I/O 6.1.5. Intel Stratix 10 EMIF IP DDR3 Parameters: Mem Timing 6.1.6. Intel Stratix 10 EMIF IP DDR3 Parameters: Board 6.1.7. Intel Stratix 10 EMIF IP DDR3 Parameters: Controller 6.1.8. Intel Stratix 10 EMIF IP DDR3 Parameters: Diagnostics 6.1.9. Intel Stratix 10 EMIF IP DDR3 Parameters: Example Designs
6.3. Board Skew Equations x
6.3.1. Equations for DDR3 Board Skew Parameters
6.4. Pin and Resource Planning x
6.4.1. Interface Pins 6.4.2. FPGA Resources 6.4.3. Pin Guidelines for Intel® Stratix® 10 EMIF IP
6.4.1. Interface Pins x
6.4.1.1. Estimating Pin Requirements 6.4.1.2. DIMM Options 6.4.1.3. Maximum Number of Interfaces
6.4.2. FPGA Resources x
6.4.2.1. OCT 6.4.2.2. PLL
6.4.3. Pin Guidelines for Intel® Stratix® 10 EMIF IP x
6.4.3.1. General Guidelines 6.4.3.2. x4 DIMM Implementation 6.4.3.3. Command and Address Signals 6.4.3.4. Clock Signals 6.4.3.5. Data, Data Strobes, DM/DBI, and Optional ECC Signals 6.4.3.6. Resource Sharing Guidelines (Multiple Interfaces) 6.4.3.7. Ping-Pong PHY Implementation
6.5. DDR3 Board Design Guidelines x
6.5.1. Terminations and Slew Rates with Intel® Stratix® 10 Devices 6.5.2. Channel Signal Integrity Measurement 6.5.3. Layout Approach 6.5.4. Design Layout Guidelines 6.5.5. Package Deskew
6.5.1. Terminations and Slew Rates with Intel® Stratix® 10 Devices x
6.5.1.1. Dynamic On-Chip Termination (OCT) in Intel® Stratix® 10 Devices 6.5.1.2. Choosing Terminations on Intel® Stratix® 10 Devices 6.5.1.3. On-Chip Termination Recommendations for Intel® Stratix® 10 Devices 6.5.1.4. Slew Rates
6.5.2. Channel Signal Integrity Measurement x
6.5.2.1. Importance of Accurate Channel Signal Integrity Information 6.5.2.2. Understanding Channel Signal Integrity Measurement 6.5.2.3. How to Enter Calculated Channel Signal Integrity Values 6.5.2.4. Guidelines for Calculating DDR3 Channel Signal Integrity
6.5.4. Design Layout Guidelines x
6.5.4.1. General Layout Guidelines 6.5.4.2. Layout Guidelines 6.5.4.3. Length Matching Rules 6.5.4.4. Spacing Guidelines 6.5.4.5. Fly-By Network Design for Clock, Command, and Address Signals
6.5.5. Package Deskew x
6.5.5.1. DQ/DQS/DM Deskew 6.5.5.2. Address and Command Deskew 6.5.5.3. Package Deskew Recommendations for Intel® Stratix® 10 Devices 6.5.5.4. Deskew Example 6.5.5.5. Package Migration
7. Intel® Stratix® 10 EMIF IP for DDR4 x
7.1. Parameter Descriptions 7.2. Register Map IP-XACT Support for Intel® Stratix® 10 EMIF DDR4 IP 7.3. Board Skew Equations 7.4. Pin and Resource Planning 7.5. DDR4 Board Design Guidelines
7.1. Parameter Descriptions x
7.1.1. Intel Stratix 10 EMIF IP DDR4 Parameters: General 7.1.2. Intel Stratix 10 EMIF IP DDR4 Parameters: FPGA I/O 7.1.3. Intel Stratix 10 EMIF IP DDR4 Parameters: Memory 7.1.4. Intel Stratix 10 EMIF IP DDR4 Parameters: Mem I/O 7.1.5. Intel Stratix 10 EMIF IP DDR4 Parameters: Mem Timing 7.1.6. Intel Stratix 10 EMIF IP DDR4 Parameters: Board 7.1.7. Intel Stratix 10 EMIF IP DDR4 Parameters: Controller 7.1.8. Intel Stratix 10 EMIF IP DDR4 Parameters: Diagnostics 7.1.9. Intel Stratix 10 EMIF IP DDR4 Parameters: Example Designs
7.3. Board Skew Equations x
7.3.1. Equations for DDR4 Board Skew Parameters
7.4. Pin and Resource Planning x
7.4.1. Interface Pins 7.4.2. FPGA Resources 7.4.3. Pin Guidelines for Intel® Stratix® 10 EMIF IP 7.4.4. Resource Sharing Guidelines (Multiple Interfaces)
7.4.1. Interface Pins x
7.4.1.1. Estimating Pin Requirements 7.4.1.2. DIMM Options 7.4.1.3. Maximum Number of Interfaces
7.4.2. FPGA Resources x
7.4.2.1. OCT 7.4.2.2. PLL
7.4.3. Pin Guidelines for Intel® Stratix® 10 EMIF IP x
7.4.3.1. General Guidelines 7.4.3.2. x4 DIMM Implementation 7.4.3.3. Command and Address Signals 7.4.3.4. Clock Signals 7.4.3.5. Data, Data Strobes, DM/DBI, and Optional ECC Signals 7.4.3.6. alert_n Pin Termination Recommendation
7.5. DDR4 Board Design Guidelines x
7.5.1. Terminations and Slew Rates with Intel® Stratix® 10 Devices 7.5.2. Channel Signal Integrity Measurement 7.5.3. Layout Approach 7.5.4. Design Layout Guidelines 7.5.5. Package Deskew
7.5.1. Terminations and Slew Rates with Intel® Stratix® 10 Devices x
7.5.1.1. Dynamic On-Chip Termination (OCT) in Intel® Stratix® 10 Devices 7.5.1.2. Dynamic On-Die Termination (ODT) in DDR4 7.5.1.3. Choosing Terminations on Intel® Stratix® 10 Devices 7.5.1.4. On-Chip Termination Recommendations for Intel® Stratix® 10 Devices 7.5.1.5. Slew Rates
7.5.2. Channel Signal Integrity Measurement x
7.5.2.1. Importance of Accurate Channel Signal Integrity Information 7.5.2.2. Understanding Channel Signal Integrity Measurement 7.5.2.3. How to Enter Calculated Channel Signal Integrity Values 7.5.2.4. Guidelines for Calculating DDR4 Channel Signal Integrity
7.5.4. Design Layout Guidelines x
7.5.4.1. General Layout Guidelines 7.5.4.2. Layout Guidelines 7.5.4.3. Length Matching Rules 7.5.4.4. Spacing Guidelines 7.5.4.5. Layout Guidelines for DDR3 and DDR4 SDRAM Wide Interface (>72 bits) 7.5.4.6. Fly-By Network Design for Clock, Command, and Address Signals 7.5.4.7. Clamshell Topology 7.5.4.8. Additional Layout Guidelines for DDR4 Twin-die Devices
7.5.5. Package Deskew x
7.5.5.1. DQ/DQS/DM Deskew 7.5.5.2. Address and Command Deskew 7.5.5.3. Package Deskew Recommendations for Intel® Stratix® 10 Devices 7.5.5.4. Deskew Example 7.5.5.5. Package Migration
8. Intel® Stratix® 10 EMIF IP for QDR II/II+/II+ Xtreme x
8.1. Parameter Descriptions 8.2. Board Skew Equations 8.3. Pin and Resource Planning 8.4. QDR II/II+/II+ Xtreme Board Design Guidelines
8.1. Parameter Descriptions x
8.1.1. Intel Stratix 10 EMIF IP QDR II/II+/II+ Xtreme Parameters: General 8.1.2. Intel Stratix 10 EMIF IP QDR II/II+/II+ Xtreme Parameters: FPGA I/O 8.1.3. Intel Stratix 10 EMIF IP QDR II/II+/II+ Xtreme Parameters: Memory 8.1.4. Intel Stratix 10 EMIF IP QDR II/II+/II+ Xtreme Parameters: Mem Timing 8.1.5. Intel Stratix 10 EMIF IP QDR II/II+/II+ Xtreme Parameters: Board 8.1.6. Intel Stratix 10 EMIF IP QDR II/II+/II+ Xtreme Parameters: Controller 8.1.7. Intel Stratix 10 EMIF IP QDR II/II+/II+ Xtreme Parameters: Diagnostics 8.1.8. Intel Stratix 10 EMIF IP QDR II/II+/II+ Xtreme Parameters: Example Designs
8.2. Board Skew Equations x
8.2.1. Equations for QDRII, QDRII+, and QDRII+ Xtreme Board Skew Parameters
8.3. Pin and Resource Planning x
8.3.1. Interface Pins
8.3.1. Interface Pins x
8.3.1.1. Estimating Pin Requirements 8.3.1.2. Maximum Number of Interfaces 8.3.1.3. FPGA Resources 8.3.1.4. OCT 8.3.1.5. PLL 8.3.1.6. Pin Guidelines for Intel® Stratix® 10 EMIF IP
8.3.1.6. Pin Guidelines for Intel® Stratix® 10 EMIF IP x
8.3.1.6.1. General Guidelines 8.3.1.6.2. QDR II, QDR II+ and QDR II+ Xtreme SRAM Command Signals 8.3.1.6.3. QDR II, QDR II+ and QDR II+ Xtreme SRAM Address Signals 8.3.1.6.4. QDR II, QDR II+, and QDR II+ Xtreme SRAM Clock Signals 8.3.1.6.5. QDR II, QDR II+ and QDR II+ Xtreme SRAM Data, BWS, and QVLD Signals 8.3.1.6.6. Resource Sharing Guidelines (Multiple Interfaces)
8.4. QDR II/II+/II+ Xtreme Board Design Guidelines x
8.4.1. QDR II SRAM Configurations 8.4.2. General Layout Guidelines 8.4.3. QDR II Layout Guidelines 8.4.4. QDR II SRAM Layout Approach 8.4.5. Package Deskew 8.4.6. Package Migration 8.4.7. Slew Rates
9. Intel® Stratix® 10 EMIF IP for QDR-IV x
9.1. Parameter Descriptions 9.2. Board Skew Equations 9.3. Pin and Resource Planning 9.4. QDR-IV Board Design Guidelines
9.1. Parameter Descriptions x
9.1.1. Intel Stratix 10 EMIF IP QDR-IV Parameters: General 9.1.2. Intel Stratix 10 EMIF IP QDR-IV Parameters: FPGA I/O 9.1.3. Intel Stratix 10 EMIF IP QDR-IV Parameters: Memory 9.1.4. Intel Stratix 10 EMIF IP QDR-IV Parameters: Mem Timing 9.1.5. Intel Stratix 10 EMIF IP QDR-IV Parameters: Board 9.1.6. Intel Stratix 10 EMIF IP QDR-IV Parameters: Controller 9.1.7. Intel Stratix 10 EMIF IP QDR-IV Parameters: Diagnostics 9.1.8. Intel Stratix 10 EMIF IP QDR-IV Parameters: Example Designs
9.2. Board Skew Equations x
9.2.1. Equations for QDR-IV Board Skew Parameters
9.3. Pin and Resource Planning x
9.3.1. Interface Pins
9.3.1. Interface Pins x
9.3.1.1. Estimating Pin Requirements 9.3.1.2. Maximum Number of Interfaces 9.3.1.3. FPGA Resources 9.3.1.4. OCT 9.3.1.5. PLL 9.3.1.6. Pin Guidelines for Intel® Stratix® 10 EMIF IP 9.3.1.7. Resource Sharing Guidelines (Multiple Interfaces)
9.3.1.6. Pin Guidelines for Intel® Stratix® 10 EMIF IP x
9.3.1.6.1. General Guidelines 9.3.1.6.2. QDR IV SRAM Commands and Addresses, AP, and AINV Signals 9.3.1.6.3. QDR IV SRAM Clock Signals 9.3.1.6.4. QDR IV SRAM Data, DINV, and QVLD Signals
9.4. QDR-IV Board Design Guidelines x
9.4.1. QDR-IV Layout Approach 9.4.2. General Layout Guidelines 9.4.3. QDR-IV Layout Guidelines 9.4.4. Package Deskew 9.4.5. Package Migration 9.4.6. Slew Rates
10. Intel® Stratix® 10 EMIF IP for RLDRAM 3 x
10.1. Parameter Descriptions 10.2. Board Skew Equations 10.3. Pin and Resource Planning 10.4. RLDRAM 3 Board Design Guidelines
10.1. Parameter Descriptions x
10.1.1. Intel Stratix 10 EMIF IP RLDRAM 3 Parameters: General 10.1.2. Intel Stratix 10 EMIF IP RLDRAM 3 Parameters: FPGA I/O 10.1.3. Intel Stratix 10 EMIF IP RLDRAM 3 Parameters: Memory 10.1.4. Intel Stratix 10 EMIF IP RLDRAM 3 Parameters: Mem Timing 10.1.5. Intel Stratix 10 EMIF IP RLDRAM 3 Parameters: Board 10.1.6. Intel Stratix 10 EMIF IP RLDRAM 3 Parameters: Diagnostics 10.1.7. Intel Stratix 10 EMIF IP RLDRAM 3 Parameters: Example Designs
10.2. Board Skew Equations x
10.2.1. Equations for RLDRAM 3 Board Skew Parameters
10.3. Pin and Resource Planning x
10.3.1. Interface Pins
10.3.1. Interface Pins x
10.3.1.1. Estimating Pin Requirements 10.3.1.2. Maximum Number of Interfaces 10.3.1.3. FPGA Resources 10.3.1.4. OCT 10.3.1.5. PLL 10.3.1.6. Pin Guidelines for Intel® Stratix® 10 EMIF IP 10.3.1.7. Resource Sharing Guidelines (Multiple Interfaces)
10.3.1.6. Pin Guidelines for Intel® Stratix® 10 EMIF IP x
10.3.1.6.1. General Guidelines 10.3.1.6.2. RLDRAM 3 Commands and Addresses 10.3.1.6.3. RLDRAM 3 Clock Signals 10.3.1.6.4. RLDRAM 3 Data, DM and QVLD Signals
10.4. RLDRAM 3 Board Design Guidelines x
10.4.1. RLDRAM 3 Configurations 10.4.2. General Layout Guidelines 10.4.3. RLDRAM 3 Layout Guidelines 10.4.4. Layout Approach 10.4.5. Package Deskew 10.4.6. Package Migration 10.4.7. Slew Rates
11. Intel® Stratix® 10 EMIF IP Timing Closure x
11.1. Timing Closure 11.2. Timing Report DDR 11.3. Optimizing Timing 11.4. Early I/O Timing Estimation
11.1. Timing Closure x
11.1.1. Timing Analysis
11.1.1. Timing Analysis x
11.1.1.1. PHY or Core 11.1.1.2. I/O Timing
11.1.1.2. I/O Timing x
11.1.1.2.1. Read Capture 11.1.1.2.2. Write 11.1.1.2.3. Address and Command 11.1.1.2.4. DQS Gating / Postamble 11.1.1.2.5. Write Leveling
11.4. Early I/O Timing Estimation x
11.4.1. Performing Early I/O Timing Analysis
12. Optimizing Controller Performance x
12.1. Interface Standard 12.2. Bank Management Efficiency 12.3. Data Transfer 12.4. Improving Controller Efficiency
12.4. Improving Controller Efficiency x
12.4.1. Auto-Precharge Commands 12.4.2. Latency 12.4.3. Calibration 12.4.4. Bank Interleaving 12.4.5. Additive Latency and Bank Interleaving 12.4.6. User-Controlled Refresh 12.4.7. Frequency of Operation 12.4.8. Series of Reads or Writes 12.4.9. Data Reordering 12.4.10. Starvation Control 12.4.11. Command Reordering 12.4.12. Bandwidth 12.4.13. Enable Command Priority Control
12.4.2. Latency x
12.4.2.1. Additive Latency
12.4.6. User-Controlled Refresh x
12.4.6.1. Back-to-Back User-Controlled Refresh Usage
13. Intel® Stratix® 10 EMIF IP Debugging x
13.1. Interface Configuration Performance Issues 13.2. Functional Issue Evaluation 13.3. Timing Issue Characteristics 13.4. Verifying Memory IP Using the Signal Tap II Logic Analyzer 13.5. Hardware Debugging Guidelines 13.6. Categorizing Hardware Issues 13.7. Debugging Intel® Stratix® 10 EMIF IP 13.8. Using the Default Traffic Generator 13.9. Using the Configurable Traffic Generator (TG2)
13.1. Interface Configuration Performance Issues x
13.1.1. Interface Configuration Bottleneck and Efficiency Issues
13.2. Functional Issue Evaluation x
13.2.1. Intel® IP Memory Model 13.2.2. Vendor Memory Model 13.2.3. Transcript Window Messages 13.2.4. Modifying the Example Driver to Replicate the Failure
13.3. Timing Issue Characteristics x
13.3.1. Evaluating FPGA Timing Issues 13.3.2. Evaluating External Memory Interface Timing Issues
13.4. Verifying Memory IP Using the Signal Tap II Logic Analyzer x
13.4.1. Signals to Monitor with the Signal Tap II Logic Analyzer
13.5. Hardware Debugging Guidelines x
13.5.1. Create a Simplified Design that Demonstrates the Same Issue 13.5.2. Measure Power Distribution Network 13.5.3. Measure Signal Integrity and Setup and Hold Margin 13.5.4. Vary Voltage 13.5.5. Operate at a Lower Speed 13.5.6. Determine Whether the Issue Exists in Previous Versions of Software 13.5.7. Determine Whether the Issue Exists in the Current Version of Software 13.5.8. Try A Different PCB 13.5.9. Try Other Configurations 13.5.10. Debugging Checklist
13.6. Categorizing Hardware Issues x
13.6.1. Signal Integrity Issues 13.6.2. Hardware and Calibration Issues
13.6.1. Signal Integrity Issues x
13.6.1.1. Characteristics of Signal Integrity Issues 13.6.1.2. Evaluating SignaI Integrity Issues
13.6.1.2. Evaluating SignaI Integrity Issues x
13.6.1.2.1. Skew 13.6.1.2.2. Crosstalk 13.6.1.2.3. Power System 13.6.1.2.4. Clock Signals 13.6.1.2.5. Read Data Valid Window and Eye Diagram 13.6.1.2.6. Write Data Valid Window and Eye Diagram 13.6.1.2.7. OCT and ODT Usage
13.6.2. Hardware and Calibration Issues x
13.6.2.1. Postamble Timing Issues and Margin 13.6.2.2. Intermittent Issue Evaluation
13.7. Debugging Intel® Stratix® 10 EMIF IP x
13.7.1. Debugging With the Legacy External Memory Interface Debug Toolkit 13.7.2. Debugging with the External Memory Interface Unified Calibration Debug Toolkit 13.7.3. On-Chip Debug Port for Intel® Stratix® 10 EMIF IP 13.7.4. Legacy Efficiency Monitor and Protocol Checker 13.7.5. New Efficiency Monitor
13.7.1. Debugging With the Legacy External Memory Interface Debug Toolkit x
13.7.1.1. User Interface 13.7.1.2. Communication 13.7.1.3. Setup and Use 13.7.1.4. Configuring Your EMIF IP for Use with the Legacy Debug Toolkit 13.7.1.5. Reports 13.7.1.6. On-Die Termination Calibration 13.7.1.7. Eye Diagram 13.7.1.8. Driver Margining for Intel® Stratix® 10 EMIF IP 13.7.1.9. Example Tcl Script for Running the Legacy EMIF Debug Toolkit 13.7.1.10. Using the Legacy EMIF Debug Toolkit with Intel® Stratix® 10 HPS Interfaces
13.7.1.4. Configuring Your EMIF IP for Use with the Legacy Debug Toolkit x
13.7.1.4.1. Daisy-Chaining Additional EMIF IP Cores for Debugging 13.7.1.4.2. General Workflow 13.7.1.4.3. Linking the Project to a Device 13.7.1.4.4. Establishing Communication to Connections 13.7.1.4.5. Selecting an Active Interface
13.7.1.8. Driver Margining for Intel® Stratix® 10 EMIF IP x
13.7.1.8.1. Determining Margin
13.7.2. Debugging with the External Memory Interface Unified Calibration Debug Toolkit x
13.7.2.1. Prerequisites for Using the EMIF Unified Calibration Debug Toolkit 13.7.2.2. Configuring a Design to use the EMIF Unified Calibration Debug Toolkit 13.7.2.3. Launching the EMIF Debug Toolkit 13.7.2.4. Using the EMIF Debug Toolkit 13.7.2.5. Exporting Tables 13.7.2.6. Viewing Diagrams in the Eye Viewer 13.7.2.7. Guidelines for Debugging Calibration Issues
13.7.2.2. Configuring a Design to use the EMIF Unified Calibration Debug Toolkit x
13.7.2.2.1. Generating a Design Example with the Debug Toolkit 13.7.2.2.2. Adding Interfaces to an Design Example 13.7.2.2.3. Enabling the EMIF Unified Calibration Debug Toolkit in an Existing Design
13.7.2.4. Using the EMIF Debug Toolkit x
13.7.2.4.1. Memory Configuration Tab 13.7.2.4.2. Calibration Tab 13.7.2.4.3. Calibration Report Tab 13.7.2.4.4. Calibrate Termination Tab 13.7.2.4.5. Vref Margining Tab 13.7.2.4.6. Driver Margining Tab 13.7.2.4.7. ISSP Tab 13.7.2.4.8. Pin Delay Settings Tab
13.7.2.7. Guidelines for Debugging Calibration Issues x
13.7.2.7.1. Debugging Calibration Failure Using Information from the Calibration report 13.7.2.7.2. Debugging Address and Command Leveling Calibration Failure 13.7.2.7.3. Debugging Address and Command Deskew Failure 13.7.2.7.4. Debugging DQS Enable Failure 13.7.2.7.5. Debugging Read Deskew Calibration Failure 13.7.2.7.6. Debugging VREFIN Calibration Failure 13.7.2.7.7. Debugging LFIFO Calibration Failure 13.7.2.7.8. Debugging Write Leveling Failure 13.7.2.7.9. Debugging Write Deskew Calibration Failure 13.7.2.7.10. Debugging VREFOUT Calibration Failure
13.7.3. On-Chip Debug Port for Intel® Stratix® 10 EMIF IP x
13.7.3.1. EMIF On-Chip Debug Port 13.7.3.2. Access Protocol
13.7.4. Legacy Efficiency Monitor and Protocol Checker x
13.7.4.1. Including the Legacy Efficiency Monitor and Protocol Checker in Your Generated IP 13.7.4.2. Running the Legacy Efficiency Monitor with the External Memory Debug Toolkit 13.7.4.3. Communicating Directly to the Legacy Efficiency Monitor and Protocol Checker
13.7.5. New Efficiency Monitor x
13.7.5.1. Enabling the Efficiency Monitor in a Design Example 13.7.5.2. Efficiency Monitor Block Descriptions 13.7.5.3. Control and Status Registers 13.7.5.4. Opening the Efficiency Monitor
13.8. Using the Default Traffic Generator x
13.8.1. Reading the Default Traffic Generator Status 13.8.2. Running Infinite Traffic using the Default Traffic Generator 13.8.3. Changing the Reset Trigger of the Default Traffic Generator 13.8.4. Observing Generated Traffic with Signal Tap
13.9. Using the Configurable Traffic Generator (TG2) x
13.9.1. Enabling the Traffic Generator in a Design Example 13.9.2. Traffic Generator Block Description 13.9.3. Default Traffic Pattern 13.9.4. Configuration and Status Registers 13.9.5. User Pattern 13.9.6. Traffic Generator Status 13.9.7. Starting Traffic with the Traffic Generator 13.9.8. Traffic Generator Configuration User Interface 13.9.9. Examples of Configuring the TG2 Traffic Generator
13.9.5. User Pattern x
13.9.5.1. Test Duration / Instruction pattern 13.9.5.2. Address Pattern 13.9.5.3. Data Pattern and Byte Enable
13.9.5.2. Address Pattern x
13.9.5.2.1. Address Generator Modes 13.9.5.2.2. Address Generator MSB Indices 13.9.5.2.3. Address Generator Effective Width 13.9.5.2.4. Address Generator Relative Frequencies 13.9.5.2.5. Address Pattern Examples - Basic Mode 13.9.5.2.6. Address Pattern Examples - Advanced Mode
13.9.8. Traffic Generator Configuration User Interface x
13.9.8.1. Connecting the Traffic Generator 13.9.8.2. Configuring the Traffic Generator 13.9.8.3. Traffic Generator Preset Selection 13.9.8.4. Traffic Generator Status Report
1. Release Information
2. External Memory Interfaces Intel® Stratix® 10 FPGA IP Introduction
3. Intel® Stratix® 10 EMIF IP Product Architecture
4. Intel® Stratix® 10 EMIF IP End-User Signals
5. Intel® Stratix® 10 EMIF – Simulating Memory IP
6. Intel® Stratix® 10 EMIF IP for DDR3
7. Intel® Stratix® 10 EMIF IP for DDR4
8. Intel® Stratix® 10 EMIF IP for QDR II/II+/II+ Xtreme
9. Intel® Stratix® 10 EMIF IP for QDR-IV
10. Intel® Stratix® 10 EMIF IP for RLDRAM 3
11. Intel® Stratix® 10 EMIF IP Timing Closure
12. Optimizing Controller Performance
13. Intel® Stratix® 10 EMIF IP Debugging
14. External Memory Interfaces Intel® Stratix® 10 FPGA IP User Guide Archives
15. Document Revision History for External Memory Interfaces Intel® Stratix® 10 FPGA IP User Guide

13.9.4. Configuration and Status Registers

You can configure the user traffic pattern by writing to configuration registers that influence the resulting traffic pattern.

Configuration registers that govern the resulting traffic pattern affect one of the following aspects of the pattern:

  • Test duration / Instruction pattern
  • Address pattern
  • Data pattern
Note: This section describes the registers that configure a traffic pattern as seen on the ctrl_amm interface.
Table 358.  Configuration and Status Registers
Symbol Address Register Name Register Width Number of Registers Readable or Writeable Register Section Register Description
0x0 TG_VERSION 32 1 Readable N/A Version number of the traffic generator address map.
0x4 TG_START 1 1 Writeable N/A Perform a write to this register to start the traffic generator (any value).
0x8 TG_LOOP_COUNT 32 1 Readable and Writeable Test Duration/Instruction Pattern The number of read/write loops to run. A loop is defined as a block of writes followed by a block of reads.

If this value is set to 0, the traffic generator will run infinite loops.
0xC TG_WRITE_COUNT 12 1 Readable and Writeable Test Duration/Instruction Pattern The number of unique writes to perform in each loop.
0x10 TG_READ_COUNT 12 1 Readable and Writeable Test Duration/Instruction Pattern Number of unique reads to perform in each loop.
0x14 TG_WRITE_REPEAT_COUNT 16 1 Readable and Writeable Test Duration/Instruction Pattern Number of times to repeat each write operation.
0x18 TG_READ_REPEAT_COUNT 16 1 Readable and Writeable Test Duration/Instruction Pattern Number of times to repeat each read operation.
0x20 TG_CLEAR 4 1 Readable and Writeable Status Clears the failure status registers. Allows clearing these registers independently from one another by writing a 1 to the following bits.

BIT0 - Clears the recorded PNF data.

BIT1 - Clears the recorded number of Avalon reads.

BIT2 - Clears the recorded data of the first failure (address, expected data, and actual data).

BIT3 - Clears the recorded data of address overflow due to burst length (last address written to, failure status).
0x1C TG_BURST_LENGTH 7 1 Readable and Writeable Test Duration/Instruction Pattern Avalon burst length.
0x38 TG_RW_GEN_IDLE_COUNT 16 1 Readable and Writeable Test Duration/Instruction Pattern Number of cycles for which the traffic generator remains idle between a write block and the next read block.
0x3C TG_RW_GEN_LOOP_IDLE_COUNT 16 1 Readable and Writeable Test Duration/Instruction Pattern Number of cycles for which the traffic generator remains idle between a read block and the next write block.
0x40 TG_SEQ_START_ADDR_WR 32 12 Readable and Writeable Address Pattern Start address for writes; used as a seed address in Random and Fixed Modes. Consists of 12 registers, 2 for each address field.[CS1] Each pair of adjacent registers represents the lower 32 bits and upper 32 bits of a start address for the corresponding field. For example:
TG_SEQ_START_ADDR_WR = start_addr_field0[31:0]
TG_SEQ_START_ADDR_WR+1 = start_addr_field0[63:32]
…
TG_SEQ_START_ADDR_WR+10=start_addr_field_5[31:0]
TG_SEQ_START_ADDR_WR+11=start_addr_field_5[63:32]
0x80 TG_ADDR_MODE_WR 2 6 Readable and Writeable Address Pattern

Address mode for writes. Consists of 6 registers, where each register specifies the write address mode for the corresponding address field. Available address modes include (see Address Generator Modes for details): 

TG_ADDR_MODE == 0: Fixed
TG_ADDR_MODE == 1: Random
TG_ADDR_MODE == 2: Sequential
TG_ADDR_MODE == 3: Unused Field
0xC0 TG_RETURN_TO_START_ADDR 1 1 Readable and Writable Address Pattern

If set to 1, specifies to return to start address in each loop. If set to 0, specifies to resume the address pattern from where the previous loop left off.

0x84 TG_RAND_SEQ_ADDRS_RD     Readable and Writeable Address Pattern Number of times to increment sequentially on the random base address before generating a new random write address for reads.
0x88 TG_PASS 1 1 Read Only Status A value of 1 indicates that the traffic generator passed at the end of all test stages.
0x8C TG_FAIL 1 1 Read Only Status A value of 1 indicates that the traffic generator failed at the end of all test stages.
0x90 TG_FAIL_COUNT_L 32 1 Read Only Status The number of failed reads (lower 32 bits).
0x94 TG_FAIL_COUNT_H 32 1 Read Only Status The number of failed reads (upper 32 bits).
0x98 TG_FIRST_FAIL_ADDR_L 32 1 Read Only Status The address of the first failed read (lower 32 bits).
0x9C TG_FIRST_FAIL_ADDR_H 32 1 Read Only Status The address of the first failed read (upper 32 bits).
0xA0 TG_TOTAL_READ_COUNT_L 32 1 Read Only Status The number of read operations executed - sent and received (lower 32 bits).
0xA4 TG_TOTAL_READ_COUNT_H 32 1 Read Only Status The number of read operations executed - sent and received (upper 32 bits).
0xA8 TG_TEST_COMPLETE 1 1 Read Only Status A value of 1 indicates that the traffic generator run has completed.
0xAC TG_INVERT_BYTEEN 1 1 Readable and Writeable Data/Byte-Enable Pattern If set to 1, specifies to invert byte-enable values and write_data.
0xB4 TG_USER_WORM_EN 1 1 Readable and Writeable Test Duration/Instruction Pattern If set to 1, enables WORM mode.
0xB8 TG_TEST_BYTEEN 1 1 Readable and Writeable Data/Byte-Enable Pattern If set to 1, specifies to change the comparison pass/fail condition, such that for each byte:
  • If byte-enable is high, compare readdata with writedata at this byte.
  • If byte-enable is low, compare readdata with inverted writedata at this byte.
0xC4 TG_NUM_DATA_GEN 5 1 Read Only Data/Byte-Enable Pattern Number of data generators in the design.
0xC8 TG_NUM_BYTEEN_GEN 5 1 Read Only Data/Byte-Enable Pattern Number of byte-enable generators in the design.
0xDC TG_RDATA_WIDTH 32 1 Read Only Data/Byte-Enable Pattern Width of read_data, write_data, and PNF signals.
0xEC TG_ERROR_REPORT 32 1 Read Only Status Reports illegal configurations of the traffic generator. Value is 0 when no error is present. (Details about error codes can be found below.)
0xF0 TG_DATA_RATE_WIDTH_RATIO 4 1 Read Only Data/Byte-Enable Pattern Data rate width ratio is the ratio between the data width at the ctrl_amm interface and the data width at the memory interface.
0x100 TG_SEQ_ADDR_INCR 8 6 Readable and Writeable Address Pattern Sequential address increment for both the read and write addresses. This value is only used if the field mode is set to Sequential. Consists of 6 registers, where each register specifies the sequential address increment for both the read and write address generators of the corresponding address field. For field 0 this value must be greater than or equal to the value of TG_BURST_LENGTH.
0x140 TG_SEQ_START_ADDR_RD 32 12 Readable and Writeable Address Pattern

Start address for reads; used as a

seed address in Random and Fixed modes. Organized as 2*6=12 registers to reserve space for 64-bit start addresses across all address fields. The start addresses are organized such that each pair of 2 adjacent start addresses represent the lower 32 bits and upper 32 bits of a start address.
0x180 TG_ADDR_MODE_RD 2 6 Readable and Writeable Address Pattern

Address mode for reads. Consists of 6 registers, where each register specifies the read address mode for the corresponding address field. Available address modes include (see Address Generator Modes for details): 

TG_ADDR_MODE == 0: Fixed
TG_ADDR_MODE == 1: Random
TG_ADDR_MODE == 2: Sequential
TG_ADDR_MODE == 3: Unused Field
0x1C0 TG_PASS 1 1 Read Only Status

A value of 1 indicates that the traffic generator passed at the end of all test stages
0x1C4 TG_FAIL 1 1 Read Only Status A value of 1 indicates that the traffic generator failed at the end of all test stages.
0x1C8 TG_FAIL_COUNT_L 32 1 Read Only Status The number of failed reads (lower 32 bits).
0x1CC TG_FAIL_COUNT_H 32 1 Read Only Status The number of failed reads (upper 32 bits).
0x1D0 TG_FIRST_FAIL_ADDR_L 32 1 Read Only Status The address of the first failed read (lower 32 bits).
0x1D4 TG_FIRST_FAIL_ADDR_H 32 1 Read Only Status

The address of the first failed read (upper 32 bits).
0x1D8 TG_TOTAL_READ_COUNT_L 32 1 Read Only Status

The number of read operations executed - sent and received (lower 32 bits).
0x1DC TG_TOTAL_READ_COUNT_H 32 1 Read Only Status

The number of read operations executed - sent and received (upper 32 bits).
0x1E0 TG_TEST_COMPLETE 1 1 Read Only Status A value of 1 indicates that the traffic generator run has completed.
0x1E4 TG_INVERT_BYTEEN 1 1 Readable and Writable Data/Byte-Enable Pattern If set to 1, specifies to invert byteenable values and write_data.
0x1EC TG_USER_WORM_EN 1 1 Readable and Writable Test Duration/ Instruction Pattern If set to 1, enables WORM mode.
0x1F0 TG_TEST_BYTEEN 1 1 Readable and Writable Data/Byte-Enable Pattern If set to 1, specifies to change the comparison pass/fail condition, such that for each byte:
  • If byte-enable is high, compare readdata with writedata at this byte.
  • If byte-enable is low, compare readdata with inverted writedata at this byte.
0x1F8 TG_NUM_DATA_GEN 5 1 Read Only Data/Byte-Enable Pattern Number of data generators in the design.
0x1FC TG_NUM_BYTEEN_GEN 5 1 Read Only Data/Byte-Enable Pattern Number of byte-enable generators in the design.
0x200 TG_RDATA_WIDTH 32 1 Read Only Data/Byte-Enable Pattern Width of read_data, write_data, and PNF signals.
0x204 TG_ERROR_REPORT 32 1 Read Only Status Reports illegal configurations of the traffic generator. Value is 0 when no error is present. (See details about error codes below.)
0x208 TG_DATA_RATE_WIDTH_RATIO 4 1 Read Only Data/Byte-Enable Pattern Data rate width ratio is the ratio between the data width at the ctrl_amm interface and the data width at the memory interface.
0x240 TG_PNF 32 ceil(TG_RDATA_WIDTH/32) Read Only Status Persistent Pass Not Fail (PNF) signal. Bus Width = TG_RDATA_WIDTH.
0x340 TG_FAIL_EXPECTED_DATA 32 ceil(TG_RDATA_WIDTH/32) Read Only Status The expected data on the first failure. Bus Width = TG_RDATA_WIDTH. (See details below.)
0x440 TG_FAIL_READ_DATA 32 ceil(TG_RDATA_WIDTH/32) Read Only Status The received data on the first failure. Bus Width = TG_RDATA_WIDTH. (See details below.)
0x540 TG_DATA_SEED 32 TG_NUM_DATA_GEN Readable and Writeable Data/Byte-Enable Pattern Seed or starting value for each data generator (DG). This consists of TG_NUM_DATA_GEN entries.

To set the seed value for the first DG[0], use the specified symbol address. For DG[1], increment the symbol address by 4. For DG[2], increment it by 8, etc.

0x580 TG_BYTEEN_SEED 32 TG_NUM_BYTEEN_GEN Readable and Writeable Data/Byte-Enable Pattern Seed or starting value for each byte-enable generator (BEG). This consists of TG_NUM_BYTEEN_GEN entries.

To set the seed value for the first BEG[0], use the specified symbol address. For BEG[1], increment the symbol address by 4. For BEG[2], increment it by 8, etc.

0x5C0 TG_PPPG_SEL 6 TG_NUM_DATA_GEN Readable and Writeable Data/Byte-Enable Pattern Select pattern for a Data Generator. This consists of TG_NUM_DATA_GEN entries. Select from the available pattern modes:

0: Fixed.

1: PRBS7

2: PRBS15

3: PRBS31

4: Rotating
0x600 TG_BYTEEN_SEL 6 TG_NUM_BYTEEN_GEN Readable and Writeable Data/Byte-Enable Pattern Select pattern for a Byte-Enable Generator. This consists of TG_NUM_BYTEEN_GEN. Select from the available pattern modes:

0: Fixed.

1: PRBS7

2: PRBS15

3: PRBS31

4: Rotating
0x640 TG_ADDR_FIELD_RELATIVE_FREQ 16 6 Readable and Writeable Address Pattern Frequency setting for both reads and writes. Consists of 6 registers, where each register specifies after how many read or write operations an address field generates a new address. To understand relative frequencies of address fields, refer to Address Generator Relative Frequencies.
0x680 TG_ADDR_FIELD_MSB_INDEX 6 5 Readable and Writeable Address Pattern Most significant bit (MSB) position setting for both reads and writes. Consists of 5 registers, where each register specifies the index of the MSB of the corresponding field. This ties each of the 6 address generators to a bit range of the generated address. Field number 5 is implied to have an MSB index of AMM_WORD_ADDRESS_WIDTH-1 and need not be specified. The width of an address field is derived from these MSB indices. To understand MSB indices of address fields, refer to Address Generator MSB Indices.
0x6C0 TG_BURSTLENGTH_OVERFLOW_OCCURRED 1 1 Read Only Status A value of 1 indicates that an attempt was made to write outside of the address space. This occurs when the current address plus the burst length is greater than the total address space. This is an invalid operation and the burst length is clipped to prevent an invalid operation on the Avalon® interface.
0x700 TG_BURSTLENGTH_FAIL_ADDR_L 32 1 Read Only Status The address at which the burst length overflow was attempted (lower 32 bits). The value at this register is valid only if TG_BURSTLENGTH_OVERFLOW_OCCURED is 1.
0x704 TG_BURSTLENGTH_FAIL_ADDR_H 32 1 Read Only Status The address at which the burst length overflow was attempted (upper 32 bits). The value at this register is valid only if TG_BURSTLENGTH_OVERFLOW_OCCURED is 1.
0x740 TG_WORM_MODE_TARGETTED_DATA 32 ceil(TG_RDATA_WIDTH/32) Readable Status Checker Received data from the targeted read. Targeted read data is set when WORM mode is enabled and the result of the second read to the first fail address occurs. Bus Width = TG_RDATA_WIDTH.

In the table above, some configuration settings and status information can fit within one 32-bit register, while others are broken into several registers. The Starting Address column indicates the address of the first register in the set while the Number of Registers column indicates the number of registers located after the start address.

For example: TG_PPPG_SEL occupies 8 registers when TG_NUM_DATA_GEN=8, so the data can be accessed by reading from addresses 0x5C0, 0x5C4, … 0x5E0.

Level Two Title