Intel® Stratix® 10 Device Design Guidelines

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ID 683738
Date 8/24/2022
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Document Table of Contents
Document Table of Contents x
Intel® Stratix® 10 Device Design Guidelines
Intel® Stratix® 10 Device Design Guidelines x
Design Flow System Specification Device Selection Early System and Board Planning Pin Connection Considerations for Board Design I/O and Clock Planning Security Considerations Design Entry Design Implementation, Analysis, Optimization, and Verification Document Revision History for Intel® Stratix® 10 Device Design Guidelines
System Specification x
Design Specifications IP Selection Platform Designer
Device Selection x
Device Variant PLLs and Clock Routing Logic, Memory, and Multiplier Density I/O Pin Count, LVDS Channels, and Package Offering Speed Grade Vertical Device Migration
Early System and Board Planning x
Power and Thermal Estimation Thermal Management and Design Temperature Sensing for Thermal Management Voltage Sensor Planning for Device Configuration Planning for On-Chip Debugging
Planning for Device Configuration x
Device Power Cycling and Reconfiguration Configuration Scheme Selection Configuration Features Intel® Quartus® Prime Configuration Settings
Configuration Scheme Selection x
Serial Configuration Devices Download Cables
Intel® Quartus® Prime Configuration Settings x
Optional Configuration Pins Dual Purpose Configuration Pins
Planning for On-Chip Debugging x
On-Chip Debugging Tools Planning Guidelines for Debugging Tools
Pin Connection Considerations for Board Design x
Device Power-Up Power Pin Connections and Power Supplies Configuration Pin Connections Board-Related Intel® Quartus® Prime Settings Signal Integrity Considerations Board-Level Simulation and Advanced I/O Timing Analysis
Power Pin Connections and Power Supplies x
Decoupling Capacitors PLL Board Design Guidelines Transceiver Board Design Guidelines
Configuration Pin Connections x
Configuration Pin Voltage Level Clock Trace Signal Integrity JTAG Pins MSEL Configuration Mode Pins Other Configuration Pins
JTAG Pins x
JTAG Pin Connections Download Cable Operating Voltage JTAG Signal Buffering
Board-Related Intel® Quartus® Prime Settings x
Unused Pins
Signal Integrity Considerations x
High-Speed Board Design Voltage Reference Pins Simultaneous Switching Noise I/O Termination
I/O and Clock Planning x
Making FPGA Pin Assignments Early Pin Planning and I/O Assignment Analysis I/O Features and Pin Connections Clock and PLL Selection PLL Feature Guidelines Clock Control Features I/O Simultaneous Switching Noise
I/O Features and Pin Connections x
I/O Signaling Type Selectable Standards and Flexible I/O Banks Memory Interfaces Dual-Purpose and Special Pin Connections Intel® Stratix® 10 I/O Features
PLL Feature Guidelines x
Clock Feedback Mode Clock Outputs
Design Entry x
Design Recommendations Using IP Cores Reconfiguration Recommended HDL Coding Styles
Design Implementation, Analysis, Optimization, and Verification x
Selecting a Synthesis Tool Device Resource Utilization Reports Intel® Quartus® Prime Messages Timing Constraints and Analysis Area and Timing Optimization Preserving Performance and Reducing Compilation Time Designing with Intel® Hyperflex™ Simulation Power Analysis Power Optimization
Timing Constraints and Analysis x
Recommended Timing Optimization and Analysis Assignments
Power Optimization x
Device and Design Power Optimization Techniques Intel® Quartus® Prime Power Optimization Techniques
Device and Design Power Optimization Techniques x
Device Speed Grade Clock Power Management Memory Power Reduction I/O Power Guidelines
Intel® Quartus® Prime Power Optimization Techniques x
Power Optimization Advisor
Intel® Stratix® 10 Device Design Guidelines

I/O Pin Count, LVDS Channels, and Package Offering

Table 8.  I/O Pin Count, LVDS Channels, and Package Offering Checklist
Number Done? Checklist Item
1   Estimate the number of I/O pins that you require.
2   Consider the I/O pins you need to reserve for debugging.
3   Verify that the number of LVDS channels are enough.

Determine the required number of I/O pins for your application, considering the design interface requirements with other system blocks.

Larger densities and package pin counts offer more full-duplex LVDS channels for different signaling; ensure that your device density-package combination includes enough LVDS channels. Other factors can also affect the number of I/O pins required for a design, including simultaneous switching noise (SSN) concerns, pin placement guidelines, pins used as dedicated inputs, I/O standard availability for each I/O bank, differences between I/O standards and speed for row and column I/O banks, and package migration options.

You can compile any existing designs in the Intel® Quartus® Prime software to determine how many I/O pins are used. Also consider reserving I/O pins for debugging.

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