AN 114: Board Design Guidelines for Intel Programmable Device Packages

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ID 683481
Date 5/27/2022
Public
Document Table of Contents
Document Table of Contents x
1. AN 114: Board Design Guidelines for Intel® Programmable Device Packages
1. AN 114: Board Design Guidelines for Intel® Programmable Device Packages x
1.1. Overview of BGA Packages 1.2. PCB Layout Terminology 1.3. PCB Layout for High-Density BGA Packages 1.4. Document Revision History for AN 114: Board Design Guidelines for Intel® Programmable Device Packages
1.2. PCB Layout Terminology x
1.2.1. Escape Routing 1.2.2. Multi-Layer PCBs 1.2.3. Vias 1.2.4. Via Capture Pad 1.2.5. Surface Land Pad 1.2.6. Stringer
1.2.5. Surface Land Pad x
1.2.5.1. Non Solder Mask Defined Pad 1.2.5.2. Solder Mask Defined Pad
1.3. PCB Layout for High-Density BGA Packages x
1.3.1. Surface Land Pad Dimension 1.3.2. Via Capture Pad Layout and Dimension 1.3.3. Signal Line Space and Trace Width 1.3.4. Number of PCB Layers
1.3.4. Number of PCB Layers x
1.3.4.1. Sample PCB Layout for 1.00-mm Flip-Chip BGA and 0.80-mm UBGA (BT Substrate) 1.3.4.2. Sample PCB Routing Scheme on 6 Layers for 0.5-mm 484-pin MBGA 1.3.4.3. Sample PCB Routing Scheme on 3 Layers for 0.5-mm 383-pin MBGA 1.3.4.4. Sample PCB Routing Scheme on 2 Layers for 0.5-mm 301-pin MBGA 1.3.4.5. Sample PCB Routing Scheme on 2 Layers for 0.5-mm 153-pin MBGA 1.3.4.6. Sample PCB Routing Scheme on 4 Layers for 0.5-mm 144-pin MBGA 1.3.4.7. Sample PCB Routing Scheme on 2 Layers for 0.5-mm 256-pin and 100-pin MBGAs 1.3.4.8. Sample PCB Routing Scheme on 4 Layers for 0.4-mm 81-pin VBGA (also known as WLCSP) 1.3.4.9. Sample PCB Routing Scheme on 2 Layers for 0.5-mm 68-pin MBGA 1.3.4.10. Sample PCB Routing Scheme on 2 Layers for 0.4-mm 36-pin VBGA (also known as WLCSP) 1.3.4.11. Sample PCB Routing Scheme on 3 Layers for 0.8-mm 324-pin UBGA 1.3.4.12. Sample PCB Routing Scheme on 3 Layers for 0.8-mm 169-pin UBGA
1. AN 114: Board Design Guidelines for Intel® Programmable Device Packages

1.2.5.1. Non Solder Mask Defined Pad

In the NSMD pad, the solder mask opening is larger than the copper pad. Thus, the surface land pad’s copper surface is completely exposed, providing greater area to which the BGA solder ball can adhere. Refer to Figure 2 for the Side View of NSMD and SMD Land Pads.

Note: Intel® recommends that you use a NSMD pad for most applications because it provides more flexibility, fewer stress points, and more line-routing space between pads.
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