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Visible to Intel only — GUID: bhc1411116815467
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2.6. Channel Bonding
The channel bonding mode that you select may contribute to the transmitter channel-to-channel skew. A bonded transmitter datapath clocking provides low channel-to-channel skew as compared to non-bonded channel configurations.
For Intel® Stratix® 10 L-tile and H-tile, Intel® Arria® 10, and Intel® Cyclone® 10 GX devices, refer to PMA Bonding chapter of the respective Transceiver PHY User Guides , about how to connect the ATX PLL and fPLL in bonded configuration and non-bonded configuration. For the non-bonded configuration, refer to Implementing Multi-Channel xN Non-Bonded Configuration. For bonded configuration, refer to Implementing x6/xN Bonding Mode.
- In PHY-only mode, you can generate up to 32 channels, provided that the channels are on the same side. In MAC and PHY integrated mode, you can generate up to 8 channels.
Note: The maximum channels of 32 is for configuration simplicity. Refer to the Intel® FPGA Transceiver PHY User Guide for the actual number of channels supported.
- In bonded channel configuration, the lower transceiver clock skew for all channels result in a lower channel-to-channel skew.
- For Stratix V, Arria V, and Cyclone V devices, you must use contiguous channels when you select bonded mode. The JESD204B IP automatically selects between ×6, ×N or feedback compensation (fb_compensation) bonding depending on the number of transceiver channels you set.
- For Intel® Arria® 10, Intel® Cyclone® 10 GX, and Intel® Stratix® 10 L-tile and H-tile devices, you do not have to place the channels in bonded group contiguously. Refer to Table 7 for the clock network selection. Refer to Channel Bonding section of the respective Transceiver PHY User Guides for more information about PMA Bonding.
- For Intel Agilex® 7 and Intel® Stratix® 10 E-tile devices, you must use contiguous channels to enable channel bonding with NRZ PMA transceiver channels.
- In non-bonded channel configuration, the transceiver clock skew is higher and latency is unequal in the transmitter phase compensation FIFO for each channel. This may result in a higher channel-to-channel skew.
Device Family | Core Variation | Bonding Mode Configuration | Maximum Number of Lanes (L) |
---|---|---|---|
Intel Agilex® 7 Intel® Stratix® 10 Intel® Arria® 10 Intel® Cyclone® 10 GX Stratix V Arria V GZ Cyclone V |
PHY only | Bonded | 32 2 |
Non-bonded | 32 2 | ||
MAC and PHY | Bonded | 8 | |
Non-bonded | 8 | ||
Arria V | PHY only | Bonded | 32 2 |
Non-bonded | 32 2 | ||
MAC and PHY | Bonded | 6 | |
Non-bonded | 8 |
Device Family | L ≤ 6 | L > 6 |
---|---|---|
Intel® Stratix® 10 L-tile and H-tile Intel® Arria® 10 Intel® Cyclone® 10 GX |
×6 | ×N 3 |
Stratix V | ×6 | Feedback compensation |
Arria V | ×N | ×N |
Arria V GZ | ×6 | Feedback compensation |
Cyclone V | ×N | ×N |