Intel® Stratix® 10 Embedded Memory User Guide

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ID 683423
Date 9/26/2022
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Document Table of Contents
Document Table of Contents x
1. Intel® Stratix® 10 Embedded Memory Overview 2. Intel® Stratix® 10 Embedded Memory Architecture and Features 3. Intel® Stratix® 10 Embedded Memory Design Considerations 4. Intel® Stratix® 10 Embedded Memory IP References 5. Intel Stratix 10 Embedded Memory Design Example 6. Intel® Stratix® 10 Embedded Memory User Guide Archives 7. Document Revision History for the Intel® Stratix® 10 Embedded Memory User Guide
1. Intel® Stratix® 10 Embedded Memory Overview x
1.1. Intel® Stratix® 10 Embedded Memory Features
2. Intel® Stratix® 10 Embedded Memory Architecture and Features x
2.1. Byte Enable in Intel® Stratix® 10 Embedded Memory Blocks 2.2. Address Clock Enable Support 2.3. Asynchronous Clear and Synchronous Clear 2.4. Memory Blocks Error Correction Code Support 2.5. Force-to-Zero 2.6. Coherent Read Memory 2.7. Freeze Logic 2.8. True Dual Port Dual Clock Emulator 2.9. 'X' Propagation Support in Simulation 2.10. Intel® Stratix® 10 Supported Embedded Memory IPs 2.11. Intel® Stratix® 10 Embedded Memory Clocking Modes 2.12. Intel® Stratix® 10 Embedded Memory Configurations 2.13. Initial Value of Read and Write Address Registers
2.1. Byte Enable in Intel® Stratix® 10 Embedded Memory Blocks x
2.1.1. Byte Enable Controls 2.1.2. Data Byte Output 2.1.3. Byte Enable Behavior
2.4. Memory Blocks Error Correction Code Support x
2.4.1. Parity Bit 2.4.2. ECC Parity Flip 2.4.3. ECC Read-During-Write Behavior 2.4.4. Error Correction Code Truth Table
2.6. Coherent Read Memory x
2.6.1. Forwarding Logic
2.11. Intel® Stratix® 10 Embedded Memory Clocking Modes x
2.11.1. Single Clock Mode 2.11.2. Read/Write Clock Mode 2.11.3. Input/Output Clock Mode 2.11.4. Asynchronous/Synchronous Clears in Clocking Modes 2.11.5. Output Read Data in Simultaneous Read/Write 2.11.6. Independent Clock Enables in Clocking Modes
2.12. Intel® Stratix® 10 Embedded Memory Configurations x
2.12.1. Mixed-Width Port Configurations
3. Intel® Stratix® 10 Embedded Memory Design Considerations x
3.1. Consider the Memory Block Selection 3.2. Consider the Concurrent Read Behavior 3.3. Customize Read-During-Write Behavior 3.4. Consider Power-Up State and Memory Initialization 3.5. Reduce Power Consumption 3.6. Avoid Providing Non-Deterministic Input 3.7. Avoid Changing Clock Signals and Other Control Signals Simultaneously 3.8. Including the Reset Release Intel® FPGA IP in Your Design 3.9. Resource and Timing Optimization Feature in MLAB Blocks 3.10. Consider the Memory Depth Setting
3.3. Customize Read-During-Write Behavior x
3.3.1. Same-Port Read-During-Write Mode 3.3.2. Mixed-Port Read-During-Write Mode
4. Intel® Stratix® 10 Embedded Memory IP References x
4.1. On Chip Memory RAM and ROM Intel® FPGA IPs 4.2. eSRAM Intel® FPGA IP 4.3. FIFO Intel® FPGA IP 4.4. FIFO2 Intel® FPGA IP 4.5. Shift Register (RAM-based) Intel® FPGA IP
4.1. On Chip Memory RAM and ROM Intel® FPGA IPs x
4.1.1. Release Information for RAM and ROM Intel® FPGA IPs 4.1.2. RAM: 1-PORT Intel® FPGA IP Parameters 4.1.3. RAM: 2-PORT Intel® FPGA IP Parameters 4.1.4. RAM: 4-PORT Intel® FPGA IP Parameters 4.1.5. ROM: 1-PORT Intel® FPGA IP Parameters 4.1.6. ROM: 2-PORT Intel® FPGA IP Parameters 4.1.7. RAM and ROM Interface Signals 4.1.8. Changing Parameter Settings Manually
4.1.8. Changing Parameter Settings Manually x
4.1.8.1. RAM and ROM Parameter Settings
4.2. eSRAM Intel® FPGA IP x
4.2.1. Release Information for eSRAM Intel® FPGA IP 4.2.2. eSRAM System Features 4.2.3. eSRAM Intel® FPGA IP Parameters 4.2.4. eSRAM Intel® FPGA IP Interface Signals 4.2.5. eSRAM Intel® FPGA IP Simulation Walk-Through 4.2.6. eSRAM Timing Diagrams
4.2.2. eSRAM System Features x
4.2.2.1. eSRAM Specifications 4.2.2.2. eSRAM Usage Model
4.3. FIFO Intel® FPGA IP x
4.3.1. Release Information for FIFO Intel® FPGA IP 4.3.2. Configuration Methods 4.3.3. Specifications 4.3.4. FIFO Functional Timing Requirements 4.3.5. SCFIFO ALMOST_EMPTY Functional Timing 4.3.6. FIFO Output Status Flag and Latency 4.3.7. FIFO Metastability Protection and Related Options 4.3.8. FIFO Synchronous Clear and Asynchronous Clear Effect 4.3.9. SCFIFO and DCFIFO Show-Ahead Mode 4.3.10. Different Input and Output Width 4.3.11. DCFIFO Timing Constraint Setting 4.3.12. Coding Example for Manual Instantiation 4.3.13. Design Example 4.3.14. Gray-Code Counter Transfer at the Clock Domain Crossing 4.3.15. Guidelines for Embedded Memory ECC Feature 4.3.16. FIFO Intel® FPGA IP Parameters 4.3.17. Reset Scheme
4.3.3. Specifications x
4.3.3.1. Verilog HDL Prototype 4.3.3.2. VHDL Component Declaration 4.3.3.3. VHDL LIBRARY-USE Declaration 4.3.3.4. FIFO Signals 4.3.3.5. FIFO Parameter Settings
4.3.8. FIFO Synchronous Clear and Asynchronous Clear Effect x
4.3.8.1. Recovery and Removal Timing Violation Warnings when Compiling a DCFIFO
4.3.11. DCFIFO Timing Constraint Setting x
4.3.11.1. Embedded Timing Constraint 4.3.11.2. User Configurable Timing Constraint
4.3.11.2. User Configurable Timing Constraint x
4.3.11.2.1. SDC Commands
4.4. FIFO2 Intel® FPGA IP x
4.4.1. Release Information for FIFO2 Intel® FPGA IP 4.4.2. Configuration Methods 4.4.3. Fmax Target Measuring Methodology 4.4.4. Performance Considerations 4.4.5. FIFO2 Intel® FPGA IP Features 4.4.6. FIFO2 Intel® FPGA IP Parameters 4.4.7. FIFO2 Intel® FPGA IP Interface Signals 4.4.8. Reset and Clock Schemes
4.4.5. FIFO2 Intel® FPGA IP Features x
4.4.5.1. FIFO2 Specifications
4.4.6. FIFO2 Intel® FPGA IP Parameters x
4.4.6.1. FIFO2 Parameter Settings
4.4.7. FIFO2 Intel® FPGA IP Interface Signals x
4.4.7.1. SCFIFO Signals 4.4.7.2. DCFIFO Signals
4.4.8. Reset and Clock Schemes x
4.4.8.1. Clock Domains 4.4.8.2. Reset
4.4.8.2. Reset x
4.4.8.2.1. FIFO2 Intel® FPGA IP Reset Guidelines
4.5. Shift Register (RAM-based) Intel® FPGA IP x
4.5.1. Release Information for Shift Register (RAM-based) Intel® FPGA IP 4.5.2. Shift Register (RAM-based) Intel® FPGA IP Features 4.5.3. Shift Register (RAM-based) Intel® FPGA IP General Description 4.5.4. Shift Register (RAM-based) Intel® FPGA IP Parameter Settings 4.5.5. Shift Register Ports and Parameters Setting
5. Intel Stratix 10 Embedded Memory Design Example x
5.1. FIFO and FIFO2 Design Example
5.1. FIFO and FIFO2 Design Example x
5.1.1. Generating the Design Example 5.1.2. Simulating the Design Example
5.1.2. Simulating the Design Example x
5.1.2.1. Simulation Results
1. Intel® Stratix® 10 Embedded Memory Overview
2. Intel® Stratix® 10 Embedded Memory Architecture and Features
3. Intel® Stratix® 10 Embedded Memory Design Considerations
4. Intel® Stratix® 10 Embedded Memory IP References
5. Intel Stratix 10 Embedded Memory Design Example
6. Intel® Stratix® 10 Embedded Memory User Guide Archives
7. Document Revision History for the Intel® Stratix® 10 Embedded Memory User Guide

4.3.7. FIFO Metastability Protection and Related Options

The FIFO Intel® FPGA IP parameter editor provides the total latency, clock synchronization, metastability protection, area, and fMAX options as a group setting for the DCFIFO.
Table 44.  DCFIFO Group Setting for Latency and Related Options This table shows the available group setting.
Group Setting Comment
Lowest latency but requires synchronized clocks This option uses one synchronization stage with no metastability protection. It uses the smallest size and provides good fMAX.

Select this option if the read and write clocks are related clocks.
Minimal setting for unsynchronized clocks This option uses two synchronization stages with good metastability protection. It uses the medium size and provides good fMAX.
Best metastability protection, best fmax and unsynchronized clocks This option uses three or more synchronization stages with the best metastability protection. It uses the largest size but gives the best fMAX.

The group setting for latency and related options is available through the FIFO Intel® FPGA IP parameter editor. The setting mainly determines the number of synchronization stages, depending on the group setting you select. You can also set the number of synchronization stages you desire through the WRSYNC_DELAYPIPE and RDSYNC_DELAYPIPE parameters, but you must understand how the actual number of synchronization stages relates to the parameter values set in different target devices.

The number of synchronization stages set is related to the value of the WRSYNC_DELAYPIPE and RDSYNC_DELAYPIPE pipeline parameters. For some cases, these pipeline parameters are internally scaled down by two to reflect the actual synchronization stage.

The following equation shows the relationship between the actual synchronization stage and the pipeline parameters:

Actual synchronization stage = value of pipeline parameter - 2

Note: The values assigned to WRSYNC_DELAYPIPE and RDSYNC_DELAYPIPE parameters are internally reduced by 2 to represent the actual synchronization stage implemented. Thus, the default value 3 for these parameters corresponds to a single synchronization pipe stage; a value of 4 results in 2 synchronization stages, and so on. Choose 4 (2 synchronization stages) for metastability protection.

The Timing Analyzer includes the capability to estimate the robustness of asynchronous transfers in your design, and to generate a report that details the mean time between failures (MTBF) for all detected synchronization register chains. This report includes the MTBF analysis on the synchronization pipeline you applied between the asynchronous clock domains in your DCFIFO. You can then decide the number of synchronization stages to use in order to meet the range of the MTBF specification you require.

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