AN 778: Intel® Stratix® 10 L-Tile/H-Tile Transceiver Usage

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ID 683086
Date 6/24/2022
Public
Document Table of Contents
Document Table of Contents x
1. Transceiver Layout 2. Tile Architecture Constraints 3. PCIe Guidelines 4. Document Revision History for AN 778: Intel® Stratix® 10 L-Tile/H-Tile Transceiver Usage
1. Transceiver Layout x
1.1. L-Tile and H-Tile Overview
1.1. L-Tile and H-Tile Overview x
1.1.1. PLLs 1.1.2. Transmitter Clock Network 1.1.3. GXT Clock Network 1.1.4. Calibration
1.1.1. PLLs x
1.1.1.1. ATX PLL 1.1.1.2. fPLL 1.1.1.3. CMU PLL
1.1.2. Transmitter Clock Network x
1.1.2.1. Bonded Transceiver Channels - Guidelines for VCCR_GXB and VCCT_GXB
2. Tile Architecture Constraints x
2.1. Transceiver Channel Placement 2.2. Unsupported Dynamic Reconfiguration Features 2.3. Intel® Stratix® 10 L-Tile Transceiver to H-Tile Transceiver Migration 2.4. Thermal Guidelines
2.1. Transceiver Channel Placement x
2.1.1. Possible Combinations of GX and GXT Channels 2.1.2. GX Channels 2.1.3. GXT Channels 2.1.4. Bonded Channel Placement with Data Rate Change 2.1.5. Reference Clock Guidelines for L-Tile and H-Tile 2.1.6. PLL Placement
2.1.1. Possible Combinations of GX and GXT Channels x
2.1.1.1. Possible Combinations of GX and GXT Channels in H-Tile 2.1.1.2. Possible Combinations of GX and GXT Channels in L-Tile
2.1.2. GX Channels x
2.1.2.1. Non-bonded GX Channels 2.1.2.2. Bonded GX Channels
2.1.6. PLL Placement x
2.1.6.1. ATX PLL – fPLL Spacing Requirements 2.1.6.2. ATX PLL Usage Model When Driving GXT Channels 2.1.6.3. Simplex Channel Merging 2.1.6.4. TX PLL Restrictions when Using PCIe*
3. PCIe Guidelines x
3.1. PCIe Hard IP 3.2. PHY Interface for PCIe Express (PIPE)
3.1. PCIe Hard IP x
3.1.1. Channel Placement for PCIe Hard IP 3.1.2. PLL Placement for PCIe Hard IP 3.1.3. Non-PCIe and PCIe Hard IP Channel Placement in L-Tile and H-Tile
3.2. PHY Interface for PCIe Express (PIPE) x
3.2.1. Channel Placement for PIPE 3.2.2. PLL Placement for PIPE 3.2.3. Non-PCIe and PCIe PIPE Channel Placement in H-Tile 3.2.4. Non-PCIe and PCIe PIPE Channel Placement in L-Tile
1. Transceiver Layout
2. Tile Architecture Constraints
3. PCIe Guidelines
4. Document Revision History for AN 778: Intel® Stratix® 10 L-Tile/H-Tile Transceiver Usage

2.4. Thermal Guidelines

Optimal thermal performance can be achieved by reducing the power density within the transceiver tile. Placing many high data rate channels next to each other results in high power density areas within a tile. Following a general guideline of minimizing power density results in a less complex, and cheaper cooling solution for the FPGA.

For best thermal performance you can minimize power density by picking transceiver channel locations early on. Follow these guidelines when placing your transceiver channels within a tile:

  • Spread out channels as much as possible
  • If all channels in a tile are used, intersperse low and high data rate channels
  • The middle of the tile has the best thermal performance, followed by the bottom and then the top of each tile when looking at the Pin Planner

The latest Intel® Stratix® 10 Power and Thermal Calculator (PTC) contains a Thermal worksheet to help you determine the impact of transceiver placement on your thermal solution requirements. Prior to finalizing your board design you should analyze your transceiver channel placement using the Intel® Stratix® 10 PTC to ensure it is thermally optimal.

Note: Contact your local FAE to have Intel run a thermal analysis of your board design after you have determined placement of all transceiver channels.
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