AN 778: Intel® Stratix® 10 L-Tile/H-Tile Transceiver Usage

ID 683086
Date 6/24/2022
Public
Document Table of Contents

2.1.4. Bonded Channel Placement with Data Rate Change

For L-tile and H-tile production devices, GXT, OTN or SDI channels that share a bank or a tile with bonded channels that need to change their data rate through dynamic reconfiguration may momentarily observe transmitter jitter increase or bit errors during the data rate change event of the bonded channels.

Avoid placing GXT channels in the same bank with bonded channels that need to change their data rates. Avoid placing OTN or SDI channels above 9 Gbps in the same bank with bonded channels, or in the same tile with more than four bonded channels that need to change their data rates during operation.

GXT, OTN or SDI channels sharing the same bank with non-bonded channels are not impacted as long as any of the GX, OTN, SDI, and the non-bonded channels in the same bank do not change data rates at the same time. The following figures show the channel placement recommendations for bonded channels with data rate change requirements.

Figure 26. Channel Placement for GXT Channels and Bonded Channels with Data Rate Change
Figure 27. Channel Placement for OTN or SDI channels > 9 Gbps and Bonded Channels with Data Rate Change