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- 4.1.2. s0_axi4_clock_out for Agilex 7 M-Series External Memory Interfaces (EMIF) IP - DDR4 Component
- 4.3.2. s0_axi4_clock_out for Agilex 7 M-Series External Memory Interfaces (EMIF) IP - DDR5 Component
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8.3.7.3. Example of an LPDDR5 Layout on an Altera® FPGA Platform Board
The LPDDR5 signal routing is on upper layers to avoid vertical crosstalk on interface and achieve high performance.


In addition, the following figure shows a LPDDR5 64-bit device board routing sample with pitch dimension of 0.4×0.4mm. The microvia has been used for via transitions on this interface. The microvia mentioned in the following is from top layer to layer 3, it belongs to Type-III stack-up for easier fan-out, not the same as microvia used in Type-IV stack-up. Only one lamination cycle is required, therefore the cost is not increased as much as microvias in Type-IV. You can also use normal PTH with backdrilling to fan out.
