Nios® V Embedded Processor Design Handbook

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ID 726952
Date 11/25/2024
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Document Table of Contents
Document Table of Contents x
1. About the Nios® V Embedded Processor 2. Nios® V Processor Hardware System Design with Quartus® Prime Software and Platform Designer 3. Nios® V Processor Software System Design 4. Nios® V Processor Configuration and Booting Solutions 5. Nios® V Processor - Using the MicroC/TCP-IP Stack 6. Nios® V Processor Debugging, Verifying, and Simulating 7. Nios® V Processor — Remote System Update 8. Nios® V Processor — Using Custom Instruction 9. Nios® V Embedded Processor Design Handbook Archives 10. Document Revision History for the Nios® V Embedded Processor Design Handbook
1. About the Nios® V Embedded Processor x
1.1. Intel® FPGA and Embedded Processors Overview 1.2. Quartus® Prime Software Support 1.3. Nios® V Processor Licensing 1.4. Embedded System Design
2. Nios® V Processor Hardware System Design with Quartus® Prime Software and Platform Designer x
2.1. Creating Nios® V Processor System Design with Platform Designer 2.2. Integrating Platform Designer System into the Quartus® Prime Project 2.3. Designing a Nios® V Processor Memory System 2.4. Clocks and Resets Best Practices 2.5. Assigning a Default Agent 2.6. Assigning a UART Agent for Printing 2.7. JTAG Signals
2.1. Creating Nios® V Processor System Design with Platform Designer x
2.1.1. Instantiating Nios® V Processor Intel® FPGA IP 2.1.2. Defining System Component Design 2.1.3. Specifying Base Addresses and Interrupt Request Priorities
2.1.1. Instantiating Nios® V Processor Intel® FPGA IP x
2.1.1.1. Instantiating Nios® V/c Compact Microcontroller Intel® FPGA IP 2.1.1.2. Instantiating Nios® V/m Microcontroller Intel® FPGA IP 2.1.1.3. Instantiating Nios® V/g General Purpose Processor Intel® FPGA IP
2.1.1.1. Instantiating Nios® V/c Compact Microcontroller Intel® FPGA IP x
2.1.1.1.1. Use Reset Request Tab 2.1.1.1.2. Vectors Tab 2.1.1.1.3. ECC Tab 2.1.1.1.4. CPU Architecture Tab
2.1.1.2. Instantiating Nios® V/m Microcontroller Intel® FPGA IP x
2.1.1.2.1. Debug Tab 2.1.1.2.2. Use Reset Request Tab 2.1.1.2.3. Vectors Tab 2.1.1.2.4. CPU Architecture 2.1.1.2.5. ECC Tab
2.1.1.3. Instantiating Nios® V/g General Purpose Processor Intel® FPGA IP x
2.1.1.3.1. Debug Tab 2.1.1.3.2. Use Reset Request Tab 2.1.1.3.3. Vectors Tab 2.1.1.3.4. Memory Configurations Tab 2.1.1.3.5. Custom Instruction Tab 2.1.1.3.6. CPU Architecture 2.1.1.3.7. ECC Tab 2.1.1.3.8. Lockstep Tab
2.2. Integrating Platform Designer System into the Quartus® Prime Project x
2.2.1. Instantiating the Nios® V Processor System Module in the Quartus® Prime Project 2.2.2. Connecting Signals and Assigning Physical Pin Locations 2.2.3. Constraining the Intel FPGA Design
2.3. Designing a Nios® V Processor Memory System x
2.3.1. Volatile Memory 2.3.2. Non-Volatile Memory 2.3.3. On-Chip Memory Configuration – RAM or ROM 2.3.4. Caches 2.3.5. Tightly Coupled Memory
2.4. Clocks and Resets Best Practices x
2.4.1. System Clock 2.4.2. Reset Request Interface 2.4.3. Reset Release IP
2.4.2. Reset Request Interface x
2.4.2.1. Typical Use Cases
2.6. Assigning a UART Agent for Printing x
2.6.1. Preventing Stalls by the JTAG UART
3. Nios® V Processor Software System Design x
3.1. Nios V Processor Software Development Flow 3.2. Intel FPGA Embedded Development Tools
3.1. Nios V Processor Software Development Flow x
3.1.1. Board Support Package Project 3.1.2. Application Project
3.2. Intel FPGA Embedded Development Tools x
3.2.1. Nios® V Processor Board Support Package Editor 3.2.2. RiscFree* IDE for Intel FPGAs 3.2.3. Nios V Utilities Tools 3.2.4. File Format Conversion Tools 3.2.5. Other Utilities Tools
4. Nios® V Processor Configuration and Booting Solutions x
4.1. Introduction 4.2. Linking Applications 4.3. Nios® V Processor Booting Methods 4.4. Introduction to Nios® V Processor Booting Methods 4.5. Nios® V Processor Booting from Configuration QSPI Flash 4.6. Nios® V Processor Booting from On-Chip Memory (OCRAM) 4.7. Nios® V Processor Booting from Tightly Coupled Memory (TCM) 4.8. Summary of Nios® V Processor Vector Configuration and BSP Settings
4.2. Linking Applications x
4.2.1. Linking Behavior
4.2.1. Linking Behavior x
4.2.1.1. Default BSP Linking 4.2.1.2. Configurable BSP Linking
4.4. Introduction to Nios® V Processor Booting Methods x
4.4.1. Nios® V Processor Application Execute-In-Place from Boot Flash 4.4.2. Nios® V Processor Application Copied from Boot Flash to RAM Using Boot Copier 4.4.3. Nios® V Processor Application Execute-In-Place from OCRAM 4.4.4. Nios® V Processor Application Execute-In-Place from TCM
4.4.1. Nios® V Processor Application Execute-In-Place from Boot Flash x
4.4.1.1. alt_load()
4.4.2. Nios® V Processor Application Copied from Boot Flash to RAM Using Boot Copier x
4.4.2.1. Nios® V Processor Bootloader via Generic Serial Flash Interface 4.4.2.2. Nios® V Processor Bootloader via Secure Device Manager
4.5. Nios® V Processor Booting from Configuration QSPI Flash x
4.5.1. Nios V Processor Design, Configuration and Boot Flow (Control Block-based Device) 4.5.2. Nios V Processor Design, Configuration and Boot Flow (SDM-based Devices)
4.5.1. Nios V Processor Design, Configuration and Boot Flow (Control Block-based Device) x
4.5.1.1. Nios® V Processor Application Executes-In-Place from Configuration QSPI Flash 4.5.1.2. Nios® V Processor Application Copied from Configuration QSPI Flash to RAM Using Boot Copier (Bootloader via GSFI) 4.5.1.3. Bootloader via GSFI Example Design
4.5.1.1. Nios® V Processor Application Executes-In-Place from Configuration QSPI Flash x
4.5.1.1.1. Hardware Design Flow 4.5.1.1.2. Software Design Flow 4.5.1.1.3. Programming Files Generation 4.5.1.1.4. QSPI Flash Programming
4.5.1.2. Nios® V Processor Application Copied from Configuration QSPI Flash to RAM Using Boot Copier (Bootloader via GSFI) x
4.5.1.2.1. Hardware Design Flow 4.5.1.2.2. Software Design Flow 4.5.1.2.3. Programming Files Generation 4.5.1.2.4. QSPI Flash Programming
4.5.2. Nios V Processor Design, Configuration and Boot Flow (SDM-based Devices) x
4.5.2.1. Nios® V Processor Application Copied from Configuration QSPI Flash to RAM Using Boot Copier (Bootloader via SDM) 4.5.2.2. Bootloader via SDM Example Design
4.5.2.1. Nios® V Processor Application Copied from Configuration QSPI Flash to RAM Using Boot Copier (Bootloader via SDM) x
4.5.2.1.1. Hardware Design Flow 4.5.2.1.2. Software Design Flow 4.5.2.1.3. Software Design Flow (Bootloader via SDM Project) Creating the Bootloader via SDM BSP Project Configuring BSP Editor and Generating the BSP Project Create the Bootloader via SDM Application Project Building the Bootloader via SDM Project Generating the HEX File and Initializing the Memory 4.5.2.1.4. Software Design Flow (User Application Project) 4.5.2.1.5. Programming Files Generation 4.5.2.1.6. QSPI Flash Programming SDM
4.6. Nios® V Processor Booting from On-Chip Memory (OCRAM) x
4.6.1. Nios® V Processor Application Executes in-place from OCRAM
4.6.1. Nios® V Processor Application Executes in-place from OCRAM x
4.6.1.1. Hardware Design Flow 4.6.1.2. Software Design Flow 4.6.1.3. Programming
4.7. Nios® V Processor Booting from Tightly Coupled Memory (TCM) x
4.7.1. Nios® V Processor Application Executes in-place from TCM
4.7.1. Nios® V Processor Application Executes in-place from TCM x
4.7.1.1. Hardware Design Flow 4.7.1.2. Software Design Flow 4.7.1.3. Programming
5. Nios® V Processor - Using the MicroC/TCP-IP Stack x
5.1. Introduction 5.2. Software Architecture 5.3. Support and Licensing 5.4. MicroC/TCP-IP Example Designs 5.5. Development Flow 5.6. Operating the Example Designs 5.7. Optional Configuration 5.8. MicroC/TCP-IP Simple Socket Server Concepts
5.4. MicroC/TCP-IP Example Designs x
5.4.1. Hardware and Software Requirements 5.4.2. Overview 5.4.3. Acquiring the Example Design Files 5.4.4. Hardware Design Files 5.4.5. Software Design Files
5.4.5. Software Design Files x
5.4.5.1. MicroC/TCP-IP IPerf Example Design 5.4.5.2. MicroC/TCP-IP Simple Socket Server Example Design
5.5. Development Flow x
5.5.1. Hardware Development Flow 5.5.2. Software Development Flow 5.5.3. Device Programming
5.5.2. Software Development Flow x
5.5.2.1. Creating a BSP project 5.5.2.2. Configuring the BSP 5.5.2.3. Creating an Application Project 5.5.2.4. Building the Application Project
5.6. Operating the Example Designs x
5.6.1. Operating the MicroC/TCP-IP IPerf 5.6.2. Operating the MicroC/TCP-IP Simple Socket Server
5.7. Optional Configuration x
5.7.1. Configuring Hardware Name 5.7.2. Configuring MAC and IP Addresses 5.7.3. Configuring MicroC/TCP-IP Initialization 5.7.4. Configuring iPerf Server Auto-Initialization
5.7.3. Configuring MicroC/TCP-IP Initialization x
5.7.3.1. Network Task Configuration 5.7.3.2. Network Interface Configuration
5.8. MicroC/TCP-IP Simple Socket Server Concepts x
5.8.1. MicroC/OS-II Resources 5.8.2. Error Handling 5.8.3. MicroC/TCP-IP Stack Default Configuration
6. Nios® V Processor Debugging, Verifying, and Simulating x
6.1. Debugging Nios® V/c Processor 6.2. Debugging Nios® V Processor Hardware Designs 6.3. Debugging Nios® V Processor Software Designs 6.4. Debugging Tools 6.5. Additional Embedded Design Considerations 6.6. Simulating Nios® V Processor Designs
6.1. Debugging Nios® V/c Processor x
6.1.1. Pilot System with Non-pipelined Nios V/m Processor 6.1.2. printf() Debugging
6.2. Debugging Nios® V Processor Hardware Designs x
6.2.1. JTAG Server 6.2.2. System Console 6.2.3. Signal Tap Logic Analyzer 6.2.4. In-System Sources and Probes
6.2.2. System Console x
6.2.2.1. JTAG to Avalon® Host Bridge Core
6.2.3. Signal Tap Logic Analyzer x
6.2.3.1. Hardware and Software Requirements 6.2.3.2. Setting Up Signal Tap Logic Analyzer 6.2.3.3. Running the Capture Session 6.2.3.4. Analyzing Results
6.2.3.2. Setting Up Signal Tap Logic Analyzer x
6.2.3.2.1. Enabling Signal Tap Logic Analyzer 6.2.3.2.2. Adding Signals for Monitoring and Debugging 6.2.3.2.3. Specifying Trigger Conditions 6.2.3.2.4. Assigning the Acquisition Clock, Sample Depth, and Memory Type, and Buffer Acquisition Mode 6.2.3.2.5. Compiling the Design and Programming the Target Device
6.2.3.2.3. Specifying Trigger Conditions x
6.2.3.2.3.1. Basic Trigger Conditions 6.2.3.2.3.2. Power-Up Trigger Conditions 6.2.3.2.3.3. Other Trigger Conditions 6.2.3.2.3.4. No Trigger Conditions
6.2.3.3. Running the Capture Session x
6.2.3.3.1. Performing Data Capture with Ashling* RiscFree* IDE for Intel® FPGAs 6.2.3.3.2. Performing Data Capture Without Software Download
6.2.3.4. Analyzing Results x
6.2.3.4.1. Viewing Data 6.2.3.4.2. Correlating Trace Data to Software ELF 6.2.3.4.3. Saving and Converting Captured Data
6.3. Debugging Nios® V Processor Software Designs x
6.3.1. Ashling* RiscFree* IDE for Intel® FPGAs 6.3.2. OpenOCD 6.3.3. Objdump File 6.3.4. Show Make Commands
6.5. Additional Embedded Design Considerations x
6.5.1. JTAG Signal Integrity 6.5.2. Additional Memory Space for System Prototyping
6.6. Simulating Nios® V Processor Designs x
6.6.1. Prerequisites 6.6.2. Setting Up and Generating Your Simulation Environment in Platform Designer 6.6.3. Creating Nios V Processor Software 6.6.4. Generating Memory Initialization File 6.6.5. Generating System Simulation Files 6.6.6. Running Simulation in the QuestaSim Simulator Using Command Line
6.6.2. Setting Up and Generating Your Simulation Environment in Platform Designer x
6.6.2.1. Using IP and Platform Designer Simulation Setup Scripts
6.6.3. Creating Nios V Processor Software x
6.6.3.1. Generating the Board Support Package 6.6.3.2. Generating the Application Project File 6.6.3.3. Building the Application Project
7. Nios® V Processor — Remote System Update x
7.1. Overview 7.2. Quartus® Prime Pro Edition Software and Tool Support 7.3. Nios® V Processor RSU Quick Start Guide in SDM-based Devices
7.2. Quartus® Prime Pro Edition Software and Tool Support x
7.2.1. Intel® Quartus® Prime Pro Edition Software 7.2.2. Programming File Generator
7.2.1. Intel® Quartus® Prime Pro Edition Software x
7.2.1.1. Setting Max Retry Parameter 7.2.1.2. Selecting Factory Load Pin
7.2.2. Programming File Generator x
7.2.2.1. Programming File Generator File Types 7.2.2.2. Bitswap Option 7.2.2.3. Quartus® Prime Programmer 7.2.2.4. Supported QSPI Flash Devices
7.3. Nios® V Processor RSU Quick Start Guide in SDM-based Devices x
7.3.1. Individual Factory, Application, and Update Images 7.3.2. Hardware Design Flow 7.3.3. Software Design Flow 7.3.4. Individual Images Generation 7.3.5. Remote System Update Image Files Generation 7.3.6. QSPI Flash Programming 7.3.7. Operating the RSU Client API
7.3.2. Hardware Design Flow x
7.3.2.1. Create a Platform Designer System 7.3.2.2. Quartus® Prime Software Settings
7.3.3. Software Design Flow x
7.3.3.1. Generating the ZLIB libraries 7.3.3.2. Creating a Board Support Package Project 7.3.3.3. Configuring and Generating the BSP Project 7.3.3.4. Creating Multiple Application Projects 7.3.3.5. Building the Application Projects 7.3.3.6. Generating HEX Files
7.3.5. Remote System Update Image Files Generation x
7.3.5.1. Generating Initial RSU Image Using SOF file 7.3.5.2. Generating an Application Update Image 7.3.5.3. Generating a Factory Update Flash Image
7.3.6. QSPI Flash Programming x
7.3.6.1. Programming the Initial RSU Image 7.3.6.2. Programming the Update Images
7.3.7. Operating the RSU Client API x
7.3.7.1. Trigger Reconfiguration Menu with Selected Image 7.3.7.2. Updating an Application Image 7.3.7.3. Updating the Factory Image
8. Nios® V Processor — Using Custom Instruction x
8.1. Introduction 8.2. Unimplemented Instruction Example Design 8.3. Hardware Acceleration Example Design
8.2. Unimplemented Instruction Example Design x
8.2.1. Hardware and Software Requirements 8.2.2. Overview 8.2.3. Acquiring the Example Design File 8.2.4. Hardware Design Files 8.2.5. Software Design Files 8.2.6. Development Flow 8.2.7. Operating the Example Design
8.2.6. Development Flow x
8.2.6.1. Hardware Development Flow 8.2.6.2. Software Development Flow 8.2.6.3. Device Programming
8.3. Hardware Acceleration Example Design x
8.3.1. Hardware and Software Requirements 8.3.2. Overview 8.3.3. Acquiring the Example Design File 8.3.4. Hardware Design Files 8.3.5. Software Design Files 8.3.6. Development Flow 8.3.7. Operating the Example Design
8.3.6. Development Flow x
8.3.6.1. Hardware Development Flow 8.3.6.2. Software Development Flow 8.3.6.3. Device Programming
1. About the Nios® V Embedded Processor
2. Nios® V Processor Hardware System Design with Quartus® Prime Software and Platform Designer
3. Nios® V Processor Software System Design
4. Nios® V Processor Configuration and Booting Solutions
5. Nios® V Processor - Using the MicroC/TCP-IP Stack
6. Nios® V Processor Debugging, Verifying, and Simulating
7. Nios® V Processor — Remote System Update
8. Nios® V Processor — Using Custom Instruction
9. Nios® V Embedded Processor Design Handbook Archives
10. Document Revision History for the Nios® V Embedded Processor Design Handbook

4.5.2.1.3. Software Design Flow (Bootloader via SDM Project)

This section provides the design flow to generate and build the Bootloader via SDM project.

Creating the Bootloader via SDM BSP Project

To launch the BSP Editor, follow these steps:

  1. In the Platform Designer window, select File > New BSP. The Create New BSP windows appears.
  2. For BSP setting file, navigate to the software/mailbox_bootloader/bsp folder and name the BSP as settings.bsp.

    BSP path: <project directory>/software/mailbox_bootloader/bsp/settings.bsp

  3. For System file (qsys or sopcinfo), select the Nios® V processor Platform Designer system (.qsys) file.
  4. For Quartus project, select the Quartus Project File.
  5. For Revision, select the correct revision.
  6. For CPU name, select the Nios® V processor.
  7. Select the Operating system as Altera HAL.
  8. Click Create to create the BSP file.
Figure 53. Create New BSP Window

Configuring BSP Editor and Generating the BSP Project

  1. Go to BSP Editor > Main > Settings
  2. Configure the settings per the following table:
    Table 31.  Settings for BSP Editor
    Settings Action

    hal.max_file_descriptors 5

    		Input as 4

    hal.log_port 5

    		Select as None

    hal.enable_exit 5

    hal.enable_clean_exit 5

    hal.c_plus_plus 5

    		Unchecked to disable the feature.

    hal.sys_clk_timer 5

    hal.timerstamp_timer 5

    hal.stdin 5

    hal.stdout 5

    hal.stderr 5

    		Select as None
    hal.linker

    Enable the following settings:

    • allow_code_at_reset

    • enable_alt_load

    • enable_alt_load_copy_rodata

    • enable_alt_load_copy_rwdata

    • enable_alt_load_copy_exceptions

    hal.make.cflags_user_flags 5

    		Input as -ffunction-sections -fdata-sections

    hal.make.link_flags 5

    		Input as -Wl,--gc-sections

    hal.make.cflags_optimization 5

    		Input as -Os
    :
    Figure 54. hal Settings
    Figure 55. hal.linker Settings
    Figure 56. hal.toolchain Settings
    Figure 57. hal.make Settings
  3. Go to BSP Software Package and enable altera_safeclib
    Figure 58. BSP Software Package
  4. Click the BSP Linker Script tab in the BSP Editor.
  5. Set the .text item in the Linker Section Name to the Bootloader ROM in the Linker Region Name. Set the rest of the items in the Linker Section Name list to the Bootloader RAM.
    Figure 59. Linker Region Settings
  6. Navigate to the BSP Driver tab and disable all drivers (except the Nios® V Processor and Mailbox Client Intel® FPGA IP).
    Figure 60. BSP Driver tab
  7. Click Generate BSP. Make sure the BSP generation is successful.
  8. Close the BSP Editor.

Create the Bootloader via SDM Application Project

  1. Download the example design files (Refer to Bootloader via SDM Example Design section). You do not need to build the example design.
  2. Navigate to the sw/mailbox_bootloader/app folder in the Bootloader via SDM Example Design project.
  3. Copy the Bootloader via SDM (mailbox_bootloader.c) into the software/mailbox_bootloader/app folder in your project.
  4. Redefine the PAYLOAD_OFFSET in mailbox_bootloader.c.
    Note: The SOF image size influences the PAYLOAD_OFFSET. The PAYLOAD_OFFSET is the start address of the Nios® V application HEX file in QSPI flash and must point to a location after the SOF image. You can determine the minimum PAYLOAD_OFFSET by using the configuration bitstream size from the device datasheet.

    For example, the estimated compressed configuration bitstream size for Intel Stratix 10 SX 2800 is 577 Mbits (72.125 MBytes). The actual size can be equal or smaller than this bitstream size. If the SOF image starts at address 0x0, the SOF image should reached until address 0x44C8FFF (0x44C8A48). With that, the minimum PAYLOAD_OFFSET you can select is 0x4500000.

  5. Launch the Nios V Command Shell.
  6. Execute the command below to generate the Bootloader via SDM application CMakeLists.txt. 
    niosv-app --app-dir=software/mailbox_bootloader/app\
        --bsp-dir=software/mailbox_bootloader/bsp\
        --srcs=software/mailbox_bootloader/app/mailbox_bootloader.c

Building the Bootloader via SDM Project

You can choose to build the Bootloader via SDM project using the RiscFree* IDE for Intel FPGAs or through the command line interface (CLI).

With the CLI , you can build the Bootloader via SDM using the following commands:

cmake -G "Unix Makefiles" -DCMAKE_BUILD_TYPE=Release -B \
        software/mailbox_bootloader/app/release -S \ 
        software/mailbox_bootloader/app

make -C software/mailbox_bootloader/app/release

The Bootloader via SDM (.elf) file is created in

software/mailbox_bootloader/app/release folder.

Generating the HEX File and Initializing the Memory

A HEX file must be generated from the ELF file so that the HEX file can be used for memory initialization.

  1. Launch the Nios V Command Shell.
  2. For Bootloader via SDM, use the following command line to convert the ELF to HEX. This command creates the Bootloader via SDM (bootcopier_rom.hex) file. 
elf2hex software/mailbox_bootloader/app/release/app.elf \
  -o bootcopier_rom.hex \
  -b <base address of Bootloader ROM> \
  -w <data width of Bootloader ROM in bits> \
  -e <end address of Bootloader ROM> \
  -r <data width of Bootloader ROM in bytes>

Recompile the hardware design to memory-initialize the bootcopier_rom.hex into the Bootloader ROM.

Related Information
5 Altera recommends you to use these settings to reduce the Bootloader via SDM code footprint.
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