AN 950: Temperature Excursions: for Intel® Stratix® 10 and Intel Agilex® 7 F-Series/I-Series Device Families

ID 713583
Date 10/02/2023
Public

2. Temporary Equipment Malfunction

Some industry standards require that system function be maintained under stringent environmental conditions that may occur during a cooling system failure or other problem.

For example: for telecommunication applications, the Telecom Telcordia NEBs GR-63 standard defines guidelines to ensure that systems allow for such temperature excursions. The table below shows guidelines from the Telcordia standard. These guidelines indicate that the system must support operation at an ambient temperature of 50°C for a total duration of 4 days or 96 consecutive hours for the repair intervention. For that purpose, this application note specifies duration and cumulative temperature-excursion hours that are still within the 11.4 years lifetime of the Intel® FPGAs.

For other applications, refer to the Temperature Excursion Definitions table for temperature excursion information.

Table 1.  Telcordia Temperature Excursion Requirements
Condition Limit
Temperature
Operating (up to 1829 meters or 6000 feet) 5°C to 40°C
Short-term * -5°C to 50°C
Short-term with fan failure -5°C to 40°C
Rate of Temperature Change
Operating 30°C / hour
Relative Humidity
Operating 5% to 85%
Short-term * 5% to 93%, but not to exceed 0.026 kg water/kg of dry air
Note: * Short-term refers to a period of not more than 96 consecutive hours and a total of not more than 15 days in 1 year. (This refers to a total of 360 hours in any given year, but no more than 15 occurrences during that 1-year period.)