AN 950: Temperature Excursions: for Intel® Stratix® 10 and Intel Agilex® 7 F-Series/I-Series Device Families

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ID 713583
Date 10/02/2023
Public
Document Table of Contents x
1. Introduction 2. Temporary Equipment Malfunction 3. Temperature Excursion Allowances and Limitations 4. Power Estimation 5. Timing Analysis 6. Document Revision History for AN 950
1. Introduction
2. Temporary Equipment Malfunction
3. Temperature Excursion Allowances and Limitations
4. Power Estimation
5. Timing Analysis
6. Document Revision History for AN 950

4. Power Estimation

You must verify the thermal impact of the higher junction excursion temperature on your design by analyzing the power increase with the Intel® FPGA Power and Thermal Calculator (Intel FPGA PTC) or the Intel® Quartus® Prime Power Analyzer.

For Intel FPGA PTC or Intel® Quartus® Prime Power Analyzer support above 100°C, increase the ambient temperature value until the higher excursion junction temperature is reached. You must use the updated total power in your thermal simulation to ensure that the junction temperature does not exceed the maximum excursion junction temperature.

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