L- and H-Tile Transceiver PHY User Guide

ID 683621
Date 12/13/2024
Public
Document Table of Contents

1. Overview

Stratix® 10 devices offer up to 144 transceivers with integrated advanced high-speed analog signal conditioning and clock data recovery circuits for chip-to-chip, chip-to-module, and backplane applications.

The Stratix® 10 devices contain a combination of GX, GXT, or GXE channels, in addition to the hardened IP blocks for PCI Express* and Ethernet applications.

The Stratix® 10 device introduces several transceiver tile variants to support a wide variety of protocol implementations. These transceiver tile variants are L-tiles, H-tiles, and E-tiles. This user guide describes both the L- and H-tile transceivers. For Stratix® 10 devices that only contain E-tiles, refer to the E-Tile Transceiver PHY User Guide.

Table 1.  Transceiver Tile Variants—Comparison of Transceiver Capabilities
Feature L-Tile H-Tile E-Tile
Maximum Transceiver Data Rate (Chip-to-chip)

GX 1—17.4 Gbps

GXT 1—26.6 Gbps

GX—17.4 Gbps

GXT—28.3 Gbps

GXE 2—57.8 Gbps Pulse Amplitude Modulation 4 (PAM4)/28.9 Gbps Non-return to zero (NRZ)
Maximum Transceiver Data Rate (Backplane)

GX—12.5 Gbps

GXT—12.5 Gbps

Number of Transceiver Channels (per tile)

GX—16 per tile

GXT—8 per tile

Total—24 per tile (4 banks, 6 channels per bank)

GX—8 per tile

GXT—16 per tile

Total—24 per tile (4 banks, 6 channels per bank)

GXE—24 individual channels per tile
Hard IP (per tile) PCIe* —Gen3 x16

PCIe* —Gen3 x16, SR-IOV (4 PF, 2K VF)

Ethernet—100GbE MAC

Ethernet—100GbE MAC and RS (528, 514)-FEC, 4 per tile

Ethernet—KP-FEC, 4 per tile

Ethernet—10/25GbE MAC and RS (528, 514)-FEC, 24 per tile

In all Stratix® 10 devices, the various transceiver tiles connect to the FPGA fabric using Intel EMIB (Embedded Multi-Die Interconnect Bridge) technology.

1 Refer to the L-Tile/H-Tile Building Blocks section for further descriptions of GX and GXT channels.
2 Refer to the E-Tile Transceiver PHY User Guide for a full description of GXE channels.