Intel® FPGA Power and Thermal Calculator User Guide

Download PDF
ID 683445
Date 10/04/2021
Public

A newer version of this document is available. Customers should click here to go to the newest version.

Document Table of Contents
Document Table of Contents x
1. Overview of the Intel® FPGA Power and Thermal Calculator 2. Setting Up the Intel® FPGA Power and Thermal Calculator 3. Intel® FPGA Power and Thermal Calculator Graphical User Interface 4. Intel® FPGA Power and Thermal Calculator Pages 5. Factors Affecting the Accuracy of the Intel® FPGA Power and Thermal Calculator 6. Intel® FPGA Power and Thermal Calculator User Guide Archive 7. Document Revision History for the Intel® FPGA Power and Thermal Calculator User Guide A. Measuring Static Power
1. Overview of the Intel® FPGA Power and Thermal Calculator x
1.1. Intel® FPGA PTC Power Model Status 1.2. Definitions of Power Terms Used in this Document
2. Setting Up the Intel® FPGA Power and Thermal Calculator x
2.1. Availability 2.2. Obtaining the Standalone Intel® FPGA Power and Thermal Calculator 2.3. Estimating Power Consumption with the Intel® FPGA Power and Thermal Calculator 2.4. Power Analysis for Dual-Core 1SG10M Intel® Stratix® 10 Devices
2.3. Estimating Power Consumption with the Intel® FPGA Power and Thermal Calculator x
2.3.1. Estimating Power Consumption Before Starting the FPGA Design 2.3.2. Estimating Power Consumption While Creating the FPGA Design 2.3.3. Estimating Power Consumption After Completing the FPGA Design
3. Intel® FPGA Power and Thermal Calculator Graphical User Interface x
3.1. Intel® FPGA PTC Select Family Dialog Box 3.2. Intel® FPGA PTC Basic GUI Components
3.2. Intel® FPGA PTC Basic GUI Components x
3.2.1. Intel® FPGA PTC Data Entry Pages 3.2.2. Intel® FPGA PTC Field Types 3.2.3. Intel® FPGA PTC Input Field Dependencies 3.2.4. Intel® FPGA PTC Data Entry Error Messages
4. Intel® FPGA Power and Thermal Calculator Pages x
4.1. Intel® FPGA PTC - Power Summary 4.2. Intel® FPGA PTC - Common Page Elements 4.3. Intel® FPGA PTC - Device Selection and Thermal Analysis Windows 4.4. Intel® FPGA PTC - Main Page 4.5. Intel® FPGA PTC - Logic Page 4.6. Intel® FPGA PTC - RAM Page 4.7. Intel® FPGA PTC - DSP Page 4.8. Intel® FPGA PTC - Clock Page 4.9. Intel® FPGA PTC - PLL Page 4.10. Intel® FPGA PTC - I/O Page 4.11. Intel® FPGA PTC - I/O-IP Page 4.12. Intel® FPGA PTC - Transceiver Page 4.13. Intel® FPGA PTC - HPS Page 4.14. Intel® FPGA PTC - HBM Page ( Intel® Stratix® 10 Devices Only) 4.15. Intel® FPGA PTC - Thermal Page 4.16. Intel® FPGA PTC - Report Page
4.12. Intel® FPGA PTC - Transceiver Page x
4.12.1. Estimating E-Tile Channel PLL Power with the Intel Power and Thermal Calculator
5. Factors Affecting the Accuracy of the Intel® FPGA Power and Thermal Calculator x
5.1. Toggle Rate 5.2. I/O Bank Allocation
1. Overview of the Intel® FPGA Power and Thermal Calculator
2. Setting Up the Intel® FPGA Power and Thermal Calculator
3. Intel® FPGA Power and Thermal Calculator Graphical User Interface
4. Intel® FPGA Power and Thermal Calculator Pages
5. Factors Affecting the Accuracy of the Intel® FPGA Power and Thermal Calculator
6. Intel® FPGA Power and Thermal Calculator User Guide Archive
7. Document Revision History for the Intel® FPGA Power and Thermal Calculator User Guide
A. Measuring Static Power

4.4. Intel® FPGA PTC - Main Page

The Main page of the Intel® FPGA Power and Thermal Calculator ( Intel® FPGA PTC) allows you to enter device, package, and cooling information, and displays thermal analysis options.
Figure 10.  Intel® FPGA PTC Main Page

The required parameters depend on whether the junction temperature is manually entered or auto computed.

Table 4.  Device Selection Parameters
Parameter Description
Family Shows the device family selected at startup, either directly or through the imported file.
Device

Select your device.

Larger devices consume more static power and have higher clock dynamic power. All other power components are unaffected by device selection.

Device Grade

Select the combination of Operating Temperature, Speed Grade, and Power Option used. Refer to the device datasheet for available combinations.

Package

Select the device package.

Larger packages provide a larger cooling surface and more contact points to the circuit board, thus they offer lower thermal resistance. Package selection does not affect dynamic power directly.

Transceiver Grade Select the transceiver grade.
Note: For information on transceiver grades, refer to the Device Overview document for a given device family.
Power characteristics

Select typical or maximum power.

There is a process variation from die-to-die. This variation primarily affects static power consumption. If you choose Typical power characteristics, estimates are based on longterm projections of average power consumed by typical silicon. For FPGA board power supply design and thermal design, choose Maximum for worst-case values.

Note: Typical power characteristics should not be used for regulator sizing or thermal analysis; use maximum power characteristics for these activities.

VCC Voltage (mV) (This field appears in the Intel® Stratix® 10 PTC only.)
Power Model Status Indicates whether the power model for the device is in advance, preliminary, or final status.

The Thermal Analysis section displays the junction temperature (TJ) and other thermal parameters, depending on the thermal analysis mode.

Table 5.  Thermal Analysis
Column Heading Description
Calculation mode Specifies the calculation mode for the thermal solver to use. The available choices are:
  • Use a constant junction temperature.
  • Find cooling solution for maximum junction temperature limit.
  • Find available thermal margin for cooling solution.
  • Find ambient temperature for specified cooling solution.
Note: For more detailed information on Calculation mode settings, refer to Intel® FPGA PTC - Thermal Page.
Junction temperature, TJ (°C) Specify the junction temperature for all dies in the package. This field is available when you select Use a constant junction temperature as the Calculation mode.

In this mode, the junction temperatures for all dies in the package are assumed to have the specified value. To automatically compute junction temperatures, select one of the other options in the same field.

Level Two Title