4.2. Evaluation with Texas Instruments* 's TMP468 Temperature Sensing Chip Evaluation Board
This evaluation was conducted with setup steps as described in Offset Compensation
The data was collected before and after applying the offset compensation. Different offset temperature was applied to different Intel® FPGA blocks because a single offset value cannot be applied on all blocks. The following figures show the results.
Figure 12. Data for Intel® Stratix® 10 Core Fabric
Figure 13. Data for Intel® FPGA H-Tile and L-Tile
Figure 14. Data for Intel® FPGA E-Tile
Figure 15. Data for Intel® FPGA P-Tile