4. Evaluation Results
In the evaluation, the Maxim Integrated* 's MAX31730 and Texas Instruments* 's TMP468 evaluation kits were modified to interface with the remote temperature diodes of several blocks in the Intel® FPGA.
Block | Temperature Sensing Chip Evaluation Board | |
---|---|---|
Texas Instruments* 's TMP468 | Maxim Integrated* 's MAX31730 | |
Intel® Stratix® 10 core fabric | Yes | Yes |
H-tile or L-tile | Yes | Yes |
E-tile | Yes | Yes |
P-tile | Yes | Yes |
The following figures show the setup of the Intel® FPGA board with the Maxim Integrated* and Texas Instruments* evaluation boards.
Figure 6. Setup with Maxim Integrated* 's MAX31730 Evaluation Board
Figure 7. Setup with the Texas Instruments* 's TMP468 Evaluation Board
- A thermal forcer—or alternatively, you can use a temperature chamber—covered and sealed the FPGA and forced the temperature as per the set temperature point.
- During this test, the FPGA remained in unpowered condition to avoid it from generating heat.
- The soak time for each temperature test point was 30 minutes.
- The settings on the evaluation kits used the default settings from the manufacturers.
- After the setup, steps in Offset Compensation were followed for data collection and analysis.