Summary
It is not recommended to use other adhesives in place of thermal interface material (TIM).
Description
What can I use as an alternative?
Resolution
Thermal interface material (TIM) provides efficient thermal exchange between the processor Integrated Heat Spreader (IHS) and the fan-heatsink.
Proper installation of the TIM is crucial to the success of the processor and fan-heatsink integration process.
Intel does not recommend using other substance as thermal paste for Intel processors as this might cause damage on the processor because its outside Intel recommended configuration.