Intel is the World Leader in Differentiated Packaging Technologies1
Intel Foundry offers a wide range of configurations. Chips can be built using Intel Foundry Advanced System Assembly and Test (Intel Foundry ASAT) or Outsourced Semiconductor Assembly and Test (OSAT). They are then connected by optimized interconnects, that we help drive industry standards for, such as Universal Chiplet Interconnect Express (UCIe).
We help enable you to combine front-end and back-end technologies to create solutions optimized at the system level. In addition, we offer an unmatched scale and depth of assembly and test capabilities via our robust, geo-diverse, and high-volume manufacturing sites.
Flip Chip Ball Grid Array 2D
World leader in complex FCBGA/LGA with single die or Multi-Chip Package (MCP).
Direct supply chain engagement for substrates as well as in-house Research and Development (R&D) to optimize substrate technologies.
One of the largest bases of advanced Thermal Compression Bonding (TCB) tools enabling improved yields and reduced warpage.
Production proven: High volume manufacturing (HVM) since 2016.
Embedded Multi-Die Interconnect Bridge 2.5D
Efficient, cost-effective way to connect multiple complex die.
2.5D packaging for logic-logic and logic-high bandwidth memory (HBM).
Silicon bridge embedded in package substrate for shoreline-to-shoreline connection.
Scalable architecture.
Simplified supply chain and assembly process.
Production proven: In mass production since 2017 with Intel and external silicon.
Foveros (2.5D & 3D)
The industry’s first 3D stacking solution.
Next generation package optimized for cost/performance.
Applicable in client and edge applications.
Ideal for solutions with multiple top die chiplets.
Production proven: In mass production since 2019 with active base die.
Embedded Multi-Die Interconnect Bridge and Foveros Technologies in One Package
Enables flexible heterogeneous systems with a wide variety of dies.
Well-suited to applications where there is a need to combine multiple 3D stacks together in one package.
Intel® Data Center GPU Max Series SoC: using EMIB 3.5D to create Intel’s most complex heterogeneous chip ever mass-produced with more than 100 billion transistors, 47 active tiles, 5 process nodes.
Ecosystem Readiness for EMIB
Key ecosystem partners announce the availability of reference flows for Intel Foundry’s Embedded Multi-Die Interconnect Bridge (EMIB) technology.
Let's Build the Future Together
Intel Foundry Portal
Product and Performance Information
Based on Intel internal analysis (2023).