As one of the largest technological service providers and electronics specialists in Germany, TQ provides customized, innovative solutions for a wide range of industries and sectors – from development, production and other services to product life cycle management. We deliver expertise, experience and far-sighted vision in the areas of E²MS, Embedded, Drives, Robotics, Automation, Medical and Aviation/Avionics. TQ also offers a complete range of in-house products such as embedded modules, carrier boards, gateways, BoxPCs and custom specific HMI systems, as well as drive, robotic and automation solutions. Moreover, we combine these components as an original design manufacturer. On the basis of our service and solution building blocks, we develop and produce customer-specific products for our international customers. And it's all "Made in Germany. "Facts and figures: Headquarter: Seefeld (near Munich), Germany14 locations worldwide (11 in Germany + China, Switzerland and the United States)
Offerings
Offering
The SMARC 2.1 compliant Computer-on-Module TQMxE41S is available with a wide variety of processors in the power range 6 W to 15 W TDP. It combines high CPU and graphics performance (incl. increased AI acceleration) with a variety of high-speed interfaces such as 2x 2.5 Gigabit Ethernet, 4x PCIe, USB 3.2 and SATA in a very compact design. The high system performance is supported by the latest LPDDR5-4800 memory and up to 256 GB Industrial iNAND eMMC. Many other interfaces ensure easy connection of numerous peripheral components. The new generation of CPU microarchitecture and the integrated Intel® UHD Graphics Gen12 with up to 32 execution units, both from the 12th generation Intel® Core™ processor, set new standards in the areas of CPU single-thread/multi-thread performance as well as multimedia and AI with low power dissipation. For the first time in this performance segment, AVX2 / AVX256 and advanced AI instruction sets (VNNI) are also supported, providing fast AI inferencing and media transcoding. Together with the extended security features including TPM 2.0 support, the module is particularly well suited for applications in healthcare, IoT, industry/robotics, retail and video & conferencing.
Offering
The SMARC 2.1 compliant Computer-on-Module TQMxE41S is available with a wide variety of processors in the power range 6 W to 15 W TDP. It combines high CPU and graphics performance (incl. increased AI acceleration) with a variety of high-speed interfaces such as 2x 2.5 Gigabit Ethernet, 4x PCIe, USB 3.2 and SATA in a very compact design. The high system performance is supported by the latest LPDDR5-4800 memory and up to 256 GB Industrial iNAND eMMC. Many other interfaces ensure easy connection of numerous peripheral components. The new generation of CPU microarchitecture and the integrated Intel® UHD Graphics Gen12 with up to 32 execution units, both from the 12th generation Intel® Core™ processor, set new standards in the areas of CPU single-thread/multi-thread performance as well as multimedia and AI. For the first time in this performance segment, AVX256 and advanced AI instruction sets (VNNI) are also supported, providing fast AI inferencing and media transcoding. Together with the extended security features including TPM 2.0 support, the module is particularly well suited for applications in healthcare, IoT, industry/robotics, retail and video & conferencing.
Offering
The SMARC 2.1 ready-to-use embedded module TQMxE40S features latest-generation Intel Atom® x6000E Series and Intel® Pentium® and Celeron® N and J Series processors and enables engineers to easily, quickly and efficiently integrate the latest technology updates and the enormous performance increase in CPU, graphics, memory and interfaces into their applications. With this COM (Computer-on-Module) or SoM (System-on-Module) approach, CPU integration and system design can be optimally parallelized, thereby optimizing effort and time-to-market.Highlights:Dual and quad-core computing power with up to 3 GhzUp to 16 GB LPDDR4/x4 soldered with in-band ECC2x gigabit ethernet2x USB 3.1 (Gen 2) and 4x USB 2.04 PCIe lanes (Gen 3)triple display support with 2x DP++ (4Kp60) and eDP (4K) / LVDS (dual channel)Up to 256 GB eMMC flash, soldered small size (82 mm x 50 mm)extended temperature support from -40°C to +85°C.
Offering
The COM Express Mini (type 10) ready-to-use embedded module TQMxE40M features latest-generation Intel Atom® x6000E Series and Intel® Pentium® and Celeron® N and J Series processors and enables engineers to easily, quickly and efficiently integrate the latest technology updates and the enormous performance increase in CPU, graphics, memory and interfaces into their applications. With this COM (Computer-on-Module) or SoM (System-on-Module) approach, CPU integration and system design can be optimally parallelized, thereby optimizing effort and time-to-market.Highlights:Dual and quad-core computing power with up to 3 GhzUp to 16 GB LPDDR4/x4 soldered with in-band ECC1x Gigabit Ethernet2x USB 3.1 (Gen 2) and 8x USB 2.04 PCIe lanes (Gen 3)Dual display support with DP++ (4Kp60) and eDP (4K) / LVDS (single channel)Up to 256 GB eMMC Flash, soldered, small size (84 mm x 55 mm) and very robust. Extended temperature support from -40°C to +85°C
Offering
Highlights: Supports Intel Atom® x5/x7 E3900 series, Pentium® N4200 and Celeron® N3350 processors, dual / quad core computing power with up to 2.5 GHz4 / 8 GB DDR3L (dual channel, with ECC), soldered. High-speed interconnected with gigabit ethernet, 8x USB (3.0 / 2.0) and 4 PCIe lanes, triple display support with 2x DP/HDMI (up to 4K UHD) and eDP/LVDSUp to 64 GB eMMC flash, soldered for highly rugged designs. Extended temperature support. The TQ module TQMxE39C1 is based on the latest generation of Intel Atom® processors. It achieves a new level of compute performance, security and media processing performance in a very compact form factor to empower real-time computing, industrial automation, digital surveillance, aviation, medical, retail and more. The module corresponds to the international established PICMG standard COM Express® Compact (COM.0 R2.1) with type 6 pinout. With the latest Intel® graphics processor integrated the module delivers 4K high resolution graphics output, immersive 3D processing and also greatly increased video encode and playback performance. Time coordinated computing capabilities enable time synchronized processes within IoT networks and industrial control applications. Onboard eMMC up to 64 GB and the option for LVDS or native eDP enable flexibility and reduce overall BOM cost. Combined with options on request like conformal coating and optimized cooling solutions the TQMxE39C1 fits also perfectly into ruggedized applications.
Offering
Highlights: Supports Intel Atom® x5/x7 E3900 series, Intel® Pentium® N4200 and Intel® Celeron® N3350 processors, dual / quad core computing power with up to 2.5 GHzUp to 8 GB DDR3L (dual channel) with2x SO-DIMM for high flexibility in system configuration, high-speed interconnected with gigabit ethernet, 8x USB (3.0 / 2.0) and 4 PCIe lanes, triple display support with 2x DP/HDMI (up to 4K UHD) and eDP/LVDSUp to 64 GB eMMC flash, soldered, extended temperature support the TQ module TQMxE39C2 is based on the latest generation of Intel Atom®, Intel® Pentium® and Celeron® processors. It achieves a new level of compute performance, security and media processing performance in a very compact form factor to empower real-time computing, industrial automation, digital surveillance, aviation, medical, retail and more. The module corresponds to the international established PICMG standard COM Express® Compact (COM.0 R2.1) with type 6 pinout. With the latest Intel® graphics processor integrated, the module delivers 4K high resolution graphics output, immersive 3D processing and also greatly increased video encode and playback performance. Equipped with 2 SO-DIMM sockets the user is very flexible in system configuration.
Offering
The TQ module TQMxE39M is based on the latest generation of Intel Atom®, Pentium® and Celeron® processors. It achieves a new level of compute performance, security and media processing performance in a very compact form factor to empower real-time computing, industrial automation, digital surveillance, aviation, medical, retail and more. The module corresponds to the international established PICMG® standard COM Express® Mini (COM.0 R2.1) with type 10 pinout. 8 USB ports – including 2x USB 3.0 – and up to 4 PCIe lanes natively supported by the processor enable high bandwidth communication with peripherals and additional interfaces on the carrier board. With the latest Intel® graphics processor integrated the module delivers 4K high resolution graphics output, immersive 3D processing and also greatly increased video encode and playback performance. Time coordinated computing capabilities enable time synchronized processes within IoT networks and industrial control applications. Onboard eMMC up to 64 GB and the option for LVDS or native eDP enable flexibility and reduce overall BOM cost. The integrated TQMx86 board controller enables high flexibility through “flexiCFG” and supports thermal management, watchdog and “Green ECO-Off” with a minimum of standby power. Combined with options like conformal coting and optimized cooling solutions the TQMxE39M fits also perfectly into ruggedized applications. Highlights: Supports Intel Atom®x5/x7 E3900 series, Pentium® N4200 and Celeron® N3350 processors, dual / quad core computing power with up to 2.5 GHz4 / 8 GB DDR3L (dual channel, non-ECC), soldered high speed interconnections with gigabit ethernet, 8x USB (3.0 / 2.0) and up to 4 PCIe lanes, dual display support with DP/HDMI (up to 4K UHD) and eDP/LVDSUp to 64 GB eMMC flash, soldered extended temperature support.
Offering
The COM Express Basic Module TQMx110EB features 11th generation Intel® Core™ Processors (formerly code-named Tiger Lake-H) and is a perfect starting point to realize individual industrial solutions in an easy, quick and cost efficient way.Supported CPUs: Intel Core i7-11800H and Intel® Core™ i5-11400H
Offering
The COM Express Basic Module TQMx110EB (Industrial) features the embedded version of 11th generation Intel® Core™ Processors (H-series) for industrial use conditions and long lifetime support. A perfect match for individual, high demanding industrial solutions, also with extended temperature support.
Offering
The COM Express Compact (type 6) ready-to-use embedded module TQMxE40C2 features latest-geneartion Intel Atom® x6000E Series and Intel® Pentium® and Celeron® N and J Series processors and enables engineers to easily, quickly and efficiently integrate the latest technology updates and the enormous performance increase in CPU, graphics, memory and interfaces into their applications. With this COM (Computer-on-Module) or SoM (System-on-Module) approach, CPU integration and system design can be optimally parallelized, thereby optimizing effort and time-to-market.Highlights:Dual and Quad-Core computing power with up to 3 GhzUp to 16 GB LPDDR4/x4 soldered with in-band ECC1x Gigabit Ethernet2x USB 3.1 (Gen 2) and 8x USB 2.0, 8 PCIe lanes (Gen 3)Dual display support with DP++ (4Kp60) and eDP (4K) / LVDS (single channel)Up to 256 GB eMMC Flash, solderedComapct size (95 mm x 95 mm) and very robustExtended temperature support from -40°C to +85°C
Offering
The COM Express Compact (type 6) ready-to-use embedded module TQMxE40C1 features latest-geneartion Intel Atom® x6000E Series and Intel® Pentium® and Celeron® N and J Series processors and enables engineers to easily, quickly and efficiently integrate the latest technology updates and the enormous performance increase in CPU, graphics, memory and interfaces into their applications. With this COM (Computer-on-Module) or SoM (System-on-Module) approach, CPU integration and system design can be optimally parallelized, thereby optimizing effort and time-to-market.Highlights:Dual and Quad-Core computing power with up to 3 GhzUp to 16 GB LPDDR4/x4 soldered with in-band ECC1x Gigabit Ethernet2x USB 3.1 (Gen 2) and 8x USB 2.0, 8 PCIe lanes (Gen 3)Dual display support with DP++ (4Kp60) and eDP (4K) / LVDS (single channel)Up to 256 GB eMMC Flash, solderedComapct size (95 mm x 95 mm) and very robustExtended temperature support from -40°C to +85°C
Offering
The COM Express Basic module TQMx60EB is designed for high end computing and graphics capabilities.With Dual-Channel DDR4-2133 support, high bandwidth PCIe, 4x SATA (6 Gb/s) and 4x USB 3.0 the TQMx60EB guarantees best in class system performance. The module can be equipped with 6th Generation Intel® Core™ i7/i5/i3 and Intel® Xeon® E3-15xx v5 processors. The integrated Intel® GT1/GT2/GT4e graphics controller supports up to three independent display outputs with up to 4K resolution @ 60 Hz and excellent 3D / rendering performance. Latest power and performance optimizing functions like Intel® Turbo Boost Technology 2.0 and Enhanced Intel® SpeedStep Technology enable perfect user experience with moderate power consumption.This high end COM Express® Basic Type 6 module is best suited for high demand medical, gaming and industrial applications.Key functionalities:High end performance up to Quad-Core 3.7 GHz / 8 MB cacheImpressive graphics performance (Intel® Iris™ Pro)Best in class power optimizationUp to 32 GB Dual-Channel DDR4 (2 SO-DIMMs), ECCHigh bandwidth with up to 24 PCIe Gen. 3 lanes (incl. PCIe x16 PEG port)TQMx86 board controller with flexible customization options (flexiCFG)Mobile Intel® 100 series chipset (CM236)TPM 1.2 / 2.0“Green ECO-Off” (minimum of standby power)Watchdog und thermal managementHighest reliability, 24/7 certifiedQuality Made-in-Germany