High Bandwidth Memory (HBM2E) Interface Agilex™ 7 M-Series FPGA IP User Guide

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ID 773264
Date 11/04/2024
Public
Document Table of Contents
Document Table of Contents x
1. About the High Bandwidth Memory (HBM2E) Interface Agilex™ 7 FPGA IP User Guide 2. Introduction to High Bandwidth Memory 3. Agilex™ 7 M-Series HBM2E Architecture 4. Creating and Parameterizing the High Bandwidth Memory (HBM2E) Interface FPGA IP 5. High Bandwidth Memory (HBM2E) Interface FPGA IP Interface 6. High Bandwidth Memory (HBM2E) Interface FPGA IP Performance 7. Debugging the High Bandwidth Memory (HBM2E) Interface FPGA IP 8. Document Revision History for High Bandwidth Memory (HBM2E) Interface FPGA IP User Guide A. High Bandwidth Memory (HBM2E) Interface FPGA IP Quartus® Prime Software Flow
1. About the High Bandwidth Memory (HBM2E) Interface Agilex™ 7 FPGA IP User Guide x
1.1. Release Information
2. Introduction to High Bandwidth Memory x
2.1. HBM2E in Agilex™ 7 M-Series Devices 2.2. HBM2E DRAM Structure 2.3. Agilex™ 7 HBM2E Features 2.4. Agilex™ 7 M-Series HBM2E Controller Features 2.5. Agilex™ 7 M-Series FPGA HBM2E IP Device Family Support
3. Agilex™ 7 M-Series HBM2E Architecture x
3.1. Agilex™ 7 M-Series HBM2E Introduction 3.2. Agilex™ 7 M-Series Hard Memory NoC Subsystem 3.3. Address Mapping of the HBM2E Targets 3.4. Agilex™ 7 M-Series UIB Architecture 3.5. Agilex™ 7 M-Series HBM2E Controller Architecture
3.5. Agilex™ 7 M-Series HBM2E Controller Architecture x
3.5.1. Agilex™ 7 M-Series HBM2E Controller Details
4. Creating and Parameterizing the High Bandwidth Memory (HBM2E) Interface FPGA IP x
4.1. Creating an Quartus® Prime Pro Edition Project for High Bandwidth Memory (HBM2E) Interface FPGA IP 4.2. Parameterizing the High Bandwidth Memory (HBM2E) Interface FPGA IP
4.2. Parameterizing the High Bandwidth Memory (HBM2E) Interface FPGA IP x
4.2.1. General Parameters for High Bandwidth Memory (HBM2E) Interface FPGA IP 4.2.2. Example Design Parameters for High Bandwidth Memory (HBM2E) Interface FPGA IP 4.2.3. Modifying Your Pin Assignments to Choose the Physical Location of the HBM2E Device
5. High Bandwidth Memory (HBM2E) Interface FPGA IP Interface x
5.1. High Bandwidth Memory (HBM2E) Interface FPGA IP High Level Block Diagram 5.2. High Bandwidth Memory (HBM2E) Interface FPGA IP Controller Interface Signals 5.3. User AXI Interface Timing 5.4. Platform Designer-Only Interface 5.5. User Accesses to the HBM2E Controller
5.2. High Bandwidth Memory (HBM2E) Interface FPGA IP Controller Interface Signals x
5.2.1. Reset, Clock, and Calibration Status Signals 5.2.2. Requirement and Timing of the hbm_reset_n Signal 5.2.3. 'Do not connect' Signals 5.2.4. Asynchronous HBM2E Controller Signals 5.2.5. AXI4 Interface Signals 5.2.6. AXI4-Lite Interface
5.3. User AXI Interface Timing x
5.3.1. AXI Write Transaction 5.3.2. AXI Read Transaction
5.5. User Accesses to the HBM2E Controller x
5.5.1. Initialization Control Register and Initialization Status Register 5.5.2. Thermal Status Register 5.5.3. ECC Error Counters Register 5.5.4. Error Login Registers 5.5.5. Error Injection Registers
6. High Bandwidth Memory (HBM2E) Interface FPGA IP Performance x
6.1. High Bandwidth Memory (HBM2E) Interface FPGA IP Controller Performance 6.2. High Bandwidth Memory (HBM2E) Interface FPGA IP System Performance
6.1. High Bandwidth Memory (HBM2E) Interface FPGA IP Controller Performance x
6.1.1. High Bandwidth Memory (HBM2E) DRAM Bandwidth 6.1.2. High Bandwidth Memory (HBM2E) Interface FPGA IP Efficiency 6.1.3. High Bandwidth Memory (HBM2E) Interface FPGA IP Latency 6.1.4. High Bandwidth Memory (HBM2E) Interface FPGA IP Timing
7. Debugging the High Bandwidth Memory (HBM2E) Interface FPGA IP x
7.1. Debugging Guidelines for High Bandwidth Memory (HBM2E) Interface FPGA IP
A. High Bandwidth Memory (HBM2E) Interface FPGA IP Quartus® Prime Software Flow x
A.1. Initiators Placement Recommendations A.2. Simulating HBM2E User Designs
1. About the High Bandwidth Memory (HBM2E) Interface Agilex™ 7 FPGA IP User Guide
2. Introduction to High Bandwidth Memory
3. Agilex™ 7 M-Series HBM2E Architecture
4. Creating and Parameterizing the High Bandwidth Memory (HBM2E) Interface FPGA IP
5. High Bandwidth Memory (HBM2E) Interface FPGA IP Interface
6. High Bandwidth Memory (HBM2E) Interface FPGA IP Performance
7. Debugging the High Bandwidth Memory (HBM2E) Interface FPGA IP
8. Document Revision History for High Bandwidth Memory (HBM2E) Interface FPGA IP User Guide
A. High Bandwidth Memory (HBM2E) Interface FPGA IP Quartus® Prime Software Flow

2.3. Agilex™ 7 HBM2E Features

Agilex™ 7 M-Series FPGAs offer the following HBM2E features.
  • Supports two configurations: 4H/8GB and 8H/16GB.
  • Transfer rate up to 3.2 GT/s for the fastest device speed grade.
  • 2GB capacity per DRAM die.
  • Supports one to eight HBM2E channels per HBM2E interface in the Pseudo Channel mode.
  • Only supports pseudo-channel mode of the HBM2E specifications.
  • Each HBM2E channel supports a 128-bit DDR data bus, with optional ECC support.
  • Pseudo Channel mode divides each channel into two individual 64-bit I/O pseudo-channels. The two pseudo-channels operate semi-independently; they share the channel’s row and column command bus as well as CK and CKE inputs, but they decode and execute commands individually. Address BA4 directs commands to either pseudo-channel 0 (BA4 = 0) or pseudo-channel 1 (BA4 = 1), offering unique address space to each pseudo-channel. Pseudo Channel mode requires that the burst length for DRAM transactions is set to 4.
  • Data referenced to strobes RDQS_t / RDQS_c and WDQS_t / WDQS_c, one strobe pair per 32 DQs.
  • Differential clock inputs (CK_t / CK_c). Unterminated data/address/cmd/clk interfaces.
  • DDR commands entered on each positive CK_t and CK_c edge. Row Activate commands require two memory cycles; all other commands are single-cycle commands.
  • Supports command, write data and read data parity.
  • Support for bank grouping.
  • Support for data bus inversion.
  • 64-bit data per pseudo-channel. Eight additional data bits are available per pseudo-channel; you can use these data bits for any of the following:
    • ECC. The ECC scheme implemented is single-bit error correction with double-bit error detection (SECDEC). This includes 8 bits of ECC code (also known as syndrome).
    • Data mask (DM). The data mask for masking write data per byte.
    • User-defined data
    • Can be left unused.
  • I/O voltage of 1.2V and DRAM core voltage of 1.2V.
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