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1. Intel® Stratix® 10 High-Speed LVDS I/O Overview
2. Intel® Stratix® 10 High-Speed LVDS I/O Architecture and Features
3. Stratix 10 High-Speed LVDS I/O Design Considerations
4. Intel® Stratix® 10 High-Speed LVDS I/O Implementation Guides
5. LVDS SERDES Intel® FPGA IP References
6. Intel® Stratix® 10 High-Speed LVDS I/O User Guide Archives
7. Document Revision History for the Intel® Stratix® 10 High-Speed LVDS I/O User Guide
3.1. PLLs and Clocking for Intel® Stratix® 10 Devices
3.2. Source-Synchronous Timing Budget
3.3. Guideline: LVDS SERDES IP Core Instantiation
3.4. Guideline: LVDS SERDES Pin Pairs for Soft-CDR Mode
3.5. Guideline: LVDS Transmitters and Receivers in the Same I/O Bank
3.6. Guideline: LVDS SERDES Limitation for Intel® Stratix® 10 GX 400, SX 400, and TX 400
3.1.1. Clocking Differential Transmitters
3.1.2. Clocking Differential Receivers
3.1.3. Guideline: LVDS Reference Clock Source
3.1.4. Guideline: Use PLLs in Integer PLL Mode for LVDS
3.1.5. Guideline: Use High-Speed Clock from PLL to Clock LVDS SERDES Only
3.1.6. Guideline: Pin Placement for Differential Channels
3.1.7. LVDS Interface with External PLL Mode
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1.3. Intel® Stratix® 10 GPIO Banks, SERDES, and DPA Locations
The I/O banks are located in I/O columns. Each I/O bank contains its own PLL, dynamic phase alignment (DPA), and SERDES circuitries.
Figure 1. I/O Bank Structure with I/O PLL, DPA, and SERDESThis figure shows an example of I/O banks in one Intel® Stratix® 10 device. The I/O banks availability and locations vary among Intel® Stratix® 10 devices.