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1. Agilex™ 7 F-Series and I-Series General-Purpose I/O Overview
2. Agilex™ 7 F-Series and I-Series GPIO Banks
3. Agilex™ 7 F-Series and I-Series HPS I/O Banks
4. Agilex™ 7 F-Series and I-Series SDM I/O Banks
5. Agilex™ 7 F-Series and I-Series I/O Troubleshooting Guidelines
6. Agilex™ 7 F-Series and I-Series General-Purpose I/O IPs
7. Programmable I/O Features Description
8. Documentation Related to the Agilex™ 7 General-Purpose I/O User Guide: F-Series and I-Series
9. Agilex™ 7 General-Purpose I/O User Guide: F-Series and I-Series User Guide Archives
10. Document Revision History for the Agilex™ 7 General-Purpose I/O User Guide: F-Series and I-Series
2.5.1. VREF Sources and VREF Pins
2.5.2. I/O Standards Implementation Based on VCCIO_PIO Voltages
2.5.3. OCT Calibration Block Requirement
2.5.4. I/O Pins Placement Requirements
2.5.5. I/O Standard Selection and I/O Bank Supply Compatibility Check
2.5.6. Simultaneous Switching Noise
2.5.7. Special Pins Requirement
2.5.8. External Memory Interface Pin Placement Requirements
2.5.9. HPS Shared I/O Requirements
2.5.10. Clocking Requirements
2.5.11. SDM Shared I/O Requirements
2.5.12. Unused Pins
2.5.13. Voltage Setting for Unused GPIO Banks
2.5.14. GPIO Pins During Power Sequencing
2.5.15. Drive Strength Requirement for GPIO Input Pins
2.5.16. Maximum DC Current Restrictions
2.5.17. 1.2 V I/O Interface Voltage Level Compatibility
2.5.18. GPIO Pins for the Avalon® Streaming Interface Configuration Scheme
2.5.19. Maximum True Differential Signaling Receiver Pairs Per I/O Lane
6.1.1. Release Information for GPIO Intel® FPGA IP
6.1.2. Generating the GPIO Intel® FPGA IP
6.1.3. GPIO Intel® FPGA IP Parameter Settings
6.1.4. GPIO Intel® FPGA IP Interface Signals
6.1.5. GPIO Intel® FPGA IP Architecture
6.1.6. Verifying Resource Utilization and Design Performance
6.1.7. GPIO Intel® FPGA IP Timing
6.1.8. GPIO Intel® FPGA IP Design Examples
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2.4. GPIO Termination
F-Series and I-Series devices support on-chip termination for single-ended and true differential I/O standards. The OCT maintains signal quality, saves board space, and reduces external component costs. You can also use external termination for the true differential signaling I/Os.